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    THIN-FILM FORMING RAW MATERIAL USED IN ATOMIC LAYER DEPOSITION METHOD AND METHOD OF PRODUCING THIN-FILM
    1.
    发明申请
    THIN-FILM FORMING RAW MATERIAL USED IN ATOMIC LAYER DEPOSITION METHOD AND METHOD OF PRODUCING THIN-FILM 有权

    公开(公告)号：US20250109296A1

    公开(公告)日：2025-04-03

    申请号：US18978671

    申请日：2024-12-12

    Applicant: ADEKA CORPORATION

    Inventor： Keisuke TAKEDA ,  Masaki ENZU

    IPC: C09D1/00 ,  C07F5/00 ,  C23C16/40 ,  C23C16/455

    Abstract: Provided is a thin-film forming raw material, which is used in an atomic layer deposition method, including a compound represented by the following formula (1): where R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, L represents a group represented by the following formula (L-1) or (L-2), and M represents an indium atom or a gallium atom; where R11 and R12 each independently represent a hydrogen atom, a fluorine atom, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms, and * represents a bonding position with M in the formula (1); where R21 to R23 each independently represent a hydrogen atom, a fluorine atom, or an alkyl group having 1 to 5 carbon atoms, and * represents a bonding position with M in the formula (1), provided that R21 and R22 represent different groups.

    COPPER COMPOUND, STARTING MATERIAL FOR FORMING THIN FILM, AND METHOD FOR MANUFACTURING THIN FILM
    6.
    发明申请
    COPPER COMPOUND, STARTING MATERIAL FOR FORMING THIN FILM, AND METHOD FOR MANUFACTURING THIN FILM 有权
    铜复合材料，用于形成薄膜的起始材料以及制造薄膜的方法

    公开(公告)号：US20170044188A1

    公开(公告)日：2017-02-16

    申请号：US15306812

    申请日：2015-04-08

    Applicant: ADEKA CORPORATION

    Inventor： Tomoharu YOSHINO ,  Masaki ENZU ,  Atsushi SAKURAI ,  Akihiro NISHIDA ,  Makoto OKABE

    IPC: C07F1/08 ,  C23C16/455 ,  C23C16/06 ,  C09D5/24 ,  C09D1/00

    CPC classification number: C07F1/08 ,  C07C215/08 ,  C09D1/00 ,  C09D5/24 ,  C23C16/06 ,  C23C16/18 ,  C23C16/45525 ,  C23C16/45542 ,  C23C16/45553 ,  H01L21/28 ,  H01L21/285

    Abstract: This invention provides a copper compound represented by General Formula (I) below. In General Formula (I), R1 to R3 independently represent a linear or branched alkyl group with a carbon number of 1 to 5; provided that R1 and R2 are a methyl group, R3 represents a linear or branched alkyl group with a carbon number of 2 to 5; and provided that R1 is a methyl group and R2 is an ethyl group, R3 represents a methyl group or a linear or branched alkyl group with a carbon number of 3 to 5. A starting material for forming a thin film of the present invention includes the copper compound represented by General Formula (I). The present invention can provide a copper compound which has a low melting point, can be conveyed in a liquid state, has a high vapor pressure, and is easily vaporizable, and also a starting material for forming a thin film which uses such a copper compound.

    Abstract translation: 该铜化合物由通式（I）表示。 在通式（I）中，R 1 -R 3各自独立地表示具有1-5个碳原子的直链或支链烷基，条件是在R 1和R 2为甲基的情况下，R 3表示直链或支链烷基， 2-5个碳原子，在R1为甲基，R2为乙基的情况下，R3表示甲基或碳原子数为3〜5的直链或支链烷基。 根据本发明的用于形成薄膜的起始材料包含由通式（I）表示的铜化合物。 本发明能够提供一种铜化合物，其具有低熔点并且可以以液态运输，并且具有高蒸气压并易于蒸发; 以及使用该铜化合物的用于形成薄膜的原料。

    REACTIVE MATERIAL AND METHOD OF PRODUCING THIN-FILM
    8.
    发明公开
    REACTIVE MATERIAL AND METHOD OF PRODUCING THIN-FILM 审中-公开

    公开(公告)号：US20240360558A1

    公开(公告)日：2024-10-31

    申请号：US18292077

    申请日：2022-07-19

    Applicant: ADEKA CORPORATION

    Inventor： Masaki ENZU

    IPC: C23C16/455 ,  C23C16/02 ,  C23C16/18 ,  C23C16/44

    CPC classification number: C23C16/45553 ,  C23C16/0272 ,  C23C16/18 ,  C23C16/4408

    Abstract: Provided is a reactive material, including a compound represented by the following general formula (1) or (2).




    In the formula (1), R1, R2, R3, and R4 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 4 carbon atoms, or an electron-withdrawing group, provided that at least one of R1, R2, R3, or R4 represents the electron-withdrawing group.




    In the formula (2), R5 and R6 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 4 carbon atoms, or an electron-withdrawing group, provided that at least one of R5 or R6 represents the electron-withdrawing group.

    ZINC COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, AND METHOD OF PRODUCING THIN-FILM
    9.
    发明公开
    ZINC COMPOUND, THIN-FILM FORMING RAW MATERIAL, THIN-FILM, AND METHOD OF PRODUCING THIN-FILM 审中-公开

    公开(公告)号：US20230142848A1

    公开(公告)日：2023-05-11

    申请号：US17915300

    申请日：2021-03-18

    Applicant: ADEKA CORPORATION

    Inventor： Ryota FUKUSHIMA ,  Keisuke TAKEDA ,  Masaki ENZU

    IPC: C07F3/06 ,  C23C16/40 ,  C23C16/455

    CPC classification number: C07F3/06 ,  C23C16/407 ,  C23C16/45553

    Abstract: Provided is a zinc compound represented by the following general formula (1) or (2):




    in the formula (1), R1 represents an unsubstituted alkyl group having 1 to 5 carbon atoms, etc., R2 and R5 each independently represent a hydrogen atom, a fluorine atom, an unsubstituted alkyl group having 1 to 5 carbon atoms, etc., and R3 and R4 each independently represent a hydrogen atom, a fluorine atom, an unsubstituted alkyl group having 1 to 5 carbon atoms, etc.;




    in the formula (2), R10, R11, R14, and R15 each independently represent a hydrogen atom, a fluorine atom, an unsubstituted alkyl group having 1 to 5 carbon atoms, etc., and R9, R12, R13, and R16 each independently represent a hydrogen atom, a fluorine atom, an unsubstituted alkyl group having 1 to 5 carbon atoms, etc.

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