Abstract:
An integrated circuit including an array of flash EEPROM memory cells wherein overerase correction is provided after application of each erase pulse.
Abstract:
Flash memory array systems (340, 450, 500, 1200) and methods (1300) are disclosed for producing a regulated boosted word line voltage (348, 452, 532, 1235) for read operations. The system comprises a multi-stage voltage boost circuit (347, 500) operable to receive a supply voltage (343) and one or more output signals (345, 346, 525, 526) from a supply voltage detection circuit (342) to generate the boosted word line voltage (348, 532) having a value greater than the supply voltage (540). The voltage boost circuit comprises a precharge circuit (522) and a plurality of boost cells (540) connected to a common node (532) of the boosted word line, and a timing control circuit (510). The stages (1210, 1220, 1230) of the plurality of boost cells are coupled in series for charge sharing between the stages, and couple a predetermined number of boost cells to the boosted word line common node (532) to provide an intermediate voltage to the boosted word line during the pre-boost timing (747), thereby anticipating a final boosted word line voltage (770, 770a, 770b) provided during the boost timing (745). The voltage boost circuit is operable to receive the one or more output signals from the supply voltage detection circuit and alter a boost gain of the multi-stage voltage boost circuit based on the one or more output signals, thereby causing the boosted word line voltage to be substantially independent of the supply voltage value.
Abstract:
A selection circuit for sensing current in a target cell (305) during a memory read operation is disclosed. According to one embodiment, the selection circuit comprises a sensing circuit selector (364) connected to a sensing circuit (360) and a ground selector (362) connected to ground (365). The ground selector (362) connects a first bit line (316) of the target cell to ground, and the sensing circuit selector (364) connects a second bit line (321) of the target cell (305) to the sensing circuit (360). The sensing circuit selector (364) also connects a third bit line (341) of a first neighboring cell (355) to the sensing circuit (360). The first neighboring cell (355) shares the second bit line (321) with the target cell (305).
Abstract:
A burst read mode operation is provided that boosts the voltage of a word line (12) while the bit lines of the row are selected for reading. When the column group address bits (35) read the last column group of cells in the row, a pulse signal (96) is generated which temporarily reduces the boosted voltage to allow the X-decoder (14) to select the next work line. An alternative delay element (100) is also provided which generates an ATD pulse (64) with a longer duration when the column group address bits (35) are at the end of a row and a shorter duration pulse at other times.
Abstract:
A memory circuit arrangement for sensing current in a target cell (305) during a read operation is disclosed. According to one exemplary embodiment, the memory circuit arrangement comprises the target cell (305) and a first neighboring cell (355) adjacent to the target cell (305). The first target cell (305) has a first bit line (316) connected to ground (365); the target cell (305) also has a second bit line (321) connected to a sensing circuit (360). The first neighboring cell (355) shares the second bit line (321) with the target cell (305); the first neighboring cell (355) also has a third bit line (341) connected to the sensing circuit (360) during the read operation. The memory circuit arrangement results in increased error margins in a fast and accurate manner during the read operation of the target cell (305).
Abstract:
A cascode amplifier circuit (205), which generates a fast, stable and accurate bit line voltage (230), is disclosed. According to one exemplary embodiment, the cascode amplifier circuit (205) comprises a transistor (210) having a source connected to a bit line voltage (230) and a drain connected to an output voltage (225). The cascode amplifier circuit (205) also comprises a differential circuit (212) having an inverting input (215) connected to the bit line voltage (230), a non-inverting input connected to a reference voltage (202), and an output (280) connected to a gate of the first transistor (210). The operation of the transistor (210) and the differential circuit (212) generate a fast, stable the accurate bit line voltage (230).
Abstract:
A technique is provided for reducing column leakage in a flash EEPROM device (10) during an erase verification process, thereby preventing false verifies. The technique has application in NOR arrays or other types of arrays in which a number of cells (100) are connected in parallel. The technique operates by reducing the leakage of the unselected cells in parallel to the selected cell being verified, thereby preventing false verifies. The technique can also be used in conjunction with other techniques for reducing column leakage, such as soft programming, automatic programming disturb erase (APDE), or various other V th compacting schemes.
Abstract:
An integrated circuit including an array of flash EEPROM memory cells wherein overerase correction is provided after application of each erase pulse.
Abstract:
A flash memory having redundancy content addressable memory (CAM) circuitry (106) is described. The flash memory is capable of substituting a second memory cell for an inoperative memory cell. The flash memory includes a primary array (118, 120, 122, 124, 134, 136, 138, 140) of memory cells, a redundant array (126, 128, 130, 132, 142, 144, 146, 148) of memory cells, and the redundancy CAM circuitry (106). The redundancy CAM circuitry (106) includes a plurality of dual-ported CAM stages (200). Each CAM stage (200) includes a CAM cell (202), a write data bus (204) coupled to the CAM cell (202), and a read data bus (206) coupled to the CAM cell (202). The CAM cell (202) stores information regarding a location of an inoperative memory cell in the primary array (118, 120, 122, 124, 134, 138, 140). The inoperative memory cell requires a substitution with a second memory cell in the redundant array (126, 128, 130, 132, 142, 144, 146, 148). The write data bus (204) produces the information from the CAM cell (202) responsively to a write select signal (WSELm). The write select signal (WSELm) is indicative of a write operation to be performed at memory cell locations in the primary array (18, 120, 122, 124, 134, 136, 138, 140). The read data bus (206) produces the information from the CAM cell (202) responsively to a read select signal (RSELm). The read select signal (RSELm) is indicative of a read operation to be performed at memory cell locations in the primary array (118, 120, 122, 124, 134, 136, 138, 140).
Abstract:
A burst mode architecture to provide burst mode access to a plurality of data words in a flash memory is described. The burst mode architecture includes a first circuit (216, 220), a control circuit (210) coupled to the first circuit (216, 220), and a data buffer (236, 238) selectively coupled to the first circuit (216, 220) by the control circuit (210). The first circuit (216, 220) accesses a plurality of data words, beginning with an initial access of a first data word and a second data word. The control circuit (210) generates a timing signal having pulses and a second signal. The second signal is generated upon completion of the initial access of the first data word and the second data word. The first circuit (216, 220) follows the initial access with subsequent accesses of the plurality of data words responsively to the second signal and the timing signal. The data buffer has an output and procedures the first data word at the output and successively produces, with each successive pulse of the timing signal following an initial period of time, the second data word, and subsequent data words at the output. The subsequent data words correspond to the subsequent accesses of the plurality of data words.