Abstract:
The invention relates to an electrostatic holder comprising: a body, and a clamping element attached to the body, said clamping element comprising an electrode for applying an attractive force between the clamping element and a first to be clamped object, wherein an outer edge of the body is configured to provide a gap between the outer edge of the body and the first to be clamped object, which gap is configured for outputting a fluid for reducing dust particles reaching the first to be clamped object or a second to be clamped object on an opposite side of the holder.
Abstract:
A substrate table (WT) configured to support a substrate (W) for exposure in an immersion lithographic apparatus, the substrate table comprising: a support body (30) having a support surface (31) configured to support the substrate; and a cover ring (130) fixed relative to the support body and configured to surround, in plan view, the substrate supported on the support surface, wherein the cover ring has an upper surface (60); wherein at least a portion (61) of the upper surface is configured so as to alter the stability of a meniscus (17) of immersion liquid when moving along the upper surface towards the substrate.
Abstract:
A lithographic apparatus has a compartment which accommodates a movable object. Movements of the movable object cause acoustic disturbances in the compartment. An acoustic damper is arranged to damp the acoustic disturbances in the compartment and comprises a chamber (100) in communication with the compartment and a perforated plate (101), having a plurality of through-holes (102), between the chamber and the compartment.
Abstract:
The invention provides a temperature conditioning system using conditioning liquid to condition a temperature of an object, comprising a conditioning conduit, a return conduit, a supply chamber, and a discharge chamber wherein the temperature conditioning system is arranged to provide a static pressure difference between the supply chamber outlet and the discharge chamber inlet to create a flow through the conditioning conduit. A lithography apparatus and a method of temperature conditioning an object is also described.
Abstract:
A device comprising a compartment, said compartment comprising a wafer stage configured to hold a semiconductor wafer on a clamp, wherein the wafer stage is configured to follow a route within the compartment in operational use, the device comprising: a first component having a first surface facing a first portion of the route; a second component having a second surface facing a second portion of the route; a thermal control system operative to maintain a first temperature of the first surface and a second temperature of the second surface at a common set-point magnitude.
Abstract:
A method of performing a lithographic exposure of a substrate, the substrate being held on a substrate table, the substrate table comprising a cooling system operative to cool the substrate table, the method comprising performing an alignment measurement of the substrate, applying heat to the substrate table to reduce cooling of the substrate table provided by the cooling system, the heat being applied between a time at which the alignment measurement is performed and a time at which the lithographic exposure is performed and performing the lithographic exposure of the substrate.
Abstract:
The present invention provides a method of processing a substrate comprising: providing a substrate with a layer of photosensitive material on a surface of the substrate; and removing photosensitive material from around an outer edge of the layer of photosensitive material, and controlling the removing so as to generate an edge, having a radial width, around the layer of photosensitive material remaining on the surface of the substrate, wherein the photosensitive material varies in thickness forming a thickness profile across the radial width and the removing is controlled so as to generate variation in the thickness profile along the length of the edge, and/or wherein the removing is controlled so as to generate a rough edge around the layer of photosensitive material remaining on the surface of the substrate.
Abstract:
Disclosed herein is a passive flow induced vibration (FIV) reduction system for use in a temperature conditioning system that controls the temperature of at least one component within a lithographic apparatus. This FIV reduction system comprises: a conduit that provides a flow path for a liquid through the system; a liquid filled cavity in fluid connection with the conduit, wherein the fluid connection is provided via one or more openings in the wall of the conduit; a membrane configured such that it separates the liquid in the liquid filled cavity from a gas at a substantially ambient pressure and the membrane is configured such that the compliance of the membrane reduces at least the low frequency FIVs in the liquid flowing through the conduit; and an end-stop located on the gas side of the membrane, wherein the end-stop is configured to limit the extent of deflection of the membrane.
Abstract:
A radiation source (SO) comprising: • a fuel supply device (3) configured to supply fuel; • an excitation device (1) configured to excite the fuel into a plasma (7); • a collector (5) configured to collect radiation emitted by the plasma and to direct the radiation to a beam exit; • a debris mitigation system (20) configured to collect debris generated by the plasma, the debris mitigation system having a component (3, 9B, 21, 22, 23, 24, 27, 28, 29) having a conduit (301) passing therethrough; and • a temperature control system (300) configured to selectively increase or decrease the temperature of the component by selectively heating or cooling a thermal transfer fluid circulating through the conduit.
Abstract:
A measurement system to determine a deformation of an object having a front surface and a back surface and being provided with a pattern is described, the measurement system comprising: ∙ a processor and ∙ an interferometer system comprising a light source and a detector system; the light source being configured to emit, to each of a plurality of locations on the object, measurement beams in order to generate, at each of the respective plurality of locations, reflected measurement beams off the front and back surfaces of the object respectively; the detector system being configured to receive the respective reflected measurement beams and output signals representative of the received reflected measurement beams to the processor; the processor being configured to: ∙ receive the signals; ∙ determine, based on the signals as received, a characteristic of the object; and ∙ determine a deformation of the pattern based on the characteristic.