Abstract:
PROBLEM TO BE SOLVED: To provide a load lock with temperature regulation, a lithography system equipped with a load lock, and a method for producing a substrate using the load lock. SOLUTION: An object, e.g. a substrate W, is transferred into/from a lithography system. Load lock outer walls 38 and 40 define at least a part of the load lock volume for containing support units 33 and 141 which support the object W when it is in the load lock. Furthermore, the load lock has a structure for temperature regulation to control the temperature of the object at least before it is transferred from the load lock toward the lithography system. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a load lock with temperature regulation, a lithography system equipped with a load lock, and a method for producing a substrate using the load lock. SOLUTION: An object, e.g. a substrate W, is transferred into/from a lithography system. Load lock outer walls 38 and 40 define at least a part of the load lock volume for containing support units 33 and 141 which support the object W when it is in the load lock. Furthermore, the load lock has a structure for temperature regulation to control the temperature of the object at least before it is transferred from the load lock toward the lithography system. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To prevent a substrate from fouling by suppressing entry of unnecessary particles or molecules at the time of opening and closing a door in a substrate loading device (LL) of an exposure system in which the pressure is lower than an atmospheric pressure. SOLUTION: The loading device (LL) forms a space, or a chamber, and comprises a first door (11) that faces a lithographic pattern forming chamber (PC), a second door (12) that faces a second environment, and a gas entrance (13). The gas entrance (13) is connected to a gas supply (17) so as to provide a gas at least for a portion of a period during which an object moves. This gas is a gas which basically does not include at least one of particles, oxygen, a hydrocarbon and H 2 O. Supplying a gas that does not foul a substrate allows the pressure in the loading device to be higher than an atmospheric pressure, thereby suppressing the entry of unnecessary particles or molecules at the time opening and closing the door between different atmospheres and thus preventing the substrate from fouling. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To increase the throughput of a lithography projection assembly. SOLUTION: The lithography projection assembly comprises at least one load-lock for transferring an article, especially a substrate, between a first environment and a second environment preferably having a pressure lower than that in the first environment, an article handler including a handler chamber which can be reached by the second environment, and a lithography projector including a projection chamber. The handler chamber and the projection chamber can be interconnected in order to transfer an article. The load-lock comprises a load-lock chamber, a means for exhausting the load-lock chamber, and a door means for closing the load-lock chamber during exhaust operation and opening the load-lock chamber in order to feed the article into the load-lock chamber or taking out the article therefrom. The load-lock chamber is provided with at least two positions for supporting different articles. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
The invention relates to a lithographic projection assembly, having at least two load locks for transferring substrates between a first environment and a lower pressure second environment, a substrate handler with a handler chamber within the second environment and a lithographic projection apparatus including a projection chamber. The handler chamber and the projection chamber communicate via a load position for entering a substrate from the handler chanter into the projection chamber and an unload position for removing the substrate from the projection chamber into the handler chamber. The handler chamber also includes pre-processing means for pre-processing of the substrates and transport means for transferring substrates between the load locks and pre-processing means.
Abstract:
A load lock for a lithographic apparatus is arranged to transfer an object, like a substrate, into and from the lithographic apparatus. The load lock outer wall defining at least part of a load lock volume accommodating a support unit for supporting the object when in the load lock. The load lock also has a temperature conditioned structure to control the temperature of the object to a desired temperature at least before the object is transferred from the load lock towards the lithographic projection apparatus.
Abstract:
A method of and apparatus for maintaining a machine part arranged in an interior space of a machine, where the interior space is kept at a first pressure and is separated from an environment having a second pressure via a load lock. The method includes transporting a machine part via the load lock out of the interior space and transporting via the load lock into the interior space one of the maintained machine part and a separate replacement machine part.
Abstract:
A load lock is constructed and arranged to transfer a substrate between a first environment and a second environment and to maintain each of the first environment and the second environment therein. The load lock includes a load lock chamber provided with at least two mutually distinct substrate supports positioned one above the other. Each of the substrate supports includes a substrate displacement element. The load lock also includes an evacuation device constructed and arranged to evacuate the load lock chamber, and a door constructed and arranged to close the load lock chamber during evacuation and for opening the load lock chamber.
Abstract:
Lithographic Apparatus and Device Manufacturing Method The present invention relates to a method for transferring an object (W) via a load lock (LL) between a lithography patterning chamber (PC) and a second environment. The load lock (LL) forming an inner space that is enclosed by a wall forming said inner space and the load lock (LL) comprising a first door (11) facing the lithography patterning chamber and a second door (12) facing the second environment. The load lock (LL) is at least during part of the transfer vented with a gas that is essentially free from at least one of particles, oxygen, hydrocarbon and H[err]O.