Lithographic apparatus and method for manufacturing device
    3.
    发明专利
    Lithographic apparatus and method for manufacturing device 审中-公开
    平面设备和制造设备的方法

    公开(公告)号:JP2005051202A

    公开(公告)日:2005-02-24

    申请号:JP2004147188

    申请日:2004-05-18

    Abstract: PROBLEM TO BE SOLVED: To prevent a substrate from fouling by suppressing entry of unnecessary particles or molecules at the time of opening and closing a door in a substrate loading device (LL) of an exposure system in which the pressure is lower than an atmospheric pressure. SOLUTION: The loading device (LL) forms a space, or a chamber, and comprises a first door (11) that faces a lithographic pattern forming chamber (PC), a second door (12) that faces a second environment, and a gas entrance (13). The gas entrance (13) is connected to a gas supply (17) so as to provide a gas at least for a portion of a period during which an object moves. This gas is a gas which basically does not include at least one of particles, oxygen, a hydrocarbon and H 2 O. Supplying a gas that does not foul a substrate allows the pressure in the loading device to be higher than an atmospheric pressure, thereby suppressing the entry of unnecessary particles or molecules at the time opening and closing the door between different atmospheres and thus preventing the substrate from fouling. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题:为了防止基板在压力低于其的曝光系统的基板装载装置(LL)中打开和关闭门时抑制不必要的颗粒或分子进入而造成污染 大气压力。 解决方案:加载装置(LL)形成空间或室,并且包括面向光刻图案形成室(PC)的第一门(11),面向第二环境的第二门(12) 和气体入口(13)。 气体入口(13)连接到气体供应源(17),以至少在物体移动期间的一部分期间提供气体。 该气体是基本上不包括颗粒,氧气,烃和H 2 SB 2 O 2中的至少一种的气体。 提供不污染基板的气体允许加载装置中的压力高于大气压,从而在不同气氛之间打开和关闭门时抑制不必要的颗粒或分子的进入,从而防止基板 污垢。 版权所有(C)2005,JPO&NCIPI

    LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD

    公开(公告)号:SG141228A1

    公开(公告)日:2008-04-28

    申请号:SG2004026134

    申请日:2004-05-14

    Abstract: Lithographic Apparatus and Device Manufacturing Method The present invention relates to a method for transferring an object (W) via a load lock (LL) between a lithography patterning chamber (PC) and a second environment. The load lock (LL) forming an inner space that is enclosed by a wall forming said inner space and the load lock (LL) comprising a first door (11) facing the lithography patterning chamber and a second door (12) facing the second environment. The load lock (LL) is at least during part of the transfer vented with a gas that is essentially free from at least one of particles, oxygen, hydrocarbon and H[err]O.

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