Abstract:
PROBLEM TO BE SOLVED: To provide a transfer apparatus which can reduce the occurrence of contaminated particles while correctly receiving an object on a receiving base with a relatively high speed. SOLUTION: A transfer apparatus 10 comprises a measuring device 22 for measuring the relative position of a gripper 15 with respect to a receiving base 20 at least in a one-dimensional manner. A position error is determined with respect to a target relative position based on the measured relative position. A relative position error on a second position can be minimized by adjusting the position of the gripper 15 relative to the receiving base 20. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an actuator that can reduce the possibility that the contaminant proceeds to the outside.SOLUTION: An actuator is configured to include a first portion and a second portion and configured so that the first portion moves relative to the second portion. A labyrinth seal is provided between the first portion and the second portion. The labyrinth seal restricts the flow of gas toward a second side of the labyrinth seal from a first side of the labyrinth seal. One or more inlets and one or more outlets are provided within the labyrinth seal, and the one or more inlets are configured to deliver the gas to a position within the labyrinth seal, and one or more outlets are configured to remove at least one part of the gas from the position within the labyrinth seal.
Abstract:
PROBLEM TO BE SOLVED: To provide a device which can limit a temperature effect when a high working speed is used for a load lock. SOLUTION: This substrate treatment device has a vacuum chamber and the load lock for gas removal. The load lock has a support table in order to support a substrate. A cover plate is provided in the load lock and the cover plate has a lower surface facing an upper surface of the support table. An opening is formed in the lower surface of the cover plate and enables gas removal from an upper part of the substrate in the substantially perpendicular direction to the lower surface. In one embodiment, a gas removal structure with the opening in the upper surface of the support table is provided and gas pressure between the upper surface of the support table and the substrate is reduced through the opening in an early stage to predetermined pressure lower than simultaneous load lock pressure in the remainder of the load lock. When the load lock pressure in the remainder of the load lock is reduced to pressure lower than the predetermined pressure, the gas pressure between the upper surface of the support table and the substrate is reduced together with the load lock pressure in the remainder of the load lock. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus that can limit temperature effect when a high operation speed is used for a load lock.SOLUTION: A substrate processing apparatus has a vacuum chamber and the load lock for gas removal. The load lock has a support table for supporting a substrate. A cover plate is provided in the load lock and has a lower surface facing an upper surface of the support table. An opening is provided to the lower surface of the cover plate so as to remove gas from above the substrate in a direction substantially perpendicular to the lower surface. As an embodiment, gas removal constitution which has an opening in the upper surface of the support table is provided to initially reduce gas pressure between the upper surface of the support table and the substrate to predetermined pressure lower than simultaneous load lock pressure in the rest of the load lock through the opening. When the load lock pressure in the rest of the load lock is made lower than predetermined, the gas pressure between the upper surface of the support table and the substrate is reduced together with the load lock pressure in the rest of the load lock.
Abstract:
PROBLEM TO BE SOLVED: To disclose a substrate support constituted to support a substrate for immersion lithographic processing. SOLUTION: The substrate support has a central part and a peripheral part, the peripheral part includes an extraction duct for extracting a liquid from an upper surface of the substrate support, and extraction duct is connected to an exit duct for duct the liquid away from the substrate support. The substrate support further includes a thermal decoupler for decreasing heat transmission between the central part and the peripheral part. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
Substrate support and lithographic process A substrate support constructed to support a substrate for immersion lithographic processing is disclosed. The substrate support has a central part and a peripheral part, the peripheral part comprising an extraction duct configured to extract a liquid from a top surface of the substrate support, the extraction duct connected to an exit duct configured to duct the liquid away from the substrate support. The substrate support further includes a thermal decoupler, arranged in the peripheral part, configured to arranged to decrease heat transport between the central part and the peripheral part.
Abstract:
The invention relates to a lithographic projection assembly, having at least two load locks for transferring substrates between a first environment and a lower pressure second environment, a substrate handler with a handler chamber within the second environment and a lithographic projection apparatus including a projection chamber. The handler chamber and the projection chamber communicate via a load position for entering a substrate from the handler chanter into the projection chamber and an unload position for removing the substrate from the projection chamber into the handler chamber. The handler chamber also includes pre-processing means for pre-processing of the substrates and transport means for transferring substrates between the load locks and pre-processing means.