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公开(公告)号：WO2006089640A2
公开(公告)日：2006-08-31
申请号：PCT/EP2006001120
申请日：2006-02-08
Applicant: EPCOS AG , LEIDL ANTON , PAHL WOLFGANG , WOLFF ULRICH
Inventor： LEIDL ANTON , PAHL WOLFGANG , WOLFF ULRICH
IPC: H04R17/02
CPC classification number: H04R17/02
Abstract: The invention relates to a microphone membrane (M1) comprising two piezoelectric layers (PS1, PS2) with c-axes oriented in the same direction. A first electroconductive surface (E11) is formed in the central metal layer and subjected to a first electrical potential. The piezoelectric layers (PS1, PS2) are respectively arranged between the central metal layer (ML2) and an outer metal layer (ML1, ML3). In a preferred embodiment, the membrane (M1) has a largely symmetrical structure in terms of the layer sequence and the layer thickness thereof.
Abstract translation: 本发明涉及一种麦克风膜（M1），其包括具有同向c轴两个压电体层（PS1，PS2）。 在中间金属层包括第一导电表面（E11）形成，这是在通过一个第一电势作用。 中心金属层（ML2）和布置在外部金属层（ML1，ML3）之间设置的压电体层（PS1，PS2）。 在一个优选的变型中，膜（M1）相对于层的顺序和层的厚度，以大致对称的结构。
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2.发明申请SAW-COMPONENT HAVING A REDUCED TEMPERATURE PATH AND METHOD FOR THE PRODUCTION THEREOF 审中-公开具有产生降低温度的过渡和方法SAW COMPONENT
公开(公告)号：WO2006032335A8
公开(公告)日：2006-05-18
申请号：PCT/EP2005008964
申请日：2005-08-18
Applicant: EPCOS AG , HAUSER MARKUS , KNAUER ULRICH , LEIDL ANTON , RIHA EVELYN , RIHA GERD , ROESLER ULRIKE , RUILE WERNER , RUPPEL CLEMENS , SCHOLL GERD , WOLFF ULRICH
Inventor： HAUSER MARKUS , KNAUER ULRICH , LEIDL ANTON , RIHA EVELYN , RIHA GERD , ROESLER ULRIKE , RUILE WERNER , RUPPEL CLEMENS , SCHOLL GERD , WOLFF ULRICH
CPC classification number: H03H9/08 , H03H3/10 , H03H9/02574 , H03H9/02834 , H03H9/02984
Abstract: The invention relates to a component which functions with the aid of acoustic waves, and which combines various measures in order to lower the temperature path, in particular the resonance frequency. Said component comprises a piezoelectric substrate (PS) having a relatively thin thickness (dp) in the region of 5 50 times the wave length capable of expanding in the material. Electrically conductive component structures (BES) are provided on the top surface and on the lower side, a compensation layer (Ks) is mechanically connected to the substrate such that mechanical deformation occurs, or that a deformation is produced in the event of a change in temperature. A Si0 2 layer having a thickness of 5 20 % of the acoustic waves capable of expanding therein is arranged over the component structures (BES).
Abstract translation: 所以建议利用声波工作，它结合了各种措施，以降低在特定的谐振频率的温度响应。 该装置包括具有从5至50倍，在材料的波长中传播的范围内的相对小的厚度（DP）的压电基片（PS）。 在顶部导电部件结构是设置在底机械牢固地与基板，补偿层（KS）连接，该机械应力被创建，或当温度变化时，一个应力积聚（BES）。 关于组件结构（BES）在其繁殖轴的厚度的声学的5〜20％由SiO 2 布置层。
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公开(公告)号：DE10329866A1
公开(公告)日：2005-01-20
申请号：DE10329866
申请日：2003-07-02
Applicant: EPCOS AG
Inventor： SCHOLL GERD , WOLFF ULRICH , KNAUER ULRICH
Abstract: Substrate comprises a composite structure with a piezoelectric layer (PS) exhibiting a first thermal expansion behavior, a tensioning layer (VS) that exhibits a second thermal expansion behavior and a third compensation layer (KS) with thermal expansion behavior similar to the piezoelectric layer. The tensioning layer sandwiched between the piezoelectric and tensioning layers. An independent claim is made for a method for producing a SAW (surface acoustic wave) component.
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公开(公告)号：DE10302633B4
公开(公告)日：2013-08-22
申请号：DE10302633
申请日：2003-01-23
Applicant: EPCOS AG
Inventor： HAUSER MARKUS DR , RUILE WERNER DR , WOLFF ULRICH , ROESLER ULRIKE DR , KNAUER ULRICH DR , LEIDL ANTON DR , SCHOLL GERD DR
Abstract: SAW Bauelement, – mit einem piezoelektrischen Substrat (S), – mit mindestens einer Wandlerelektrode, die auf dem piezoelektrischen Substrat aufgebracht ist und eine Metallisierung (M) aufweist, die aus einem oder mehreren Metallen zusammengesetzt ist, deren gemittelte spezifische Dichte mindestens 50% über der von Al liegt und – bei dem zur Reduzierung des Temperaturgangs ganzflächig oder teilflächig über der Metallisierung eine dünne Kompensationsschicht (K) eines Materials mit einer Temperaturabhängigkeit der elastischen Koeffizienten aufgebracht ist, die dem Temperaturgang des Substrats entgegenwirkt, – bei dem die Kompensationsschicht (K) SiO2 umfasst, – bei dem die Metallisierung (M) überwiegend aus einem Metall besteht und ausgewählt ist aus Kupfer, Molybdän, Wolfram, Gold, Silber und Platin, – bei dem die Metallisierung (M) eine relative Metallisierungshöhe von 6 bis 14% h/λ aufweist, – bei dem die elastischen Konstanten der Metallisierung eine geringere Temperaturabhängigkeit aufweisen als die des Aluminiums, – bei dem die Kompensationsschicht (K) eine Höhe von 4 bis 10% h/λ aufweist, wobei –λ die Wellenlänge der akustischen Welle ist, die in diesem SAW Bauelement ausbreitungsfähig ist.
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Patent Agency Ranking
公开(公告)号：DE102005008512A1
公开(公告)日：2006-08-31
申请号：DE102005008512
申请日：2005-02-24
Applicant: EPCOS AG
Inventor： WOLFF ULRICH , PAHL WOLFGANG , LEIDL ANTON
Abstract: The module has a cavity (HR2) formed between a base plate (BP) and a cover. The plate has an acoustic channel whose one end opens out to the cavity. The other end of the channel is closed by a microphone chip. The chip is arranged in another cavity connected with outer space. The chip has a diaphragm which separates the cavity (HR1) from the channel. The cover has a separating bar which separates the two cavities from one another.
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公开(公告)号：DE102005008511A1
公开(公告)日：2006-08-31
申请号：DE102005008511
申请日：2005-02-24
Applicant: EPCOS AG
Inventor： WOLFF ULRICH , LEIDL ANTON , PAHL WOLFGANG
Abstract: The microphone has microphone membrane (M1) and an auxiliary membrane (M2), which are connected with a closed air volume. The membranes are electrically coupled so that a movement of the auxiliary membrane is effected simultaneously during movement of the microphone membrane. A base has two openings (AU1, AU2), which flow into a hollow space (HR2) that is formed within the base.
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公开(公告)号：DE102005008514A1
公开(公告)日：2006-08-31
申请号：DE102005008514
申请日：2005-02-24
Applicant: EPCOS AG
Inventor： LEIDL ANTON , WOLFF ULRICH , PAHL WOLFGANG
Abstract: The diaphragm has piezoelectric layers (PS1, PS2), consisting of material e.g. lead zirconium titanate, arranged one above the other, where c-axes of the layers are positioned in the same direction. A middle metal layer (ML2) lies between the piezoelectric layers. Two electrically conducting surfaces are formed in the metal layer and supplied with respective electrical potentials, where one surface lies opposite to the other surface.
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公开(公告)号：DE10302633A1
公开(公告)日：2004-07-29
申请号：DE10302633
申请日：2003-01-23
Applicant: EPCOS AG
Inventor： HAUSER MARKUS , RUILE WERNER , WOLFF ULRICH , ROESLER ULRIKE , KNAUER ULRICH , LEIDL ANTON , SCHOLL GERD
Abstract: A SAW component comprises a piezoelectric substrate (S), a converter electrode arranged on the substrate and having a metallization (M) consisting of one or more metals having an average specific density of at least 50 % above that of aluminum, and a thin compensation layer (K) of a material with a temperature dependency of the elastic coefficient which interacts with the temperature path of the substrate. The compensation layer partially or completely reduces the temperature path over the metallization.
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公开(公告)号：DE102005008515A1
公开(公告)日：2006-08-31
申请号：DE102005008515
申请日：2005-02-24
Applicant: EPCOS AG
Inventor： LEIDL ANTON , WOLFF ULRICH , PAHL WOLFGANG
Abstract: The microphone has a set of diaphragms that are electrically interconnected with one another and includes different masses such that an acoustic resonance of each diaphragm lies in an acoustic operating frequency range (FB) of the microphone. Resonances of the individual diaphragms are shifted against each other in a frequency and overlap the operating frequency range of the microphone. An independent claim is also included for a method for producing a microphone chip.
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