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公开(公告)号：JP2002015536A
公开(公告)日：2002-01-18
申请号：JP2001158467
申请日：2001-05-28
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , FUJII NAOKI , SUZUKI NAOKI , MATSUMOTO YUSUKE , SURUYA PATANAIKU , WILLIAM A CHILDERS , O'REGAN DIANE SPRANDEL
Abstract: PROBLEM TO BE SOLVED: To solve the problem that conventionally it is difficult to improve the efficiency of operation and the efficiency of internal space in a high-temperature vessel, because it is necessary to keep a joined state between a slider of hard disk device(HDD) and a suspension which supports the slider, by using a joining jig until epoxy adhesive is hardened through heat treatment, when the slider and the suspension are adhered by the epoxy adhesive of low elasticity, and, the operation is performed in the state of being set by the joining jig, even when both are moved during operational processes or are heat treated in the high-temperature vessel. SOLUTION: One part of a joint part, of the slider and the suspension which are joined with an epoxy adhesive of low elasticity interposed in between, is heated by a laser beam and is temporally tacked by partially hardening the adhesive. In addition, in order to determine the output and the irradiation time of the laser beam beforehand, the value of resistance of a head which is disposed on the slider is measured, and the temperature is monitored. The output and the irradiation time, which permits the desired temporal tacking strength within a range, where the measured temperature does not exceeds the prescribed temperature, are determined.
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Patent Agency Ranking
公开(公告)号：JPS63113917A
公开(公告)日：1988-05-18
申请号：JP11916487
申请日：1987-05-18
Applicant: IBM
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公开(公告)号：JP2002025025A
公开(公告)日：2002-01-25
申请号：JP2000189148
申请日：2000-06-23
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , SATO TAKUYA , SURUYA PATANAIKU
IPC: B23K1/00 , B23K1/005 , B23K3/00 , B23K3/06 , B23K31/02 , B23K101/38 , G11B5/17 , G11B5/60 , G11B21/21 , H01R43/02 , H05K3/34
Abstract: PROBLEM TO BE SOLVED: To solve the problem that laser irradiation efficiency, maintenance, work efficiency of a conventional solder ball joining device due to spatial restriction, difficulty in the weight reduction and fixed work procedure, etc., involved in the device which joins the slider bonding pad of a head gimbals assembly and the leading pad of a lead wire to each other by a solder ball, and carries out (1) the supplying of the solder ball, (2) the positioning of the solder ball, (3) the spraying of nitrogen gas N2, and (4) the dissolving of the solder ball by laser irradiation, by only one device. SOLUTION: This solder ball joining device is provided with a solder ball holding device 1, and optical device 4, these being separately installed, and a suction pad 3, solder balls 135 held in the soldering ball holding holes of the soldering ball holding device 1 are conveyed to the connection part of the head gimbals assembly by the suction pad 3, and solder is caused to reflow by the optical device 4.
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公开(公告)号：JP2002045962A
公开(公告)日：2002-02-12
申请号：JP2001158474
申请日：2001-05-28
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , MITA YASUHIRO , TOMIYAMA TADAAKI , KIDACHI TAKAO , SURUYA PATANAIKU
Abstract: PROBLEM TO BE SOLVED: To prevent defective bonding due to positional deviation or distortion of a soldered part by correctly positioning a spherical solder ball at a desired bonding position, irradiating it with the laser beam in a stable state, and implementing the reflow when bonding a bonding pad formed on a slider with a pad for a lead formed on a lead wire by the solder ball bonding, and to prevent reduction in energy due to the reflection of the laser beam inside a capillary tube. SOLUTION: A most distal tip part of the capillary tube can be located slightly below a center position P1 of the solder ball contained therein by tapering a tip part 6a of the capillary tube, a play clearance for allowing the solder ball to move is prevented from being increased. In addition, a part in the capillary tube, which is irradiated with the laser beam is mirror-finished.
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公开(公告)号：JP2002251705A
公开(公告)日：2002-09-06
申请号：JP2001039888
申请日：2001-02-16
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , SATO TAKUYA , MITA YASUHIRO , SHI ARASHI , YOKOME HIROYOSHI , YOSHIDA TATSUSHI , SURUYA PATANAIKU
Abstract: PROBLEM TO BE SOLVED: To attain the increase in efficiency, the miniaturization and the enhancement in maintenance of a solder ball disposing device for disposing a solder ball and a solder ball reflow device for performing solder ball reflow, with respect to a device which joins the slider bonding pad of a head gimbals assembly and the leading pad of a lead wire to each other by a solder ball. SOLUTION: The solder ball flying out from a solder ball discharging opening of a solder ball supplying device 1 is attracted by a suction pad 3. An environmental space 6c in which an inert atmosphere is formed and an inert gas supplying part are formed on a placing plate 6 and the inert gas supplying means is removed from an optical device 4 so that the solder ball is directly irradiated with an outputted convergent laser beam.
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公开(公告)号：JP2001043647A
公开(公告)日：2001-02-16
申请号：JP20163099
申请日：1999-07-15
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , TSUCHIDA HIROYASU , INOUE HIROO , SURUYA PATANAIKU , ISHIKAWA HIROMI , NANBA MASAAKI
Abstract: PROBLEM TO BE SOLVED: To prevent short-circuiting caused by the oozing-out of flexure adhesive, to absorb distortion caused by the contraction of a soldered part by reducing the rigidity of a flexure, and to improve the quality of the soldered part by arranging pads adjacently to each other as much as possible when the bonding pad formed in a slider held in the flexure and the leading pad for a lead fixed to the platform of the flexure are soldered to each other. SOLUTION: Holes 21 and 22 are bored in a flexure 8 portion near the soldered parts of the bonding pads 28 to 31 of a slider 25 and the leading pads 41 to 44 of a lead end part. Thus, since adhesive for adhering the slider 25 to a flexure tongue 20 is moved downward from the holes 21 and 22, the adhesive is prevented from being brought into contact with the bonding pads 28 to 31.
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