公开(公告)号：DE68908480T2

公开(公告)日：1994-03-17

申请号：DE68908480

申请日：1989-04-15

Applicant: IBM

Inventor： GALLAGHER WILLIAM JOSEPH ,  GIESS EDWARD AUGUST ,  GUPTA ARUNAVA ,  LAIBOWITZ ROBERT BENJAMIN ,  O'SULLIVAN EUGENE JOHN M ,  SANDSTROM ROBERT LEE

IPC: C01G3/00 ,  C01B13/14 ,  C01G1/00 ,  C04B41/89 ,  C30B23/02 ,  C30B25/18 ,  C30B29/22 ,  H01B12/06 ,  H01B13/00 ,  H01L39/14 ,  H01L39/22 ,  H01L39/24 ,  H01P3/08

公开(公告)号：DE69116422D1

公开(公告)日：1996-02-29

申请号：DE69116422

申请日：1991-02-08

Applicant: IBM

Inventor： AHN BYUNG TAE ,  BEYERS ROBERT BRUCE ,  COOPER EMANUEL ISRAEL ,  GIESS EDWARD AUGUST ,  O'SULLIVAN EUGENE JOHN ,  ROLDAN JUDITH MARIE ,  ROMANKIW LUBOMYR TARAS

IPC: C01G1/00 ,  C01G29/00 ,  C04B35/00 ,  C04B35/45 ,  H01B12/06 ,  H01B13/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  H01L39/02 ,  H01L39/24 ,  H01L39/08 ,  H01L21/768 ,  C04B41/51

Abstract: A superconducting multilayer ceramic substrate is disclosed, prepared by firing a laminate of at least two polymer bonded cast sheets of a ceramic dielectric oxide powder, at least one sheet of which has a metallization pattern provided thereon, to thereby form a superconducting oxide reaction layer at the interface between the sintered ceramic material and the embedded metallic conductor lines of the metallization pattern.

公开(公告)号：DE3482352D1

公开(公告)日：1990-06-28

申请号：DE3482352

申请日：1984-07-16

Applicant: IBM

Inventor： EGGERDING CARL LOUIS ,  GIESS EDWARD AUGUST

IPC: C04B35/195 ,  C04B35/634 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K3/46 ,  H01L23/14

Abstract: A method of forming a dielectric substrate is disclosed which method comprises admixing crystalline cordierite particles with a binder and solvent therefor, casting the mixture into a sheet, drying the cast sheet to form a self-supporting green sheet and then heating the green sheet to burn out the binder and sinter the crystalline cordierite particles together.

公开(公告)号：DE68908480D1

公开(公告)日：1993-09-23

申请号：DE68908480

申请日：1989-04-15

Applicant: IBM

Inventor： GALLAGHER WILLIAM JOSEPH ,  GIESS EDWARD AUGUST ,  GUPTA ARUNAVA ,  LAIBOWITZ ROBERT BENJAMIN ,  O'SULLIVAN EUGENE JOHN M ,  SANDSTROM ROBERT LEE

IPC: C01G3/00 ,  C01B13/14 ,  C01G1/00 ,  C04B41/89 ,  C30B23/02 ,  C30B25/18 ,  C30B29/22 ,  H01B12/06 ,  H01B13/00 ,  H01L39/14 ,  H01L39/22 ,  H01L39/24 ,  H01P3/08

公开(公告)号：DE2655572A1

公开(公告)日：1977-07-14

申请号：DE2655572

申请日：1976-12-08

Applicant: IBM

Inventor： GIESS EDWARD AUGUST ,  KEEFE GEORGE EDWARD ,  LIN YEONG SHOW

IPC: G11C11/14 ,  G11C19/08 ,  H01F10/00 ,  H01F10/24

公开(公告)号：DE2541140A1

公开(公告)日：1976-05-13

申请号：DE2541140

申请日：1975-09-16

Applicant: IBM

Inventor： GHEZ RICHARD ANGELO ,  GIESS EDWARD AUGUST ,  PLASKETT THOMAS STANLEY

IPC: C30B19/02 ,  C30B19/06 ,  C30B29/28 ,  H01F41/28 ,  H01L21/208 ,  B01J17/06

公开(公告)号：DE2232902A1

公开(公告)日：1973-02-15

申请号：DE2232902

申请日：1972-07-05

Applicant: IBM

Inventor： CALHOUN BERTRAM ALLEN ,  GIESS EDWARD AUGUST ,  KLOKHOLM ERIK ,  PLASKETT THOMAS STANLEY ,  ROSIER LAURENCE LEE ,  SEIDEN PHILIP EDWARD

IPC: H01F10/26 ,  C09D5/23 ,  H01F10/24 ,  B01J17/00