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1.
公开(公告)号:GB2577463A
公开(公告)日:2020-03-25
申请号:GB202000225
申请日:2018-06-14
Applicant: IBM
Inventor: KEVIN WAYNE BREW , DENNIS NEWNS , TALIA SIMCHA GERSHON , TEODOR KRASSIMIROV TODOROV , GLENN JOHN MARTYNA , SEYOUNG KIM
IPC: H01L45/00
Abstract: Memristive devices based on ion-transfer between two meta-stable phases in an ion intercalated material are provided. In one aspect, a memristive device is provided. The memristive device includes: a first inert metal contact; a layer of a phase separated material disposed on the first inert metal contact, wherein the phase separated material includes interstitial ions; and a second inert metal contact disposed on the layer of the phase separated material. The first phase of the phase separated material can have a different concentration of the interstitial ions from the second phase of the phase separated material such that the first phase of the phase separated material has a different electrical conductivity from the second phase of the phase separated material. A method for operating the present memristive device is also provided.
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公开(公告)号:GB2608308A
公开(公告)日:2022-12-28
申请号:GB202213056
申请日:2021-01-26
Applicant: IBM
Inventor: TIAN SHEN , HENG WU , KEVIN WAYNE BREW , JINGYUN ZHANG
Abstract: A method is presented for improved linearity of a phase change memory (PCM) cell structure. The method includes forming a bottom electrode (12) over a substrate (10), constructing a PCM stack (20) including a plurality of PCM layers each having a different crystallization temperature over the bottom electrode (12), and forming a top electrode (32) over the PCM stack (20). The crystallization temperature varies in an ascending order from the bottom electrode (12) to the top electrode (32).
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3.
公开(公告)号:GB2577463B
公开(公告)日:2020-08-19
申请号:GB202000225
申请日:2018-06-14
Applicant: IBM
Inventor: KEVIN WAYNE BREW , DENNIS NEWNS , TALIA SIMCHA GERSHON , TEODOR KRASSIMIROV TODOROV , GLENN JOHN MARTYNA , SEYOUNG KIM
IPC: H01L45/00
Abstract: Memristive devices based on ion-transfer between two meta-stable phases in an ion intercalated material are provided. In one aspect, a memristive device is provided. The memristive device includes: a first inert metal contact; a layer of a phase separated material disposed on the first inert metal contact, wherein the phase separated material includes interstitial ions; and a second inert metal contact disposed on the layer of the phase separated material. The first phase of the phase separated material can have a different concentration of the interstitial ions from the second phase of the phase separated material such that the first phase of the phase separated material has a different electrical conductivity from the second phase of the phase separated material. A method for operating the present memristive device is also provided.
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公开(公告)号:GB2577831A
公开(公告)日:2020-04-08
申请号:GB201918712
申请日:2018-06-01
Applicant: IBM
Inventor: KEVIN WAYNE BREW , DENNIS NEWNS , SEYOUNG KIM , TALIA SIMCHA GERSHON , TEODOR KRASSIMIROV TODOROV
IPC: H01L27/12
Abstract: A method of fabricating a memristive structure for symmetric modulation between resistance states is presented. The method includes forming a first electrode and a second electrode over an insulating substrate, forming an anode contacting the first and second electrodes, forming an ionic conductor over the anode, forming a cathode of the same material as the anode over the ionic conductor, forming a third electrode over the cathode, and enabling bidirectional transport of ions between the anode and cathode resulting in a resistance adjustment of the memristive structure, the anode and the cathode being formed from metastable mixed conducting materials with ion concentration dependent conductivity.
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公开(公告)号:GB2608308B
公开(公告)日:2025-04-16
申请号:GB202213056
申请日:2021-01-26
Applicant: IBM
Inventor: TIAN SHEN , HENG WU , KEVIN WAYNE BREW , JINGYUN ZHANG
Abstract: A method is presented for improved linearity of a phase change memory (PCM) cell structure. The method includes forming a bottom electrode over a substrate, constructing a PCM stack including a plurality of PCM layers each having a different crystallization temperature over the bottom electrode, and forming a top electrode over the PCM stack. The crystallization temperature varies in an ascending order from the bottom electrode to the top electrode.
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6.
公开(公告)号:GB2617496B
公开(公告)日:2024-12-25
申请号:GB202310214
申请日:2021-11-09
Applicant: IBM
Inventor: KEVIN WAYNE BREW , WEI WANG , INJO OK , LAN YU , YOUNGSEOK KIM
Abstract: An embodiment in the application may include an analog memory structure, and methods of writing to such a structure, including a volatile memory element in series with a non-volatile memory element. The analog memory structure may change resistance upon application of a voltage. This may enable accelerated writing of the analog memory structure.
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公开(公告)号:GB2577831B
公开(公告)日:2021-10-13
申请号:GB201918712
申请日:2018-06-01
Applicant: IBM
Inventor: KEVIN WAYNE BREW , DENNIS NEWNS , SEYOUNG KIM , TALIA SIMCHA GERSHON , TEODOR KRASSIMIROV TODOROV
IPC: H01L27/12
Abstract: A method of fabricating a memristive structure for symmetric modulation between resistance states is presented. The method includes forming a first electrode and a second electrode over an insulating substrate, forming an anode contacting the first and second electrodes, forming an ionic conductor over the anode, forming a cathode of the same material as the anode over the ionic conductor, forming a third electrode over the cathode, and enabling bidirectional transport of ions between the anode and cathode resulting in a resistance adjustment of the memristive structure, the anode and the cathode being formed from metastable mixed conducting materials with ion concentration dependent conductivity.
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公开(公告)号:GB2573693A
公开(公告)日:2019-11-13
申请号:GB201910618
申请日:2018-01-03
Applicant: IBM
Inventor: TALIA SIMCHA GERSHON , KEVIN WAYNE BREW , SAURABH SINGH , DENNIS NEWNS
IPC: H01L45/00
Abstract: A memristive device includes a first conductive material layer. An oxide material layer is arranged on the first conductive layer. A second conductive material layer is arranged on the oxide material layer, where in the second conductive layer comprises a metal-alkali alloy.
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