Abstract:
PROBLEM TO BE SOLVED: To prevent peeling or separation of a polyimide insulating material caused by the pie-doughy irregularities during the wet etching of the polyimide insulating material in a circuit integrated suspension and a flexible circuit board. SOLUTION: The vicinity of a pie-doughy irregular part formed when a polyimide insulating material is patterned by wet etching is covered with thermosetting resin, photosetting resin or a precursor thereof. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a technique capable of making manufacturing efficiency higher and a product cost lower than the conventional production process, etc., utilizing only the dry etching process represented by plasma etching in molding an intermediate second layer consisting of an electrically insulating material in a method of manufacturing a laminated structure for a disk driving suspension assembly using a multilayered lamination sheet having a first layer consisting of a metallic spring material, the second layer described above and a third layer consisting of a conductive material. SOLUTION: The method of manufacturing the laminated structure for the disk driving suspension assembly comprising using the multilayered lamination sheet having the first layer 50 consisting of the metallic spring material, the intermediate second layer 90 consisting of the electrical insulating material and the third layer 70 consisting of the conductive material and performing the dry etching process after wet etching as a process step of molding the second layer 90 and the laminated structure thereof are provided.
Abstract:
PROBLEM TO BE SOLVED: To solve the problems, such as the degradation in working space efficiency and a cost increase by as much as the need for assembly jigs (holders and fixtures, etc.), as trays or blocks move as a pair at all times while unfinished HG assemblies move between respective manufacturing process steps in assembling the HG assemblies which are components of hard disk devices and consequently the assembly jigs are needed by as much as the number of the unfinished HG assemblies existing in at least the respective assembly process steps. SOLUTION: Base plates, load beams, etc., which are lamination members constituting the HG assemblies are respectively formed of run constitution. The base late runs 3 and the load beam runs 4 are conveyed in the laminated run state by the conveyance equipment 2 and are subjected in the run state to necessary assembly process steps, such as adhesion of the respective layers, fitting of sliders, electrical connection of terminals and the like.
Abstract:
PROBLEM TO BE SOLVED: To improve manufacturing efficiency and to reduce costs for a product compared with a conventional manufacturing method, etc., using only a dry etching process typified by plasma etching for molding a second layer in a method for manufacturing a laminated structure for a disk driving suspension assembly using a multilayer sheet having a first layer made of metallic spring material, the second layer in between consisting of electric insulation material and a third layer consisting of conductive material. SOLUTION: The method for manufacturing the laminated structure for the disk driving suspension assembly and the laminated structure uses the multilayer sheet having the first layer 50 made of the metallic spring material, the second layer 90 in between consisting of the electric insulation material and the third layer 70 consisting of the conductive material and uses only the wet etching process as the molding process of the second layer 90. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To accurately control the flying height by obtaining the ideal static attitude of a head/slider assembly. SOLUTION: The head supporting arm 17 of the disk drive device is provided with a front part for supporting an assembly 21, a rear part pivotally attached 30 to the frame of the drive device, a bent part 31 between the front part and rear part, plural conductive wires 25 covered with a tube, and a first and 2nd fixing positions 38, 39 symmetrically arranged on the both sides of the center line of the arm in the position between the bent part and the front part. The tube is mounted on the arm between the bent part and the rear part, and the plural conductive wires extended from the tip of the tube positioned on the front part side of the arm are extended above the bent part and divided into a 1st and 2nd groups 25A, 25B, then the wires of the 1st, 2nd groups are respectively fixed to the 1st and 2nd fixing positions and connected to the head while being symmetrically arranged on the both sides of the center line 29.
Abstract:
PROBLEM TO BE SOLVED: To provide a laminated structure for a disk drive suspension assembly, which is improved in machining precision and excellent in quality. SOLUTION: In the metod of manufacturing the laminated structure for the disk drive suspension assembly, wet etching is applied to form first and third layers by using a multilayered sheet at least including a first layer made of a metal spring material, a second middle layer made of an electric insulating material, and a third layer made of a conductive material, and then the pattern formation of the second layer is executed by the etching processes of three kinds or more including continuous wet etching using at least two or more kinds of different etching solutions, and dry etching carried out after the wet etching. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To meet the demand of developing a technology capable of making uniform processing on both sides particularly when a resin layer is processed from both surfaces by wet etching in the multilayered plate of a structure having a resin layer in which thermoplastic polyimide layers are formed on both surfaces of a non-thermoplastic polyimide layer. SOLUTION: A manufacturing method is provided for a multilayered plate 100 wherein the thickness d1 of a thermoplastic polyimide layer 20 on a large surface roughness side is secured larger than a thermoplastic polyimide layer 30 on a small rough surface side corresponding to a difference in surface roughness between the thermoplastic polyimide layers 20 and 30 on both sides of a resin layer 60, and etching is similarly progressed on both sides of the resin layer 60 according to a difference in thickness, and a hard disk suspension multilayered body. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To prevent short-circuiting caused by the oozing-out of flexure adhesive, to absorb distortion caused by the contraction of a soldered part by reducing the rigidity of a flexure, and to improve the quality of the soldered part by arranging pads adjacently to each other as much as possible when the bonding pad formed in a slider held in the flexure and the leading pad for a lead fixed to the platform of the flexure are soldered to each other. SOLUTION: Holes 21 and 22 are bored in a flexure 8 portion near the soldered parts of the bonding pads 28 to 31 of a slider 25 and the leading pads 41 to 44 of a lead end part. Thus, since adhesive for adhering the slider 25 to a flexure tongue 20 is moved downward from the holes 21 and 22, the adhesive is prevented from being brought into contact with the bonding pads 28 to 31.