公开(公告)号：JPH03152544A

公开(公告)日：1991-06-28

申请号：JP25042290

申请日：1990-09-21

Applicant: IBM

Inventor： UIRIAMU ROSU BURANZUBOURUDO ,  FUIRITSUPU CHIU ,  UIRAADO AARU KONREE JIYUNIA ,  DEIRU MAREE KUROKATSUTO ,  MERUBIN UOREN MONGOMERII ,  UEIN MAATEIN MOROO

IPC: C08G8/00 ,  C08G8/10 ,  G03F7/039 ,  G03F7/38 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE: To enable dry development by using a phenol-aldehyde type condensation product and a photoactive compd. generating a strong acid which enables the reaction of hydroxy groups with an organometallic reagent when the compd. is exposed with deep UV. CONSTITUTION: A phenol-aldehyde type condensation product represented by formula I and a radiation-degradable acid generating material such as a metallic or nonmetallic onium salt, a tosylate or a non-metal sulfonic acid precursor as a radiation sensitive material are used. In the formula I, R is H, -CH3 or phenyl, R' is H, alkyl or aryl, R'' is H, halogen, nitro, alkoxy, alkyl, aryl or hydroxy and the basic arom. ring may be condensed with other cyclic structure so as to form a naphthol or anthracene unit. By such constitution, dry development is enabled.

公开(公告)号：JPH04217251A

公开(公告)日：1992-08-07

申请号：JP3137491

申请日：1991-02-01

Applicant: IBM

Inventor： UIRIAMU ROSU BURANZUBOURUDO ,  KURISUTOFUAA JIYON NOOZU ,  MERUBIN UOREN MONGOMERII ,  UEIN MAATEIN MOROO ,  KEBIN MAIKURU UERUSHIYU

IPC: G03F7/004 ,  G03F7/029 ,  G03F7/039 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE: To obtain the acid-sensitized photoresist composition comprising an acid generation photoinitiator and a polymer binder and/or a polymerizable compound and an acid responsive group and being accelerated in photochemical reaction velocity. CONSTITUTION: This acid-initiation photoresist composition to be used comprises the acid generation photoinitiator and the polymer binder and/or a matrix, the acid responsive group capable of patternizing the composition by an acid initiation chemical reaction, and a sufficient amount of a hydroxyaromatic compound for accelerating a reaction velocity of the photoresist composition during irradiation for image formation, and the photoreaction velocity is remarkably enhanced by adding this hydroxyaromatic compound to the photoresist composition in a amount of 1-5weight%.

公开(公告)号：JPH05249680A

公开(公告)日：1993-09-28

申请号：JP20784692

申请日：1992-08-04

Applicant: IBM

Inventor： ROBAATO DEIBITSUDO AREN ,  UIRIAMU ROSU BURANZUBOURUDO ,  BAATON JIESHII KAAPENTAA ,  UIRIAMU DEIINAN HINZUBAAGU ,  JIYOZEFU RATOORE ,  MAIKURU JIYOOJI MAKUMASUTAA ,  MERUBIN UOREN MONTOGOMERII ,  UEIN MAATEIN MOROO ,  ROOGAN ROIDO SHINPUSON ,  ROBAATO JIEIMUZU TOUEIGU ,  GUREGORII MAIKURU UOORURAFU

IPC: G03F7/004 ,  C08F2/50 ,  G03F7/039 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE: To obtain a positive photoresist and to provide a photolithographic method using the photoresist. CONSTITUTION: This photoresist contains a polymer practically insoluble in water and base and unstable to light and a photo-acid generating agent capable of forming a strong acid. The photo-acid generating agent is sulfonate ester derived from N-hydroxyamide or N-hydroxyimide. This photoresist further contains a proper photosensitizer.

公开(公告)号：JPH03206458A

公开(公告)日：1991-09-09

申请号：JP3168190

申请日：1990-02-14

Applicant: IBM

Inventor： UIRIAMU ROSU BURANZUBOURUDO ,  KURISUTOFUAA JIYON NOOAZU ,  RANII WAIIRIN KUUON ,  SUTEIIBU SEIICHI MIURA ,  MERUBIN UOREN MONGOMERII ,  UEIN MAATEIN MOROO ,  HAABANZU SHINGU SAKUDEBU

IPC: G03F7/004 ,  G03F7/038 ,  G03F7/039 ,  H01L21/027 ,  H01L21/30

Abstract: PURPOSE: To chemically increase sensitivity by irradiation with UV, electron beams or X-rays by using a specified polymerizable or molecular compsn. and a specified precursor of sulfonic acid. CONSTITUTION: This photoresist contains a polymerizable or molecular compsn. whose solubility depends on the presence of a protective group capable of removal with an acid and a precursor of sulfonic acid generating the strong acid when exposed with radiation, that is, an N-fluoroalkylsulfonyloxyimide sensitizer and a polymerizable resin or a molecular monomer having a protective group such as a carbonate or carboxylate group capable of removal with the acid. When the sulfonyloxyimide sensitizer is used in various photoresist compsns, the sensitivities are increased and exposure is carried out under various radiation conditions. Chemical amplification is attained.