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    BUCKLING BEAM TEST PROBE ASSEMBLY
    1.
    发明专利
    BUCKLING BEAM TEST PROBE ASSEMBLY 未知

    公开(公告)号：DE3473651D1

    公开(公告)日：1988-09-29

    申请号：DE3473651

    申请日：1984-06-22

    Applicant: IBM DEUTSCHLAND ,  IBM

    Inventor： ELSASSER MICHAEL ,  STOEHR ROLAND

    IPC: G01R1/073

    Abstract: The contactor (10) comprises an assembly block attached to a relatively fixed mount by bolts with a degree of emergency overtravel in the 'Z' direction being provided by the spring and bush. The test probes are arranged in a square series of 9 matrices each of which accommodates 285 probes with four probe positions at the corners of each square being occupied by thin stabilising rods. The probe wires (50) slide through a matrix of holes in three guide plates set at predetermined spacings and supported in the frames and the stripper plates supported in frames. Above exit plate, the probe wires converge into bundles leading to cables and within the carrier block are embedded in cast resin.

    3.
    发明专利
    未知

    公开(公告)号：DE3886754D1

    公开(公告)日：1994-02-10

    申请号：DE3886754

    申请日：1988-10-19

    Applicant: IBM DEUTSCHLAND

    Inventor： BAYER THOMAS ,  BARTHA JOHANN DR ,  GRESCHNER JOHANN DR ,  KERN DIETER ,  MATTERN VOLKER ,  STOEHR ROLAND

    IPC: C08J7/00 ,  C23F4/00 ,  H01L21/00 ,  H01L21/302 ,  H01L21/3065 ,  H01J37/20

    Abstract: The invention relates to a vacuum reactor for etching thermally poorly conducting substrates with a high etching rate uniformity, in which the substrates (33) to be etched are arranged in a holder (35, 36) at a specific distance from the cathode (31) to which RF energy is applied. In an advantageous embodiment of the invention, the cathode is raised in the region of the substrate (33) to be etched and brought up to the underside of the substrate as far as a distance of approximately 0.2 mm. The cathode consists of aluminium, and is provided in the region of the substrate to be etched with a layer (32) acting as a complete radiator. The heat formed during the RIE is dissipated by thermal radiation, and the radiation reflected back onto the substrates from the cathode is absorbed by the layer (32). The invention also comprises a process for etching thermally poorly conducting substrates, in particular for etching plastic substrates.

    CONTACT PROBE ARRANGEMENT
    4.
    发明专利
    CONTACT PROBE ARRANGEMENT 审中-公开

    公开(公告)号：JP2002098713A

    公开(公告)日：2002-04-05

    申请号：JP2001218755

    申请日：2001-07-18

    Applicant: IBM

    Inventor： BAYER THOMAS ,  GRESCHNER JOHANN DR ,  MEISSNER KLAUS ,  STEINER WERNER ,  STOEHR ROLAND

    IPC: G01R31/26 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66

    Abstract: PROBLEM TO BE SOLVED: To provide a contact probe arrangement 1 for connecting electrically a test device to circular contact pads 2 of a device 3 to be tested. SOLUTION: The contact probes 4 are pressed perpendicularly onto the contact pads 2 in order to realize a low contact resistance, and can be bent in the transverse direction in regions 6a, 6b where the contact probes are installed in order to adjust the difference of heights of the contact pads 2 caused by a non-uniform surface of the device 3 to be tested. The contact probes 4 are installed in a guide groove 5. The guide groove 5 and the regions 6a, 6b are formed on a plane parallel to the plane of a guide groove 7, and covered with a protection plate. This constitution assures a contact probe array having a very high density. This kind of contact probe array can be used, for example, for detecting open and short in an electric circuit array of a microelectronic composite device.

    Contact probe arrangement
    6.
    发明专利
    Contact probe arrangement 未知

    公开(公告)号：GB2306804B

    公开(公告)日：1999-07-14

    申请号：GB9621500

    申请日：1996-10-16

    Applicant: IBM

    Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

    IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

    Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

    Contact probe arrangement for electronic functional testing
    7.
    发明专利
    Contact probe arrangement for electronic functional testing 未知

    公开(公告)号：DE19625493C1

    公开(公告)日：1997-11-20

    申请号：DE19625493

    申请日：1996-06-26

    Applicant: IBM

    Inventor： ELSNER GERHARD DR ,  GRESCHNER JOHANN DR ,  STOEHR ROLAND

    IPC: G01R1/073 ,  G01R31/28 ,  H01L25/00

    Abstract: The arrangement has a first stack (1) of hole plates in which the contact probes (1a-1d) are inserted with lateral flexibility. The probes are fixed onto or in a second contact plate stack (2). There is also a test card (3) and a pressure plate (4). The first and second hole plate stacks are connected and able to move wrt. each other. The test card is rigidly connected to a counter holder (5) and the pressure plate is movable wrt. the test card.

    Contact probe arrangement
    8.
    发明专利
    Contact probe arrangement 未知

    公开(公告)号：GB2306804A

    公开(公告)日：1997-05-07

    申请号：GB9621500

    申请日：1996-10-16

    Applicant: IBM

    Inventor： BAYER THOMAS ,  GRESCHNER JOHANN ,  MEISSNER KLAUS ,  STOEHR ROLAND ,  STEINER WERNER

    IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

    Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

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