Abstract:
The invention relates to a time-detection device using a floating-gate-cell, wherein an ON-layer structure or a ONO-layer structure is provided between the floating-gate and the control-gate. A charge injection device is supplied in order to insert the floating-gate-electrode into the nitride layer of the ON-structure or the ONO-layer structure, wherein a voltage or a voltage pulse is applied to the control-gate-electrode, the centre of gravity of the charges injected into the nitride layer being located on the defining surface. Said time-detection device also comprises a device for detecting time elapsed since injection of the charges, based on changes in the transmission behaviour of the channel area, which are effected by displacement of the centre of gravity of the charges in the nitride layer away from the defining surface.
Abstract:
Each memory cell is a memory transistor which is provided with a gate electrode (2) on the upper surface of a semiconductor body. Said gate electrode is disposed in a trench between a source area (3) and a drain area (4) which are formed in the semiconductor material. The gate electrode is separated from the semiconductor material by dielectric material. A series of oxide nitride-oxide layers (5, 6, 7) is disposed between the source area and the drain area and between the drain area and the gate electrode in order to capture charge carriers on the source and drain.
Abstract:
A floating gate cell is used as a clock whereby the charging process is delayed by the application of a sufficiently low charging voltage until a predetermined threshold voltage is reached. A particularly thin tunnel oxide layer can be provided in order to bring about a gradual discharge of a charged cell. Preferably, the floating gate electrode (5)is connected to the control gate electrode (16) of a second cell, which then delays the charging of the floating gate electrode (15) of the second cell.
Abstract:
In the case of this semiconductor memory having NROM cells, the channel regions of the memory transistors (T) in each case run transversely with respect to the relevant word line (2), the bit lines are arranged on the top side of the word lines and in a manner electrically insulated from the latter, and electrically conductive cross-connections (21) are present, which are arranged in sections in interspaces between the word lines and in a manner electrically insulated from the latter and are connected to the bit lines in each case in next but one sequence.
Abstract:
The invention relates to memory transistors with trenched gate electrodes (2) and an ONO memory layer sequence (5, 6, 7), whose source/drain regions (3, 4) are associated with an electroconductive layer (8) or layer sequence that has a strip-shaped structure that corresponds to the bit lines. Said layer especially comprises a metal silicide or a polysilicon layer (14) with a metallic layer (15) applied thereto that reduces the ohmic resistance of the trenched bit lines. The metal silicide is preferably a cobalt silicide, the metallic layer is preferably a tungsten silicide or WN/W.
Abstract:
A time recording device employs a floating gate cell, wherein an ON layer structure or an ONO layer structure is provided between floating gate and control gate. A charge injection unit is provided to inject charges into the floating gate electrode and into the nitride layer of the ON structure or the ONO structure by applying a voltage or voltage pulses to the control gate electrode, a center of concentration of the charges injected into the nitride layer being located at the interface between oxide layer and nitride layer of the layer sequence. The time recording device also includes a unit for recording a time which has elapsed since charge injection on the basis of changes in the transmission behavior of the channel region caused by a shift in the center of concentration of the charges in the nitride layer away from the interface.
Abstract:
In the case of this semiconductor memory having NROM cells, the channel regions of the memory transistors in each case run transversely with respect to the relevant word line, the bit lines are arranged on the top side of the word lines and in a manner electrically insulated from the latter, and electrically conductive cross-connections are present, which are arranged in sections in interspaces between the word lines and in a manner electrically insulated from the latter and are connected to the bit lines in each case in next but one sequence.
Abstract:
Each memory cell is a memory transistor which is provided on a top side of a semiconductor body with a gate electrode (2) which is arranged in a trench between a source region (3) and a drain region (4), which are formed in the semiconductor material. The gate electrode is separated from the semiconductor material by dielectric material. At least between the source region and the gate electrode and between the drain region and the gate electrode there is an oxide-nitride-oxide layer sequence (5, 6, 7), which is provided for the purpose of trapping charge carriers at source and drain.
Abstract:
In the case of this semiconductor memory having NROM cells, the channel regions of the memory transistors in each case run transversely with respect to the relevant word line, the bit lines are arranged on the top side of the word lines and in a manner electrically insulated from the latter, and electrically conductive cross-connections are present, which are arranged in sections in interspaces between the word lines and in a manner electrically insulated from the latter and are connected to the bit lines in each case in next but one sequence.