Abstract:
A memory device having a reading configuration and including a plurality of memory cells (3), arranged in rows and columns, memory cells (3) arranged on the same column having respective first terminals (3a) connected to a same bit line (12) and memory cells (3) arranged on the same row having respective second terminals (3b) selectively connectable to a same word line (13); a supply line (9) providing a supply voltage (V DD ); a column addressing circuit (4) and a row addressing circuit (5) for respectively addressing a bit line (12) and a word line (13) corresponding to a memory cell (3) selected for reading in the reading configuration. The column addressing circuit (4) is configured to bias the addressed bit line (12) corresponding to the selected memory cell (3) substantially at the supply voltage (V DD ) in the reading configuration. A row driving circuit (6) biases the addressed word line (13) corresponding to the selected memory cell (3) at a non-zero word line read voltage (V WL ), so that a predetermined cell voltage (V CELL ), lower than a phase change voltage (V PHC ), is applied between the first terminal (3a) and the second terminal (3b) of the selected memory cell (3) in the reading configuration.
Abstract:
A nonvolatile memory device (10'; 10") is described comprising a memory array (11), a row decoder (12) and a column selector (13) for addressing the memory cells (16) of the memory array (11), and a biasing stage (22; 36, 28) for biasing the array access device terminal of the addressed memory cell (16). The biasing stage (22; 36 28) is arranged between the column selector (13) and the memory array (11) and comprises a biasing transistor (22; 36) having a drain terminal connected to the column selector (13), a source terminal connected to the array access device terminal of the addressed memory cell (16), and a gate terminal receiving a logic driving signal, the logic levels of which are defined by precise and stable voltages and are generated by a logic block (31) and an output buffer (32) cascaded together. The output buffer (32) may be supplied with either a read voltage (VREAD) or a program voltage (VPROG) supplied by a multiplexer (33). The biasing transistor (22; 36) may be either included as part of the column selector (13) and formed by the selection transistor (22) which is closest to the addressed memory cell (16) or distinct from the selection transistors (20, 21, 22) of the column selector (13).
Abstract:
A memory device includes a plurality of memory cells (3), arranged in row and columns, memory cells (3) arranged on the same column having respective first terminals (3a) connected to a same bit line (12) and memory cells (3) arranged on the same row having respective second terminals (3b) selectively connectable to a same word line (13); a supply line (9) providing a supply voltage (V A ); a column addressing circuit (4) for addressing a bit line (12) corresponding to a memory cell (3) to be read; and a row addressing circuit (5) for addressing a word line (13) corresponding to the memory cell (3) to be read. Moreover, the column addressing circuit (4) is configured to bias the addressed bit line (12) corresponding to the memory cell (3) to be read substantially at the supply voltage (V A ).
Abstract:
A phase change memory includes a temperature sensor having a resistance variable with temperature with the same law as a phase-change storage element. The temperature sensor is formed by a resistor (20) of chalcogenic material furnishing an electrical quantity (V(T), I(T)) that reproduces the relationship between the resistance of a phase change memory cell and temperature; the electrical quantity is processed (21) so as to generate reference quantities as necessary for writing and reading the memory cells. The chalcogenic resistor (20) has the same structure as a memory cell and is programmed with precision, preferably in the reset state.
Abstract:
A nonvolatile memory device (10'; 10") is described comprising a memory array (11), a row decoder (12) and a column selector (13) for addressing the memory cells (16) of the memory array (11), and a biasing stage (22; 36, 28) for biasing the array access device terminal of the addressed memory cell (16). The biasing stage (22; 36 28) is arranged between the column selector (13) and the memory array (11) and comprises a biasing transistor (22; 36) having a drain terminal connected to the column selector (13), a source terminal connected to the array access device terminal of the addressed memory cell (16), and a gate terminal receiving a logic driving signal, the logic levels of which are defined by precise and stable voltages and are generated by a logic block (31) and an output buffer (32) cascaded together. The output buffer (32) may be supplied with either a read voltage (VREAD) or a program voltage (VPROG) supplied by a multiplexer (33). The biasing transistor (22; 36) may be either included as part of the column selector (13) and formed by the selection transistor (22) which is closest to the addressed memory cell (16) or distinct from the selection transistors (20, 21, 22) of the column selector (13).
Abstract:
A phase-change memory device includes a plurality of data PCM cells (13), for storing data bits; data decoding circuits (14, 27, 28a), for selectively addressing sets of data PCM cells (13); and data read/program circuits (20a), for reading and programming the selected data PCM cells (13). The device further includes a plurality of parity PCM cells (25), for storing parity bits associated to data bits stored in the data PCM cells (13); parity decoding circuits (14, 27, 28b), for selectively addressing sets of parity PCM cells (25); and parity read/program circuits (20b), for reading and programming the selected parity PCM cells (25).
Abstract:
A memory device is proposed. The memory device includes a plurality of memory cells (P,S), wherein each memory cell includes a storage element (P) and a selector (S) for selecting the corresponding storage element during a reading operation or a programming operation. The selector includes a unipolar element (M) and a bipolar element (D;B). The memory device further includes control means (110s) for prevalently enabling the unipolar element during the reading operation or the bipolar element during the programming operation.