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公开(公告)号：CN100452342C
公开(公告)日：2009-01-14
申请号：CN03818345.5
申请日：2003-06-20
Applicant: 索尼株式会社
CPC classification number: H05K1/187 , H01L21/6835 , H01L23/3128 , H01L23/3157 , H01L23/49816 , H01L24/10 , H01L24/13 , H01L24/24 , H01L24/81 , H01L24/97 , H01L25/105 , H01L2221/68345 , H01L2221/68377 , H01L2224/13 , H01L2224/13111 , H01L2224/13144 , H01L2224/16237 , H01L2224/24227 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K3/205 , H05K3/386 , H05K3/4614 , H05K3/4617 , H05K2201/0394 , H05K2201/10674 , H05K2203/063 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
Abstract: 披露了一种用于制造具有内置器件的板的方法，能够在绝缘层上精确地形成精细间距的导电图形，同时能够保证导电图形的尺寸稳定性，并且能够将转印薄片彻底去除。转印薄片(61)包括金属基底层(62)和将被溶解的金属层(64)。通过电镀在将被溶解的金属层(64)上形成导电图形(55)。在将具有形成的导电图形(55)的转印薄片(61)粘合到绝缘基底(51)上之后，通过将金属基底层(62)从将被溶解的金属层(64)上分离并且相对于导电图形(55)有选择地将将被溶解的金属层(64)溶解并去除的步骤，将转印薄片(61)去除。
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公开(公告)号：CN1672473A
公开(公告)日：2005-09-21
申请号：CN03818345.5
申请日：2003-06-20
Applicant: 索尼株式会社
IPC: H05K3/20
CPC classification number: H05K1/187 , H01L21/6835 , H01L23/3128 , H01L23/3157 , H01L23/49816 , H01L24/10 , H01L24/13 , H01L24/24 , H01L24/81 , H01L24/97 , H01L25/105 , H01L2221/68345 , H01L2221/68377 , H01L2224/13 , H01L2224/13111 , H01L2224/13144 , H01L2224/16237 , H01L2224/24227 , H01L2224/8121 , H01L2224/81815 , H01L2224/83192 , H01L2224/97 , H01L2225/1035 , H01L2225/1058 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H05K3/205 , H05K3/386 , H05K3/4614 , H05K3/4617 , H05K2201/0394 , H05K2201/10674 , H05K2203/063 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
Abstract: 披露了一种用于制造具有内置器件的板的方法、一种具有内置器件的板、一种用于制造印刷电路板的方法以及一种印刷电路板，其中，能够在绝缘层上精确地形成精细间距的导电图形，同时能够保证导电图形的尺寸稳定性，并且能够将转印薄片彻底去除。转印薄片(61)包括金属基底层(62)和将被溶解的金属层(64)。通过电镀在将被溶解的金属层(64)上形成导电图形(55)。在将具有形成的导电图形(55)的转印薄片(61)粘合到绝缘基底(51)上之后，通过将金属基底层(62)从将被溶解的金属层(64)上分离并且相对于导电图形(55)有选择地将将被溶解的金属层(64)溶解并去除的步骤，将转印薄片(61)去除。
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