Patent search ap:("英闻萨斯有限公司") AND inv:"罗莎娜·阿拉托雷" Page 1

1.

发明授权
具有线键合通孔的堆叠封装组件有权

公开(公告)号：CN104011858B

公开(公告)日：2017-10-10

申请号：CN201280062529.5

申请日：2012-10-16

Applicant: 英闻萨斯有限公司

Inventor： 埃利斯·周 , 雷纳多·科 , 罗莎娜·阿拉托雷 , 菲利普·丹贝格 , 王纬舜 , 杨世英 , 赵志军

IPC: H01L25/10 , H01L23/31 , H01L23/495 , H01L23/498 , H01L21/48

CPC classification number: H01L24/85 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , Y10T29/49149 , Y10T29/49151 , H01L2224/45664 , H01L2924/00 , H01L2924/014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076

Abstract: 一种微电子封装(10)可以包括具有键合至衬底(12)上的各个导电元件(28)的基(34)和相对于基(34)的端部(36)的线键合(32)。介质封装层(42)从衬底(12)延伸且覆盖线键合(32)的部分，以使线键合(32)的被覆盖部分通过封装层(42)相互分离，其中线键合(32)的未封装部分(39)由线键合(32)的未被封装层(42)覆盖的部分限定。未封装部分(39)设置成具有最小间距的图案，该最小间距大于相邻的线键合(32)的基(34)之间的第一最小间距。

2.

发明公开
具有线键合通孔的堆叠封装组件有权

公开(公告)号：CN104011858A

公开(公告)日：2014-08-27

申请号：CN201280062529.5

申请日：2012-10-16

Applicant: 英闻萨斯有限公司

Inventor： 埃利斯·周 , 雷纳多·科 , 罗莎娜·阿拉托雷 , 菲利普·丹贝格 , 王纬舜 , 杨世英 , 赵志军

IPC: H01L25/10 , H01L23/31 , H01L23/495 , H01L23/498 , H01L21/48

CPC classification number: H01L24/85 , H01L21/4853 , H01L21/56 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/3677 , H01L23/4334 , H01L23/49517 , H01L23/49811 , H01L23/49816 , H01L24/06 , H01L24/16 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/05599 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/48245 , H01L2224/48247 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/78301 , H01L2224/851 , H01L2224/8518 , H01L2224/85399 , H01L2224/85951 , H01L2224/85986 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06558 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1029 , H01L2225/1052 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/12042 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15331 , H01L2924/1715 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3511 , H05K3/3436 , H05K2201/10515 , H05K2201/1053 , Y10T29/49149 , Y10T29/49151 , H01L2224/45664 , H01L2924/00 , H01L2924/014 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076

Abstract: 一种微电子封装(10)可以包括具有键合至衬底(12)上的各个导电元件(28)的基(34)和相对于基(34)的端部(36)的线键合(32)。介质封装层(42)从衬底(12)延伸且覆盖线键合(32)的部分，以使线键合(32)的被覆盖部分通过封装层(42)相互分离，其中线键合(32)的未封装部分(39)由线键合(32)的未被封装层(42)覆盖的部分限定。未封装部分(39)设置成具有最小间距的图案，该最小间距大于相邻的线键合(32)的基(34)之间的第一最小间距。

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