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    Method for Simultaneous Structuring and Chip Singulation
    1.
    发明申请
    Method for Simultaneous Structuring and Chip Singulation 有权
    同时结构化和芯片分割的方法

    公开(公告)号：US20150217997A1

    公开(公告)日：2015-08-06

    申请号：US14170187

    申请日：2014-01-31

    Applicant: Infineon Technologies AG

    Inventor： Thomas Grille ,  Ursula Hedenig ,  Michael Roesner ,  Gudrun Stranzl ,  Martin Zgaga

    IPC: B81C1/00 ,  B81B3/00

    CPC classification number: B81B7/0061 ,  B01D67/0034 ,  B81B2201/0257 ,  B81B2201/10 ,  B81C1/00904 ,  B81C2201/0132 ,  Y10T428/24273

    Abstract: A method for structuring a substrate and a structured substrate are disclosed. In an embodiment a method includes providing a substrate with a first main surface and a second main surface, wherein the substrate is fixed to a carrier arrangement at the second main surface, performing a photolithography step at the first main surface of the substrate to mark a plurality of sites at the first main surface, the plurality of sites corresponding to future perforation structures and future kerf regions for a plurality of future individual semiconductor chips to be obtained from the substrate, and plasma etching the substrate at the plurality of sites until the carrier arrangement is reached, thus creating the perforation structures within the plurality of individual semiconductor chips and simultaneously separating the individual semiconductor chips along the kerf regions.

    Abstract translation: 公开了一种用于构造衬底和结构化衬底的方法。 在一个实施方案中，一种方法包括提供具有第一主表面和第二主表面的基底，其中所述基底固定到第二主表面处的载体布置，在所述基底的第一主表面处执行光刻步骤以标记 在第一主表面处的多个位置，对应于未来穿孔结构的多个部位以及从基板获得的多个未来单个半导体芯片的未来切割区域，以及在多个位置等离子体蚀刻基板，直到载体 从而在多个单独的半导体芯片内形成穿孔结构，同时沿着切口区分离各个半导体芯片。

    Method for fabrication of a molecular filter and apparatus formed by the same
    3.
    发明授权
    Method for fabrication of a molecular filter and apparatus formed by the same 有权
    用于制造分子过滤器的方法及由其形成的装置

    公开(公告)号：US07252764B2

    公开(公告)日：2007-08-07

    申请号：US09855404

    申请日：2001-05-15

    Applicant: Axel Scherer

    Inventor： Axel Scherer

    IPC: B01D29/46

    CPC classification number: F16K99/0001 ,  B01D61/18 ,  B01D67/0062 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01D71/027 ,  B01D2325/04 ,  B01D2325/26 ,  B01L2400/082 ,  B81B1/004 ,  B81B2201/10 ,  B81C1/00087 ,  B81C2201/019 ,  B82Y30/00 ,  F15C5/00 ,  F16K99/0015 ,  F16K99/0042 ,  F16K99/0051 ,  F16K2099/0074 ,  F16K2099/008 ,  Y10S264/48

    Abstract: The invention is a method for fabricating molecular filters which can separate objects approximately 1-5 nm in range, where the filtration size is controlled by using thin films of materials and technologies to form a filtration channel or pore in a middle thin film layer in a multilayered structure. Lithography is used to define two offset arrays of blind holes into the opposing sides of a multi-layer membrane. The blind holes extend across a thin central filtration layer. A selective etch is used to attack the filtration layer to form a communicating channel between the two holes. The only connection between one side of the filter and the other is through the channel in the filter layer, whose thickness, d, determines the largest size object which can traverse the filter.

    Abstract translation: 本发明是一种制造分子过滤器的方法，其可以分离大约1-5nm范围内的物体，其中过滤尺寸通过使用材料和技术的薄膜来控制，以在中间薄膜层中形成过滤通道或孔 多层结构。 使用平版印刷术将盲孔的两个偏移阵列定义在多层膜的相对侧中。 盲孔延伸穿过薄的中央过滤层。 使用选择性蚀刻来攻击过滤层以在两个孔之间形成连通通道。 过滤器一侧之间的唯一连接是通过过滤层中的通道，其厚度d决定可以穿过过滤器的最大尺寸的物体。

    PROCESS FOR MANUFACTURING A MICROMECHANICAL STRUCTURE HAVING A BURIED AREA PROVIDED WITH A FILTER
    8.
    发明申请
    PROCESS FOR MANUFACTURING A MICROMECHANICAL STRUCTURE HAVING A BURIED AREA PROVIDED WITH A FILTER 有权
    制造具有过滤器的烧结区域的微观结构的方法

    公开(公告)号：US20120018819A1

    公开(公告)日：2012-01-26

    申请号：US13190254

    申请日：2011-07-25

    Applicant: Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    Inventor： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    IPC: H01L29/84 ,  H01L21/02

    CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

    Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

    Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。

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