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    SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    用于安装电子元件的基板及其制造方法

    公开(公告)号：US20160135302A1

    公开(公告)日：2016-05-12

    申请号：US14938191

    申请日：2015-11-11

    Applicant: IBIDEN CO., LTD.

    Inventor： Naoyuki NAGAYA ,  Kiyotaka Tsukada

    IPC: H05K1/18 ,  H05K3/10 ,  H05K3/46 ,  H05K1/02 ,  H05K3/00

    CPC classification number: H05K3/341 ,  H05K1/0206 ,  H05K3/005 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10416 ,  Y02P70/613

    Abstract: A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet.

    Abstract translation: 用于安装电子部件的基板包括：基材，其包括绝缘树脂，形成在所述材料的第一表面上的第一导体层，形成在所述材料的第二表面上的第二导体层，以及插入穿透所述材料的孔中的金属块 第一导体，材料和第二导体，使得金属块安装在孔中。 所述材料具有与所述孔中的所述金属块接触的弯曲部分，使得所述弯曲部朝向所述第二导体弯曲，所述金属块在第一导体侧具有表面，使得所述表面具有具有弯曲表面的外周部分 并且所述孔在所述第一导体层侧具有第一配件入口，在所述第二导体侧具有第二配件入口，并且所述金属块被定位成与所述第二配件入口接触。

    All in one snow crystal-shaped LED module
    4.
    发明授权
    All in one snow crystal-shaped LED module 有权
    所有在一个雪晶体LED模组

    公开(公告)号：US08833972B2

    公开(公告)日：2014-09-16

    申请号：US13712914

    申请日：2012-12-12

    Applicant: Seong Gon Baik

    Inventor： Seong Gon Baik

    IPC: F21S4/00 ,  F21K99/00 ,  H05K1/02 ,  F21V21/00 ,  F21W121/00 ,  F21Y101/02

    CPC classification number: F21S4/00 ,  F21K9/90 ,  F21V21/00 ,  F21W2121/006 ,  F21Y2115/10 ,  H05K1/028 ,  H05K2201/052 ,  H05K2201/0909 ,  H05K2201/091 ,  H05K2201/10106

    Abstract: A straight middle LED module having a certain length and positioned at a middle portion; side LED modules which are provided at both sides of the middle LED module at a regular interval along a longitudinal direction; a middle connection portion at which the side LED modules and the middle LED module are connected and integrally formed in order for the side LED modules to be bent; and a horizontal connection portion to which a lower side of the middle LED module is connected at a regular interval along a horizontal direction, and the middle connection portion has grooves alternately formed at both sides and has a width narrower than the width of the side LED module.

    Abstract translation: 具有一定长度并位于中间部分的直的中间LED模块; 在所述中间LED模块的两侧设置有沿着长度方向的规定间隔的侧面LED模块; 侧面LED模块和中间LED模块连接并整体形成的中间连接部分，以使侧面LED模块弯曲; 以及水平连接部，中间LED模块的下侧沿水平方向以规定的间隔连接到中间连接部，并且中间连接部具有交替地形成在两侧的槽，并且宽度窄于侧面LED的宽度 模块。

    Method for making three-dimensional liquid crystal polymer multilayer circuit boards
    5.
    发明授权
    Method for making three-dimensional liquid crystal polymer multilayer circuit boards 有权
    制备三维液晶聚合物多层电路板的方法

    公开(公告)号：US08778124B2

    公开(公告)日：2014-07-15

    申请号：US12016060

    申请日：2008-01-17

    Applicant: Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Philip Anthony Marvin

    Inventor： Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Philip Anthony Marvin

    IPC: B32B37/00

    CPC classification number: H05K3/0014 ,  H01H2219/01 ,  H05K1/0284 ,  H05K1/185 ,  H05K3/4611 ,  H05K2201/0141 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302

    Abstract: A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.

    Abstract translation: 一种制造非平面三维（3D）多层电路板的方法。 该方法可以包括形成包括至少一对液晶聚合物（LCP）层的层叠布置，其间具有结合层。 所述堆叠布置还可包括至少一个LCP层上的至少一个导电图案层。 该方法还可以包括加热和施加压力到堆叠的布置以将堆叠布置形成非平面3D形状并且同时使结合层将堆叠布置的相邻LCP层结合在一起，从而形成非平面3D 多层电路板。

    Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component
    6.
    发明授权
    Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component 有权
    电子元件和有线电路板的连接结构，有线电路板组装，电子元器件测试方法

    公开(公告)号：US08618828B2

    公开(公告)日：2013-12-31

    申请号：US12926441

    申请日：2010-11-18

    Applicant: Tetsuya Ohsawa ,  Hitoki Kanagawa

    Inventor： Tetsuya Ohsawa ,  Hitoki Kanagawa

    IPC: G01R31/00

    CPC classification number: H05K3/326 ,  G11B5/455 ,  G11B5/486 ,  H05K1/056 ,  H05K1/118 ,  H05K3/305 ,  H05K3/4092 ,  H05K2201/091

    Abstract: In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected.

    Abstract translation: 在电子部件和布线电路基板的连接结构中，电子部件包括多个外部端子。 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层和形成在绝缘基底层上的导电图案。 导电图案包括用于与多个外部端子连接的多个端子部分。 电子部件和布线电路基板被配置为使得多个外部端子和多个端子部彼此面对。 弯曲布线电路板使得导电图案翘曲，并且通过翘曲的反作用力使端子部分和外部端子抵接，并且电子部件和布线电路板电连接。

    Patch panel assembly for use with data networks
    7.
    发明授权
    Patch panel assembly for use with data networks 有权
    用于数据网络的配线架组件

    公开(公告)号：US08562358B2

    公开(公告)日：2013-10-22

    申请号：US13123030

    申请日：2009-10-07

    Applicant: Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

    Inventor： Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

    IPC: H01R29/00

    CPC classification number: H04Q1/136 ,  H04L41/12 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

    Abstract: A patch panel (100) for use with infrastructure management systems that utilizes a plurality of cables interconnected to end-user devices and work area outlets, and integrated circuits to monitor the status of these end-user devices and outlets includes a pair of circuit boards. A plurality of connective jacks (31) are mounted on the first (36) of the two circuit boards, and are interconnected to other network devices. Wires from the jacks extend to and connect with network devices and the first circuit board has a plurality of first integrated circuits (45) mounted thereon which monitor the status of the network devices connected to the jacks. The second circuit board (49) is spaced apart from the first circuit board and it includes a plurality of second integrated circuits (52) that convey the status information obtained from the network work area outlets on the network to network devices, such as switches and scanners of the network (104).

    Abstract translation: 用于与利用与终端用户设备和工作区域出口相互连接的多条电缆的基础设施管理系统使用的接线板（100）以及用于监控这些终端用户设备和出口的状态的集成电路包括一对电路板 。 多个连接插座（31）安装在两个电路板的第一（36）上，并且互连到其他网络设备。 插座的电线延伸到网络设备并与其连接，并且第一电路板具有安装在其上的多个第一集成电路（45），其监测连接到插座的网络设备的状态。 第二电路板（49）与第一电路板间隔开，并且包括多个第二集成电路（52），其将从网络上的网络工作区域出口获得的状态信息传送到网络设备，诸如交换机和 网络扫描仪（104）。

    Method of manufacturing wiring board
    9.
    发明授权
    Method of manufacturing wiring board 有权
    制造布线板的方法

    公开(公告)号：US08522429B2

    公开(公告)日：2013-09-03

    申请号：US13187995

    申请日：2011-07-21

    Applicant: Michimasa Takahashi ,  Masakazu Aoyama

    Inventor： Michimasa Takahashi ,  Masakazu Aoyama

    IPC: H01K3/10

    CPC classification number: H05K3/4691 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/091 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536

    Abstract: A method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

    Abstract translation: 一种形成布线板的方法。 布线板包括第一基板和具有比第一基板的安装面积小的安装面积的第二基板。 基底衬底层压在第一衬底和第二衬底之间，使得第一衬底延伸超过第二衬底的边缘，以及形成在第一衬底或第二衬底中的至少一个衬底中的至少一个通孔。 夹在第一基板和第二基板之间的基底基板的一部分的厚度大于未被夹在第一基板和第二基板之间的基底部分的厚度。

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