公开(公告)号：US20240357739A1

公开(公告)日：2024-10-24

申请号：US18639407

申请日：2024-04-18

Applicant: TOPPAN Holdings Inc.

Inventor： Tomoyuki Ishii

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/0306 ,  H05K3/0017 ,  H05K3/4644 ,  H05K2201/0266 ,  H05K2201/0338 ,  H05K2201/09154 ,  H05K2203/0548 ,  H05K2203/1105

Abstract: A wiring board includes: a substrate; a first seed layer provided on the substrate; a first conductive layer provided on the first seed layer; a first insulating layer provided on the first conductive layer; a second seed layer provided on the first insulating layer; and a second conductive layer provided on the second seed layer. An area of the first insulating layer is smaller than an area of the first conductive layer. An area of the second conductive layer is smaller than the area of the first insulating layer. A region of the first insulating layer not overlapping the second conductive layer includes a first region surrounding the second conductive layer and a second region outside the first region. A surface roughness of the second region is larger than a surface roughness of the first region.

公开(公告)号：US12080637B2

公开(公告)日：2024-09-03

申请号：US17725627

申请日：2022-04-21

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Satoru Kuramochi ,  Sumio Koiwa ,  Hidenori Yoshioka

IPC: H01L23/498 ,  H01L23/48 ,  H01L25/065 ,  H01L25/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/44 ,  H01L23/00 ,  H01L23/13 ,  H01L23/15

CPC classification number: H01L23/49827 ,  H01L23/481 ,  H01L23/49894 ,  H01L25/065 ,  H01L25/18 ,  H05K1/115 ,  H05K3/28 ,  H05K3/445 ,  H01L23/13 ,  H01L23/15 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16165 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81805 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/381 ,  H05K2201/09154 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2203/0594 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2924/15787 ,  H01L2924/05432 ,  H01L2924/1579 ,  H01L2924/00014 ,  H01L2224/13109 ,  H01L2924/00014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/81805 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/2919 ,  H01L2924/07025

Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

公开(公告)号：US20230380062A1

公开(公告)日：2023-11-23

申请号：US17923624

申请日：2021-04-29

Applicant: CORNING INCORPORATED

Inventor： DHANANJAY JOSHI ,  CHUKWUDI AZUBUIKE OKORO ,  SCOTT CHRISTOPHER POLLARD

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/06 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/068 ,  H05K2201/09154 ,  H05K2201/0215 ,  H05K2201/09827 ,  H05K2201/09845

Abstract: A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.

公开(公告)号：US20180317321A1

公开(公告)日：2018-11-01

申请号：US15904577

申请日：2018-02-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kenichi MORI ,  Kazuyuki KUBOTA ,  Yoshihiro IHARA

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H01R12/72

CPC classification number: H05K1/144 ,  H01R12/721 ,  H01R12/725 ,  H01R12/728 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09409 ,  H05K2201/10522

Abstract: A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.

公开(公告)号：US09986635B2

公开(公告)日：2018-05-29

申请号：US15379778

申请日：2016-12-15

Applicant: Fujitsu Technology Solutions Intellectual Property GmbH

Inventor： Wilhelm Neukam

IPC: H05K1/02 ,  H05K5/02 ,  H05K1/03 ,  H05K7/14 ,  H05K3/20

CPC classification number: H05K1/0275 ,  H05K1/0284 ,  H05K1/03 ,  H05K3/20 ,  H05K5/0208 ,  H05K7/1427 ,  H05K2201/0388 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/09681

Abstract: An assembly includes a carrier and an electrically conductive mesh, wherein the carrier includes a side surface with an edge, the electrically conductive mesh is attached to the side surface and extends over the edge of the side surface, and the edge has a radius at least as big as a minimal bending radius of electric lines of the electrically conductive mesh.

公开(公告)号：US20180075871A1

公开(公告)日：2018-03-15

申请号：US15689695

申请日：2017-08-29

Applicant: NITTO DENKO CORPORATION

Inventor： Yuu SUGIMOTO ,  Hiroyuki TANABE

IPC: G11B5/48 ,  H05K1/05 ,  H05K1/11 ,  H05K3/40 ,  H05K3/06 ,  H05K3/00

CPC classification number: G11B5/4853 ,  G11B5/3163 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/119 ,  H05K1/184 ,  H05K3/0023 ,  H05K3/0041 ,  H05K3/06 ,  H05K3/3405 ,  H05K3/4015 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/10106

Abstract: A suspension board with circuit having an opening with an electronic element inserted therein includes an insulating layer disposed at the edge of the opening, a first terminal disposed at one surface of the insulating layer and connected to a magnetic head, and a second terminal disposed at the other surface thereof and connected to the electronic element. The insulating layer includes a first portion in which the first terminal is disposed and a second portion that extends from the first portion toward the opening and is overlapped with a slider. The second portion is thinner than the first portion and is overlapped with the second terminal. The slider has a first surface facing the second portion. The first surface is disposed between the first terminal and the second terminal.

公开(公告)号：US20180024676A1

公开(公告)日：2018-01-25

申请号：US15547796

申请日：2015-03-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Cameron Hutchings ,  Stewart R. Wyatt ,  Scott David Hahn

IPC: G06F3/041 ,  H05K1/02 ,  G06F3/042

CPC classification number: G06F3/0412 ,  G06F3/041 ,  G06F3/0421 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K2201/09036 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: According to an example, a device may comprise a touchscreen light guide assembly, a lens disposed on the touchscreen light guide assembly, and a printed circuit board including a relief cut on an edge of the printed circuit board. The relief cut may be to receive the touchscreen light guide assembly and to allow the lens to extend into the printed circuit board relief cut.

公开(公告)号：US20170343204A1

公开(公告)日：2017-11-30

申请号：US15681989

申请日：2017-08-21

Applicant: Molex, LLC

Inventor： Yi-Tse HO

IPC: F21V29/83 ,  F21K9/232 ,  H05K3/18 ,  F21V29/77 ,  H05K1/02 ,  F21V19/00 ,  F21Y2107/40 ,  H05K3/38 ,  H05K3/10 ,  H05K3/00 ,  F21V3/00 ,  F21Y2115/10

CPC classification number: F21V29/83 ,  F21K9/232 ,  F21V3/00 ,  F21V19/0055 ,  F21V29/77 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09154 ,  H05K2201/09645 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10287 ,  H05K2201/10409 ,  H05K2203/107

Abstract: An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.

公开(公告)号：US09821787B2

公开(公告)日：2017-11-21

申请号：US14632574

申请日：2015-02-26

Applicant: NISSIN KOGYO CO., LTD.

Inventor： Sakae Miyasaka

IPC: H05K7/10 ,  B60T15/02 ,  H05K3/40 ,  H05K3/32

CPC classification number: B60T15/028 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/09154 ,  H05K2201/09381 ,  H05K2201/10151 ,  H05K2203/048

Abstract: One embodiment provides a circuit board having a substrate and an electrode portion which is provided on the substrate. The electrode portion includes: a quadrangular land which is provided on a front surface of the substrate; a solder layer which is laminated on the whole of a front surface of the land; and a pad which is joined to a front surface of the solder layer. When the electrode portion is seen from thereabove, an outer circumferential line of the pad touches each of four sides of the land. Exposed portions where the solder layer is exposed are formed individually at four corners of a front surface of the electrode portion. And, the exposed portions are formed to have the same shape.

公开(公告)号：US09627739B2

公开(公告)日：2017-04-18

申请号：US13526817

申请日：2012-06-19

Applicant: Theodore Timaru

Inventor： Theodore Timaru

IPC: H05K5/00 ,  H01P5/02 ,  H05K1/14 ,  H05K1/02

CPC classification number: H01P5/028 ,  H05K1/0239 ,  H05K1/142 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09845

Abstract: The system includes a first printed circuit board including a first transmission line, the first circuit board may be attached to a chassis and a second printed circuit board including a second transmission line, the second circuit board may be attached to the chassis and/or the first printed circuit board and the second transmission line configured to electrically couple power from the first transmission line.