公开(公告)号：US20240357746A1

公开(公告)日：2024-10-24

申请号：US18326031

申请日：2023-05-31

Applicant: INNODISK CORPORATION

Inventor： CHIH-CHIEH KAO

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10628

Abstract: A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.

公开(公告)号：US12046534B2

公开(公告)日：2024-07-23

申请号：US17653633

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Simon J. Trivett ,  Brett W. Degner ,  Mahesh S. Hardikar ,  Michael E. Leclerc ,  Eric R. Prather ,  Kevin J. Ryan

IPC: H01L23/40 ,  G06F1/20 ,  H05K1/02 ,  H05K7/20

CPC classification number: H01L23/4093 ,  G06F1/206 ,  H05K1/0203 ,  H05K7/2039 ,  H05K2201/10515

Abstract: This application relates to modifications and enhancements to assemblies used with integrated circuits. In the described embodiments, multiple thermal components (e.g., vapor chambers, fin stacks, heat pipes) can be used to provide a dual-sided thermal energy extraction solution for a circuit board and an integrated circuit located on the circuit board. The thermal components can provide thermal energy dissipation capabilities for additional heat-generating components on the circuit board. Additionally, multiple plates can provide a compression force used to maintain contact between the integrated circuit and the circuit board, and in particular, between contact pads of the integrated circuit and pins, or springs, of a socket located on the circuit board.

公开(公告)号：US20240147624A1

公开(公告)日：2024-05-02

申请号：US18498080

申请日：2023-10-31

Applicant: CANON KABUSHIKI KAISHA

Inventor： NORITAKE TSUBOI

IPC: H05K1/18 ,  H01L25/16 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L25/16 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3485 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/0465

Abstract: An electronic module includes a first wiring component, a first electronic component, a first bonding member, and a second bonding member. The first wiring component includes a first pad, a second pad, and a first insulating member. The first pad, the second pad, and the first insulating member are formed in a first mounting surface. The first electronic component includes a first electrode and a second electrode and is surface-mounted on the first mounting surface. The first bonding member is configured to bond the first pad and the first electrode together. The second bonding member is configured to bond the second pad and the second electrode together. The first electrode and the second electrode are positioned on an insulating area of the first mounting surface. A distance between the first electrode and the first insulating member is smaller than a distance between the first electrode and the first pad.

公开(公告)号：US11950366B2

公开(公告)日：2024-04-02

申请号：US17635968

申请日：2020-09-03

Applicant: TDK CORPORATION

Inventor： Kazuhiro Hagita ,  Yoshiaki Ishikawa ,  Masaharu Moritsugu

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/112 ,  H05K2201/10515

Abstract: An electronic component mounting structure is an electronic component mounting structure in which an electronic component group is mounted on a substrate, and a pattern constituting a part of a current path between the inflow port and the outflow port, the electronic component group includes a plurality of electronic components connected between the inflow port and the outflow port, each of the electronic components has a current inflow terminal electrically connected to the inflow port and a current outflow terminal electrically connected to the outflow port, and one of a first spatial distance group and a second spatial distance group has equal spatial distances within the one spatial distance group, and the first spatial distance group includes spatial distances between the inflow port and the inflow terminals, and the second spatial distance group includes spatial distances between the outflow port and the outflow terminals.

公开(公告)号：US20240090131A1

公开(公告)日：2024-03-14

申请号：US17944333

申请日：2022-09-14

Applicant: Hamilton Sundstrand Corporation

Inventor： Alexander Trotman ,  Judy Schwartz

IPC: H05K1/18 ,  H01L23/31 ,  H01L23/34 ,  H01L23/367 ,  H05K3/32

CPC classification number: H05K1/18 ,  H01L23/3121 ,  H01L23/34 ,  H01L23/367 ,  H05K3/32 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10946 ,  H05K2203/049

Abstract: A method of forming a circuit board assembly includes receiving a flat no-lead package. The package includes: a housing having a first side and second side; a circuit disposed within the housing; and an exposed thermal belly pad that is thermally coupled to the circuit and passes at least partially through the first side such that it can be exposed to an environment outside of the housing. The method also includes attaching the second side of the flat no-lead package to a first side of a printed circuit board (PCB) such that the exposed thermal belly pad is opposite the first side of the PCB.

公开(公告)号：US11844178B2

公开(公告)日：2023-12-12

申请号：US17325080

申请日：2021-05-19

Applicant: ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY

Inventor： John David Brazzle ,  Sok Mun Chew

IPC: H05K1/18 ,  H01F27/29 ,  H01L23/31 ,  H01L25/16 ,  H05K3/34 ,  H01L23/495

CPC classification number: H05K1/181 ,  H01F27/29 ,  H01L23/3121 ,  H01L25/167 ,  H05K3/3447 ,  H01L23/49575 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10901

Abstract: An electronic device and a method of forming such an electronic device are disclosed. The electronic device can include an integrated device package and a component. The integrated device package includes a substrate and a package body over the substrate, and a hole formed through the package body to expose a conductive pad of the substrate. The component is mounted over the package body, and includes a component body and a lead extending from the component body through the hole. The lead includes an insulated portion and a distal exposed portion, and the insulated portion includes a conductor and an insulating layer disposed about the conductor, wherein the distal exposed portion is uncovered by the insulating layer such that the conductor is exposed at the distal portion. The electronic device can also include a conductive material that electrically connects the distal exposed portion to the conductive pad of the substrate.

公开(公告)号：US20230389182A1

公开(公告)日：2023-11-30

申请号：US17752634

申请日：2022-05-24

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Warren A. Kartadinata ,  Neil Jefferson Asmussen ,  Vance B. Murakami

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/10265 ,  H05K2201/10537 ,  H05K2201/10515 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10393

Abstract: One aspect provides an apparatus for locking circuit boards in position between a pair of guide rails. The apparatus can include a slider attached to a sidewall of one guide rail. The slider is allowed to slide along the guide rail within a predetermined range and one or more plunger-and-spring assemblies. A respective plunger-and-spring assembly comprises a plunger and a spring surrounding the plunger, and the plunger is inserted into a through-hole on the sidewall of the guide rail such that a first end of the plunger can be aligned with a notch on a corresponding circuit board and a second end of the plunger is in contact with the slider. Sliding of the slider causes the spring to compress and decompress and the first end of the plunger to move in and out of the notch on the circuit board, thereby facilitating locking and unlocking of the circuit board.

公开(公告)号：US20230309233A1

公开(公告)日：2023-09-28

申请号：US17842709

申请日：2022-06-16

Applicant: Kioxia Corporation

Inventor： Satoru FUKUCHI

IPC: H05K1/18 ,  H01L23/498 ,  H01L25/16 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01L23/49827 ,  H01L25/16 ,  H01L25/162 ,  H01L23/49838 ,  H05K1/113 ,  H05K2201/10378 ,  H05K2201/10174 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/09518 ,  H05K2201/09481 ,  H05K2201/10734

Abstract: An electronic device according to an embodiment includes first and second substrates, first and second conductors, and an electronic component. The first substrate includes a first connector portion, first pad portions, and a first transmission line. The first pad portions include a second pad portion, the first transmission line coupling the second pad portion and the first connector portion. The second substrate includes third pad portions. The third pad portions include a fourth pad portion and a fifth pad portion. The first conductor is coupled to the fourth pad portion and to the second pad portion. The second conductor is coupled to the fifth pad portion. The first electronic component has one end coupled to the first conductor and other end coupled to the second conductor.

公开(公告)号：US11728555B2

公开(公告)日：2023-08-15

申请号：US17461539

申请日：2021-08-30

Applicant: Micron Technology, Inc.

Inventor： Yoshihito Koya

IPC: G06F3/12 ,  H01P3/12 ,  H01P1/24 ,  H05K1/18 ,  H05K1/02 ,  G06F13/16 ,  G06F13/40 ,  H01P5/08

CPC classification number: H01P3/12 ,  G06F13/1668 ,  G06F13/4068 ,  H01P1/24 ,  H05K1/0243 ,  H05K1/181 ,  H01P5/085 ,  H05K2201/10159 ,  H05K2201/10257 ,  H05K2201/10515 ,  H05K2201/10522

Abstract: Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.

公开(公告)号：US11721608B2

公开(公告)日：2023-08-08

申请号：US17165253

申请日：2021-02-02

Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.

Inventor： Shailesh N. Joshi ,  Ercan Mehmet Dede

IPC: H01L23/427 ,  H05K1/18 ,  H01L23/46 ,  H01L23/36 ,  H01L23/367 ,  H01L23/473

CPC classification number: H01L23/427 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/46 ,  H01L23/473 ,  H05K1/183 ,  H05K2201/1056 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10515

Abstract: A power electronics assembly includes a vapor chamber and a heat-generating device. The vapor chamber includes a housing defining an evaporator side and a condenser side and a pedestal integrally formed with an extending from the evaporator side, the pedestal comprising a non-rectangular shape corresponding to a thermal management objective. The heat-generating device is coupled to the pedestal.