公开(公告)号：US06861290B1

公开(公告)日：2005-03-01

申请号：US09699537

申请日：2000-10-30

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H01L21/44

CPC classification number: H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.

公开(公告)号：US20040214468A1

公开(公告)日：2004-10-28

申请号：US10819279

申请日：2004-04-07

Inventor： Rwei Ching Chang ,  Ching-Liang Tu

IPC: H05K001/00

CPC classification number: H05K1/141 ,  H01R12/585 ,  H01R43/0256 ,  H05K3/308 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: An electrical connector which includes a seat integrally made of plastic and formed with a plurality of through holes, a plurality of metal terminals each fitted in a respective one of the through holes of the seat and provided with a tail, and a base board used as a conductive medium between an electrical connector and a printed circuit board to provide a closed circuit, wherein the base board has an upper surface in contact with the electrical connector, a lower surface in contact with the printed circuit board, and a plurality of conductive members arranged between the upper and lower surfaces, whereby the possibility of unstable connection between the terminal and the solder ball can be eliminated.

Abstract translation: 一种电连接器，包括由塑料一体制成并形成有多个通孔的座，多个金属端子，每个金属端子安装在座椅的相应一个通孔中并具有尾部，以及基板，其用作 在电连接器和印刷电路板之间的导电介质以提供闭合电路，其中所述基板具有与所述电连接器接触的上表面，与所述印刷电路板接触的下表面，以及多个导电构件 布置在上表面和下表面之间，由此可以消除端子和焊球之间不稳定的连接的可能性。

公开(公告)号：US06796807B2

公开(公告)日：2004-09-28

申请号：US10431915

申请日：2003-05-07

Applicant: Richard A. Olzak ,  Tehmosp Khan

Inventor： Richard A. Olzak ,  Tehmosp Khan

IPC: H01R1200

CPC classification number: H05K1/141 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09418 ,  H05K2201/096 ,  H05K2201/09954 ,  H05K2201/10075 ,  H05K2201/10689

Abstract: An electrical adapter formed of a printed wiring board having opposing primary and secondary sides and at least one printed circuit having a plurality of solder pads arranged to interconnect with input/output signal pins of a surface mount technology (SMT) device and a plurality of plated vias arranged to interconnect with input/output signal pins of one or more discrete electrical components; one or more plated through holes extending between the primary and secondary sides of the board and electrically coupled to the printed circuit, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and a plurality of input/output signal interconnect pins mechanically and electrically coupled to the plated holes and extending a distance beyond the secondary side of the board.

Abstract translation: 由具有相对的一次侧和次侧的印刷线路板形成的电适配器和至少一个印刷电路，所述印刷电路具有布置成与表面贴装技术（SMT）器件的输入/输出信号引脚相互连接的多个焊盘，以及多个电镀 布置成与一个或多个分立电气部件的输入/输出信号引脚互连的通孔; 一个或多个电镀通孔，其延伸在所述基板的所述主侧和次侧之间并且电耦合到所述印刷电路，所述电镀通孔以构造成与母电路板中的电镀通孔匹配的图案定位; 以及多个输入/输出信号互连引脚，其机械地和电耦合到所述电镀孔并且延伸超过所述板的次级侧的距离。

公开(公告)号：US20040170006A9

公开(公告)日：2004-09-02

申请号：US10199926

申请日：2002-07-19

Inventor： Mark F. Sylvester ,  David A. Hanson ,  William G. Petefish

IPC: H05K007/02

CPC classification number: H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/66 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/113 ,  H05K1/141 ,  H05K1/162 ,  H05K3/0035 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09672 ,  H05K2201/09718 ,  H05K2201/10734 ,  H05K2203/1383 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/81205

Abstract: An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.

Abstract translation: 用于集成电路芯片的互连模块结合了薄的高介电常数嵌入式电容器结构，以提供降低的功率分布阻抗，从而促进更高频率的操作。 互连模块能够通过焊球连接将集成电路芯片可靠地附接到印刷线路板，同时在超过1.0千兆赫的工作频率下提供小于或等于约0.60欧姆的降低的功率分布阻抗。

公开(公告)号：US06778405B2

公开(公告)日：2004-08-17

申请号：US09964151

申请日：2001-09-25

Applicant: Jeffrey Boylan ,  Carl Milton Wildrick ,  Gordon K. Y. Lee

Inventor： Jeffrey Boylan ,  Carl Milton Wildrick ,  Gordon K. Y. Lee

IPC: H05K706

CPC classification number: H05K1/141 ,  H05K1/0295 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09954

Abstract: The adapter couples a power module to a circuit board. An adapter embodying the present invention can be configured to allow the connection of any power module regardless of pin out to any circuit board. Signal modifying circuitry can also be added to the adapter to enhance or simply modify the signal to the end user's circuit board. The modifying circuitry can act on either the input to the adapter or the output from the adapter. At least one conductive path couples the input interconnects and the output interconnects.

Abstract translation: 适配器将电源模块连接到电路板。 体现本发明的适配器可以被配置为允许任何电源模块的连接，而不管引脚到任何电路板。 信号修改电路也可以添加到适配器，以增强或简单地将信号修改到终端用户的电路板。 修改电路可以作用于适配器的输入或适配器的输出。 至少一个导电路径耦合输入互连和输出互连。

公开(公告)号：US06777798B2

公开(公告)日：2004-08-17

申请号：US10377639

申请日：2003-03-04

Applicant: Takakazu Fukumoto ,  Muneharu Tokunaga ,  Tetsuya Matsuura

Inventor： Takakazu Fukumoto ,  Muneharu Tokunaga ,  Tetsuya Matsuura

IPC: H01L2302

CPC classification number: H05K1/144 ,  H01L25/105 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/1627 ,  H05K1/141 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3421 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A stacked semiconductor device structure comprising: a plurality of semiconductor modules each of which includes a substrate and at least one semiconductor device mounted on the substrate; a stacking device for stacking the semiconductor modules on one another; and a surface mount device for surface mounting on a further substrate for a system appliance the semiconductor modules stacked on one another by the stacking device.

Abstract translation: 一种叠层半导体器件结构，包括：多个半导体模块，每个半导体模块包括衬底和安装在所述衬底上的至少一个半导体器件; 堆叠装置，用于将半导体模块彼此堆叠; 以及表面安装装置，用于表面安装在用于系统设备的另一基板上，用于通过堆叠装置彼此堆叠的半导体模块。

公开(公告)号：US20040118603A1

公开(公告)日：2004-06-24

申请号：US10323221

申请日：2002-12-18

Inventor： Douglas C. Chambers

IPC: H05K001/11

CPC classification number: G06F13/1689 ,  G01R1/0735 ,  G11C7/1006 ,  H01L2224/16225 ,  H04L7/0037 ,  H05K1/0268 ,  H05K1/141 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/049 ,  H05K2201/10734 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A flexible circuit interposer includes a flexible circuit substrate which allows in-situ probing of an attached device during, for example, circuit debugging, assembly qualification, and the like. In accordance with one embodiment, a first set of pads (for example, bond pads configured to interface with solder balls) are configured in a predetermined pattern on the bottom surface of a flexible substrate. Similarly, a second set of pads are configured in substantially the same pattern on the top surface of the flexible substrate, wherein each of the pads in the second set of pads is electrically continuous with a corresponding pad in the first set of pads. A third set of pads are configured in the same pad pattern on the top surface of the flexible substrate. One or more conductive traces are formed to connect one or more pads in the first set of pads with spatially-corresponding pads in the third set of pads. A fourth set of pads corresponding to the third set of pads may also be provided on the bottom surface of the flexible substrate.

Abstract translation: 柔性电路插入器包括柔性电路基板，其允许在例如电路调试，组装鉴定等期间原位探测附接的装置。 根据一个实施例，在柔性基板的底表面上以预定图案配置第一组焊盘（例如，被配置为与焊球接合的焊盘）。 类似地，第二组焊盘在柔性基板的顶表面上以基本上相同的图案配置，其中第二组焊盘中的每个焊盘与第一组焊盘中的对应的焊盘电连接。 第三组焊盘在柔性基板的顶表面上以相同的焊盘图案配置。 形成一个或多个导电迹线以将第一组焊盘中的一个或多个焊盘与第三组焊盘中的空间对应焊盘连接。 对应于第三组焊盘的第四组焊盘也可以设置在柔性基板的底表面上。

公开(公告)号：US20040104466A1

公开(公告)日：2004-06-03

申请号：US10720623

申请日：2003-11-24

Inventor： Joseph P. Miller ,  Sompong P. Olarig ,  Donald J. Stoddard

IPC: H01L021/44 ,  H01L023/52

CPC classification number: H05K1/023 ,  H05K1/0246 ,  H05K1/141 ,  H05K1/185 ,  H05K2201/049 ,  H05K2201/10022 ,  H05K2201/10734

Abstract: In a computer system two integrated circuit devices are operatively mounted on the main system board using a pair of interstitial circuit boards sandwiched between the integrated circuit devices and the system board and having substantially smaller footprints than the system board. Each interstitial board has a series of terminating components, representatively resistors, interposed in its circuitry which interconnects the associated integrated circuit board with system board circuitry that, in turn, operatively couples the two integrated circuit boards. The incorporation of the terminating components in the interstitial boards instead of in the system board reduces the circuit complexity of the system board and the required number of layers therein, thereby reducing the cost of the system board and substantially simplifying its signal trace routing design.

公开(公告)号：US06719574B2

公开(公告)日：2004-04-13

申请号：US10148649

申请日：2002-10-07

Applicant: Joachim Grek

Inventor： Joachim Grek

IPC: H01R909

CPC classification number: H05K1/147 ,  H01R12/716 ,  H05K1/0284 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/09045 ,  H05K2201/10189

Abstract: An angled connector and a method for mounting the same, having first connector means (20) extended in a first direction and second connector means (29a-c) extended in a angled direction in relation to the first connector means (20). According to the invention the slanted connector comprises a first part (2) comprising the first connector means (20) and a second part (21a-e) comprising the second connector means (29a-c) The second part (21a-e) is connectable to the first connector means (20) and has a bent form in order to engage the first connector means (20) in a first direction and provide the second connector means (29a-c) protruding in at least one second direction angled to the first direction, the second part (21a-e) having a circuit pattern to connect the first connector means (20) to the second connector means (29a-c).

Abstract translation: 一种成角度的连接器及其安装方法，具有沿第一方向延伸的第一连接器装置（20）和相对于第一连接器装置（20）以成角度​​的方向延伸的第二连接器装置（29a-c）。 根据本发明，倾斜连接器包括包括第一连接器装置（20）的第一部分（2）和包括第二连接器装置（29a-c）的第二部分（21a-e）。第二部分（21a-e） 可连接到第一连接器装置（20）并且具有弯曲形式，以便在第一方向上接合第一连接器装置（20）并且提供第二连接器装置（29a-c），其以至少一个第二方向突出， 第二部分（21a-e）具有将第一连接器装置（20）连接到第二连接器装置（29a-c）的电路图案。

公开(公告)号：US20040016114A1

公开(公告)日：2004-01-29

申请号：US10202726

申请日：2002-07-25

Applicant: International Business Machines Corporation

Inventor： Michael F. McAllister ,  John G. Torok

IPC: H05K003/20 ,  H05K001/00

CPC classification number: H05K1/141 ,  H05K1/0286 ,  H05K1/162 ,  H05K3/325 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/10348 ,  H05K2201/10666 ,  H05K2201/10719 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.