公开(公告)号：US20060117332A1

公开(公告)日：2006-06-01

申请号：US11191939

申请日：2005-07-29

Applicant: Manabu Ochi ,  Yukinari Ueki ,  Yoshitaka Kusano ,  Hiroyasu Yoshida ,  Fumihito Ichikawa

Inventor： Manabu Ochi ,  Yukinari Ueki ,  Yoshitaka Kusano ,  Hiroyasu Yoshida ,  Fumihito Ichikawa

IPC: G11B7/08 ,  G11B7/085 ,  G11B7/09

CPC classification number: H05K1/0209 ,  G11B7/0935 ,  G11B7/12 ,  H05K1/0206 ,  H05K1/189 ,  H05K2201/055 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/10969

Abstract: Provided is a reliable optical pick-up which can prevent deterioration of a performance of a component, shortening of a service life or malfunctioning due to heat generation of an laser driver IC, wherein a metallic pattern is provided on a flexible printed board, having an area wider than the external shape of the laser driver IC and having an exposed outer surface, and made of the same material as that of a wiring pattern. It is preferable to bent the flexible printed board in a mounting part for the laser driver IC so that the metallic pattern is faced to and superposed with a surface of the flexible printed board on the side remote from the surface on which the laser driver IC is mounted.

Abstract translation: 提供了一种可靠的光学拾取器，其可以防止部件性能的劣化，使用寿命缩短或者由于激光驱动器IC的发热引起的故障，其中金属图案设置在柔性印刷电路板上，具有 区域比激光驱动IC的外形宽，外露面外露，并且由与布线图案相同的材料制成。 优选地，将柔性印刷电路板弯曲在用于激光驱动IC的安装部分中，使得金属图案面对并与柔性印刷电路板的远离激光驱动器IC的表面的一侧的表面重叠 安装。

公开(公告)号：US06972371B2

公开(公告)日：2005-12-06

申请号：US10648351

申请日：2003-08-27

Applicant: Sean Kelly Summers

Inventor： Sean Kelly Summers

IPC: H05K1/14 ,  H05K3/28 ,  H05K5/06 ,  H05K7/06

CPC classification number: H05K5/065 ,  H05K1/14 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/055 ,  H05K2203/0191 ,  H05K2203/1316

Abstract: An electronic component includes a circuit board assembly having a thin polymer sheet having no electronic function located within the assembly, the circuit board assembly and the thin polymer sheet encapsulated in a potting material. A method of preventing damage to circuit boards in an electronic component encapsulated in potting material due to cracks in the potting material includes a) providing plural circuit boards for assembly into the component; b) during assembly, inserting a thin polymer film at least between adjacent ones of the plural circuit boards, said polymer film having no electronic function; c) completing the assembly of the component; and d) encapsulating the component in a potting material.

公开(公告)号：US20050229196A1

公开(公告)日：2005-10-13

申请号：US11100920

申请日：2005-04-07

Applicant: Hajime Iizuka ,  Yasuhito Kojima ,  Koichi Takezawa

Inventor： Hajime Iizuka ,  Yasuhito Kojima ,  Koichi Takezawa

IPC: G11B7/12 ,  G11B7/00 ,  G11B7/085 ,  G11B7/09 ,  H05K1/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: G11B7/12 ,  G11B7/08582 ,  G11B2007/0006 ,  H05K1/0218 ,  H05K1/189 ,  H05K2201/055

Abstract: A pickup device comprises a flexible circuit member including a main circuit portion on which electric or electronic components are mounted and a sub-circuit portion connected to the main circuit portion. The pickup device further comprises a housing on which the flexible circuit member is mounted. Each of the main circuit portion and the sub-circuit portion has a single-sided structure and includes a ground portion. The sub-circuit portion is folded with respect to the main circuit portion. The flexible circuit member is mounted on the housing while the main circuit portion and the sub-circuit portion are held in an overlapping arrangement. With this arrangement, S/N ratio of electric signals can be improved while achieving cost reduction.

Abstract translation: 拾取装置包括柔性电路构件，该柔性电路构件包括安装有电子或电子部件的主电路部分和连接到主电路部分的子电路部分。 拾取装置还包括其上安装有柔性电路构件的壳体。 主电路部分和子电路部分中的每一个具有单面结构并且包括接地部分。 副电路部分相对于主电路部折叠。 柔性电路部件安装在壳体上，而主电路部分和副电路部分保持重叠的布置。 通过这种布置，可以提高电信号的S / N比，同时实现成本降低。

公开(公告)号：US20050077078A1

公开(公告)日：2005-04-14

申请号：US10683106

申请日：2003-10-08

Applicant: Benjamin Holmes ,  Randall Chambers

Inventor： Benjamin Holmes ,  Randall Chambers

IPC: H05K1/00 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K2201/055 ,  H05K2201/09081 ,  H05K2201/09781

Abstract: A flexible circuit having improved tear resistance is provided. A flexible circuit, made of polyimide film, includes at least one extension which needs to be folded. To prevent tearing, an annular piece of metal, like an exposed copper pad for example, is placed at the apex of the bend angle. A second metal is then deposited atop the annular piece of metal, thereby reinforcing the annular piece of metal. The reinforced annular piece of metal helps to prevent the flexible circuit from tearing when shearing forces are applied to the extension. Experimental results have shown that the invention provides as much as a 285% increase in tear resistance when compared to prior art flexible circuits.

Abstract translation: 提供了具有改进的抗撕裂性的柔性电路。 由聚酰亚胺膜制成的柔性电路包括至少一个需要折叠的延伸部分。 为了防止撕裂，例如像暴露的铜垫的环形金属片放置在弯曲角度的顶点处。 然后将第二金属沉积在环形金属片上方，从而加强环形金属片。 加强的环形金属片有助于防止当剪切力施加到延伸部时柔性电路撕裂。 实验结果表明，与现有技术的柔性电路相比，本发明提供了高达285％的抗撕裂性能。

公开(公告)号：US20040130500A1

公开(公告)日：2004-07-08

申请号：US10695438

申请日：2003-10-28

Inventor： Yoshiki Takei

IPC: H01Q001/36

CPC classification number: H01Q1/22 ,  G06K19/07728 ,  G06K19/07749 ,  G06K19/0775 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/118 ,  H05K3/4685 ,  H05K2201/055 ,  H05K2201/09081

Abstract: A loop antenna is formed on one side of a circuit board and an IC chip is mounted on the same side of the circuit board. An inner end of the loop antenna is connected to an antenna connection terminal of the IC chip. An arm part provided with a first pad part, a second pad part, and a conducting wire for allowing conduction between the fist pad part and the second pad part is collapsibly provided in such a manner that, when the arm part is collapsed, an outer end of the loop antenna contacts the first pad part and an antenna connection terminal of the IC chip contacts the second pad part.

Abstract translation: 环形天线形成在电路板的一侧，IC芯片安装在电路板的同一侧。 环形天线的内端连接到IC芯片的天线连接端子。 设置有第一焊盘部分，第二焊盘部分和用于允许第一焊盘部分和第二焊盘部分之间的传导的臂部分以这样的方式可折叠地设置，使得当臂部被折叠时，外部 环形天线的端部接触第一焊盘部分，并且IC芯片的天线连接端子接触第二焊盘部分。

公开(公告)号：US20030095389A1

公开(公告)日：2003-05-22

申请号：US10242377

申请日：2002-09-12

Inventor： Sanjiv Singh Samant ,  Jinesh Jitendra Jain ,  Joseph Laughter

IPC: H05K001/00

CPC classification number: H05K1/118 ,  H01J47/001 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/055 ,  H05K2201/2009 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: An easier and cheaper way to obtain multilayer circuit board is by using a flexible circuit board and folding it in an organized pattern. Flexible circuit has the unique property of being a three-dimensional circuit that can be shaped in multiplanar configurations, rigidized in specific areas, and molded to backer boards for specific applications. The folded circuit is fabricated from a series of foldable circuit board strips and rigid circuit board strips which are interconnected, folded, and bonded into a composite structure. The foldable strips may have prefolds arranged so that a group of upper foldable strips and lower foldable strips are folded in opposite directions. A plurality of intermediate portions are stacked on each other by the folding the foldable strips in opposite directions. The folded circuit, can be bonded after a first fold, or folded further to achieve a greater reduction in area and subsequently be bonded as a composite multilayer structure.

Abstract translation: 获得多层电路板的一个更简单和更便宜的方法是使用柔性电路板并以有组织的方式折叠。 柔性电路具有独特的性能，可以是三维电路，可以在多平面配置中成形，在特定区域中进行刚性化，并模制成用于特定应用的背板。 折叠电路由一系列可折叠的电路板条和刚性电路板条制成，这些条带互连，折叠并结合成复合结构。 可折叠带可以具有折叠布置，使得一组上折叠条和下可折叠条在相反方向折叠。 通过在相反的方向上折叠可折叠条，多个中间部分彼此堆叠。 折叠电路可以在第一折叠之后被接合，或者进一步折叠以实现更大的面积减小，并且随后作为复合多层结构粘合。

公开(公告)号：US20030045177A1

公开(公告)日：2003-03-06

申请号：US10234542

申请日：2002-09-03

Inventor： Yo Kamei ,  Naotaka Sekita

IPC: H01R013/514

CPC classification number: G11B33/122 ,  G11B17/056 ,  H05K1/0281 ,  H05K2201/055 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/2009

Abstract: A flexible wiring plate includes a first wiring plate connected to a connector of a member of a fixed side (chassis), a second wiring plate connected to a connector of a member of a movable side (slide), and a third wiring plate connecting the first wiring plate to the second wiring plate, wherein an extended direction of the first wiring plate is parallel to the second wiring plate, the second wiring plate is curved so as to be able to bend in an opposite direction to the extended direction of the first wiring plate when the flexible wiring plate is provided, and a reinforcement part having an increased width is formed at a facing part of the second wiring plate that faces a gap formed between the member of the fixed side and the member of the movable side.

Abstract translation: 柔性布线板包括连接到固定侧（底盘）的构件的连接器的第一布线板，连接到可移动侧（滑动件）的构件的连接器的第二布线板和连接到可移动侧 第一布线板到第二布线板，其中第一布线板的延伸方向平行于第二布线板，第二布线板弯曲成能够沿与第一布线板的延伸方向相反的方向弯曲 在设置柔性布线板的布线板上形成有宽度增大的加强部，该第二布线板的面对形成在固定侧的构件与可动侧的构件之间的间隙的面对部。

公开(公告)号：US20020047978A1

公开(公告)日：2002-04-25

申请号：US09932026

申请日：2001-08-20

Inventor： Kazuhiko Fukuta ,  Tomohiko Iwane ,  Masahiko Monzen

IPC: G02F001/1333

CPC classification number: G02F1/13452 ,  G02B6/0073 ,  G02B6/0083 ,  G02F1/133615 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H05K3/361 ,  H05K2201/055 ,  H05K2201/10681 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A semiconductor device of the present invention includes a film-like flexible substrate having formed thereon a wiring pattern, external connection terminals formed at both end portions of the flexible substrate; and a semiconductor element mounted on a surface side of the flexible substrate, wherein a folded part, which is folded down in U-shape to a back surface side of the flexible substrate, is formed in a fixed state at least at one end portion of the flexible substrate. With this structure, the semiconductor device is COF mounted, and, for example, in its application to a liquid crystal module wherein the semiconductor device is provided so as to face a liquid crystal panel, the external connection terminals of the flexible substrate can be connected to an inner surface of a module main body for a liquid crystal panel in a state the semiconductor element of the semiconductor device faces the inside of the module main body. As a result, since the semiconductor element can be mounted without being projected to the outside of the module main body, the liquid crystal module can be made thinner for the thickness of the semiconductor element.

Abstract translation: 本发明的半导体器件包括其上形成有布线图案的膜状柔性基板，形成在柔性基板的两端部的外部连接端子; 以及安装在柔性基板的表面侧的半导体元件，其中，以柔性基板的背面侧U形折叠的折叠部分至少在一个端部的 柔性基板。 利用这种结构，半导体器件被安装在COF上，并且例如在其应用于其中半导体器件被设置为面对液晶面板的液晶模块中，柔性基板的外部连接端子可以被连接 在半导体器件的半导体元件面向模块主体的内部的状态下，到达用于液晶面板的模块主体的内表面。 结果，由于半导体元件可以安装而不会突出到模块主体的外部，所以可以使半导体元件的厚度更薄化液晶模块。

公开(公告)号：US06239485B1

公开(公告)日：2001-05-29

申请号：US09315785

申请日：1999-05-20

Applicant: Michael G. Peters ,  Wen-chou Vincent Wang ,  Yasuhito Takahashi ,  William Chou ,  Michael G. Lee ,  Solomon Beilin

Inventor： Michael G. Peters ,  Wen-chou Vincent Wang ,  Yasuhito Takahashi ,  William Chou ,  Michael G. Lee ,  Solomon Beilin

IPC: H01L2312

CPC classification number: H05K1/0219 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/144 ,  H05K3/20 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/10378 ,  H01L2924/00

Abstract: An interposer for providing power, ground, and signal connections between an integrated circuit chip or chips and a substrate. The inventive interposer includes a signal core and external power/ground connection wrap. The two sections may be fabricated and tested separately, then joined together using z-connection technology. The signal core is formed from a conductive power/ground plane positioned between two dielectric layers. A patterned metal layer is formed on each dielectric layer. The two metal layers are interconnected by a through via or post process. The conductive power/ground plane functions to reduce signal cross-talk between signal lines formed on the two patterned metal layers. The power/ground wrap includes an upper substrate positioned above the signal core and a lower substrate positioned below the signal core. The upper and lower substrates of the power/ground wrap are formed from a dielectric film having a patterned metal layer on both sides, with the patterned layers connected by a through via or post process. The two power/ground wrap substrates may be formed separately or from one substrate which is bent into a desired form (e.g., a “U” shape). The two power/ground substrates are maintained in their proper alignment relative to the signal core and to each other by edge connectors which are also connected to the signal core's intermediary power/ground plane.

Abstract translation: 一种用于在集成电路芯片或芯片与基板之间提供电源，接地和信号连接的插入器。 本发明的插入器包括信号芯和外部电源/接地连接外壳。 这两个部分可以单独制造和测试，然后使用z连接技术连接在一起。 信号芯由位于两个电介质层之间的导电电源/接地平面形成。 在每个电介质层上形成图案化的金属层。 两个金属层通过通孔或后处理相互连接。 导电功率/接地面用于减少形成在两个图案化金属层上的信号线之间的信号串扰。 电源/接地包裹物包括位于信号芯上方的上基板和位于信号芯下方的下基板。 电源/接地线圈的上下基板由两面具有图案化金属层的电介质膜形成，图案化层通过通孔或后工艺连接。 两个电源/接地包覆基板可以分开地形成，或者可以从弯曲成所需形状（例如，“U”形状）的一个基板形成。 两个电源/接地基板相对于信号芯线保持正确的对准，并通过也连接到信号芯的中间电源/接地平面的边缘连接器彼此保持。

公开(公告)号：US5865650A

公开(公告)日：1999-02-02

申请号：US734771

申请日：1996-10-22

Applicant: Vaughn R. Marian, Jr. ,  Donald R. Mullen

Inventor： Vaughn R. Marian, Jr. ,  Donald R. Mullen

IPC: G01S7/52 ,  H01R13/193 ,  H01R31/06 ,  H05K1/02 ,  H05K3/34 ,  H05K3/36 ,  H01R9/05

CPC classification number: H01R31/065 ,  G01S7/52017 ,  H05K3/363 ,  H01R13/193 ,  H01R23/6873 ,  H05K1/0218 ,  H05K2201/0394 ,  H05K2201/055 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09354 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10371 ,  H05K3/341

Abstract: An ultrasound adapter assembly includes a rectangular zero-insertion-force receptacle, such as the ITT Cannon.RTM. DL-series Zero Insertion Force ("DL-ZIF") receptacle, and a high-density micro-coaxial ("HDMC") connector plug interconnected by micro-coaxial conductors. The adapter assembly includes a frame for supporting the two connectors and a locking mechanism for use in semi-permanently attaching the adapter assembly to an ultrasound imaging system receptacle. The adapter assembly permits old-style ultrasound transducer assemblies having the rectangular zero-insertion-force plug to be used with newer ultrasound imaging systems using the newer HDMC interfacing system. In an alternative embodiment, the two connectors are electrically interconnected using flex-circuit. The HDMC connector plug is formed using a multi-layer printed wiring board having a high density array of electrical contact pads on one surface arranged for compatible mating with the newer system HDMC interfacing receptacle. Solder pads are placed on the opposed surface for solder attachment of the micro-coaxial cables and the alternative flex-circuit. A second multi-layer printed wiring board includes pre-tinned feedthroughs for solder connection to the Cannon DL-ZIF connector. An opposed surface of the second printed wiring board includes solder pads for attachment of the micro-coaxial cables and the alternative flex-circuit. In another alternative embodiment, the flex-circuit is attached at both ends to separate connectors forming an interconnection assembly, and both the second printed wiring board and the HDMC plug printed wiring board include mating connectors for attachment of the interconnecting flex-circuit assembly.

Abstract translation: 超声波适配器组件包括矩形零插入插座，例如ITT Cannon TM DL系列零插入力插座（“DL-ZIF”）插座和高密度微同轴（“HDMC”）连接器插头 通过微同轴导体互连。 适配器组件包括用于支撑两个连接器的框架和用于将适配器组件半永久地附接到超声成像系统插座的锁定机构。 适配器组件允许具有矩形零插入力塞的旧式超声换能器组件与使用较新的HDMC接口系统的较新的超声成像系统一起使用。 在替代实施例中，两个连接器使用柔性电路电互连。 HDMC连接器插头使用多层印刷线路板形成，该多层印刷线路板在一个表面上具有高密度阵列的电接触焊盘，其布置成与较新的系统HDMC接口插座兼容配合。 焊盘放置在相对的表面上，用于焊接附着微同轴电缆和备用柔性电路。 第二多层印刷线路板包括用于焊接连接到Cannon DL-ZIF连接器的预镀锡馈通。 第二印刷线路板的相对表面包括用于连接微同轴电缆和替代柔性电路的焊盘。 在另一替代实施例中，柔性电路在两端连接成形成互连组件的分离连接器，并且第二印刷线路板和HDMC插头印刷线路板都包括用于连接互连柔性电路组件的配合连接器。