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91.
公开(公告)号:US20160374201A1
公开(公告)日:2016-12-22
申请号:US14901751
申请日:2014-05-23
Applicant: ILLINOIS TOOL WORKS INC.
Inventor: XianBo WANG , Mark R. HECKENKAMP , Jerald J. SMITH , Maxwell J. KIRBY , William E. BARGHOLTZ , Michael S. OSVATIC
CPC classification number: H05K1/119 , H01R12/728 , H01R12/75 , H05K1/09 , H05K1/117 , H05K1/181 , H05K3/007 , H05K3/325 , H05K3/3405 , H05K2201/09063 , H05K2201/09181 , H05K2201/10015 , H05K2201/10022 , H05K2201/10053 , H05K2201/10287 , H05K2201/1034 , H05K2201/10356 , H05K2201/10386 , H05K2203/0195 , H05K2203/167
Abstract: A printed circuit board provides lateral notches for receiving wire conductors in a lateral direction to be joined with printed circuit board traces by solder or an insulation displacement connector eliminating the need for laborious sequential insertion of conductors through printed circuit board holes.
Abstract translation: 印刷电路板提供横向凹口以在横向方向上接收线导体,以通过焊料或绝缘位移连接器与印刷电路板迹线接合,从而消除了通过印刷电路板孔难以连续插入导体的需要。
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公开(公告)号:US20160353575A1
公开(公告)日:2016-12-01
申请号:US15232808
申请日:2016-08-10
Applicant: IBIS Innotech Inc.
Inventor: Wen-Chun Liu
CPC classification number: H05K1/181 , H05K1/0218 , H05K1/0353 , H05K1/0373 , H05K1/113 , H05K1/115 , H05K3/0014 , H05K3/105 , H05K3/188 , H05K3/4007 , H05K3/4697 , H05K2201/0236 , H05K2201/0376 , H05K2201/09063 , H05K2201/09118 , H05K2201/0919 , H05K2201/10151 , H05K2201/10515 , H05K2201/10674
Abstract: A package structure includes a substrate, a sensor, a base, a lead frame, conductive vias and patterned circuit layer. The substrate includes a component-disposing region and electrode contacts. The sensor is disposed at the component-disposing region and electrically connected to the electrode contacts. The base covers the substrate with its bonding surface and includes a receiving cavity, a slanted surface extended between a bottom surface of the receiving cavity and the bonding surface, and electrodes disposed on the bonding surface and electrically connected to the electrode contacts respectively. The sensor is located in the receiving cavity. The lead frame is disposed at the base. The conductive vias penetrates the base and electrically connected to the lead frame. The patterned circuit layer is disposed on the slanted surface and electrically connected to the conductive vias and the electrodes.
Abstract translation: 封装结构包括基板,传感器,基座,引线框架,导电通孔和图案化电路层。 基板包括部件布置区域和电极触点。 传感器设置在部件布置区域处并电连接到电极触点。 基座覆盖基板与其接合表面,并且包括接收腔,在接收腔的底表面和接合表面之间延伸的倾斜表面,以及设置在接合表面上并电连接到电极触头的电极。 传感器位于接收腔中。 引线框架设置在基座上。 导电通孔穿透基座并电连接到引线框架。 图案化电路层设置在倾斜表面上并电连接到导电通孔和电极。
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公开(公告)号:US20160353573A1
公开(公告)日:2016-12-01
申请号:US15135248
申请日:2016-04-21
Applicant: Innodisk Corporation
Inventor: Chih-Hsing CHEN , Hsiao-Yu WANG
CPC classification number: H05K1/144 , H05K3/368 , H05K2201/042 , H05K2201/09063 , H05K2201/10189 , H05K2201/10409
Abstract: The invention provides a stacked structure comprising a master circuit board and at least two slave circuit boards. The master circuit board comprises a plurality of connecting seats. Each slave circuit board is equipped with a connector, and defined with a plurality of post-production process areas. Wherein the connector of each slave circuit board is disposed on one of post-production process areas, and inserted into the corresponding connecting seat. When the connector of the slave circuit board must be through other slave circuit boards in order to insert the corresponding connecting seat, the post-production process areas that are disposed on other slave circuit boards and impede the connection between the connector and the corresponding connecting seat will be cut into hollow areas. Accordingly, the connector of the slave circuit board is capable of inserting the corresponding connecting seat through the hollow areas of other slave circuit boards.
Abstract translation: 本发明提供了包括主电路板和至少两个从电路板的堆叠结构。 主电路板包括多个连接座。 每个从属电路板都配有一个连接器,并且具有多个后期制作工艺区域。 其中每个从属电路板的连接器设置在后期制作处理区域中的一个上,并插入到相应的连接座中。 当从属电路板的连接器必须通过其他从电路板以插入相应的连接座时,后置制作处理区域设置在其他从电路板上并阻碍连接器与相应连接座之间的连接 将被切成中空区域。 因此,从电路板的连接器能够通过其他从属电路板的中空区域插入相应的连接座。
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公开(公告)号:US09508485B1
公开(公告)日:2016-11-29
申请号:US14596836
申请日:2015-01-14
Applicant: VLT, Inc.
Inventor: Patrizio Vinciarelli
IPC: H04L25/02 , H05K1/14 , H01F27/28 , H01F27/36 , H01F7/20 , H05K1/11 , H05K1/02 , H02J5/00 , H01F7/06 , H05K1/16
CPC classification number: H01F27/2804 , H01F27/288 , H01F2019/085 , H01F2027/2809 , H04L25/0266 , H05K1/0239 , H05K1/0254 , H05K1/0298 , H05K1/145 , H05K1/165 , H05K3/366 , H05K2201/09063 , H05K2201/10189
Abstract: A signal isolator apparatus includes a first substrate for supporting input circuitry including a high frequency oscillator circuit for receiving an input signal, a second substrate for supporting output circuitry including a detector circuit for providing an output signal; and a third substrate having parallel conductive layers separated by insulation. The third substrate has an upper conductive shield formed in a second conductive layer and a lower conductive shield formed in a fifth conductive layer. A transformer is formed between the upper and lower conductive shields and includes a primary winding formed in a third conductive layer and a secondary winding formed in a fourth conductive layer. The oscillator circuit is connected to the primary winding and adapted to excite the primary winding at a first frequency in response to the input signal, and the detector circuit is connected to the secondary winding and adapted to selectively sense the first frequency and provide the output signal. The third substrate is arranged to form a bridge connection between the first and second substrates.
Abstract translation: 信号隔离器装置包括:第一基板,用于支撑包括用于接收输入信号的高频振荡器电路的输入电路;第二基板,用于支持包括用于提供输出信号的检测器电路的输出电路; 以及具有由绝缘体隔开的平行导电层的第三衬底。 第三基板具有形成在第二导电层中的上导电屏蔽和形成在第五导电层中的下导电屏蔽。 变压器形成在上下导电屏蔽之间,并且包括形成在第三导电层中的初级绕组和形成在第四导电层中的次级绕组。 振荡器电路连接到初级绕组并且适于响应于输入信号以第一频率激励初级绕组,并且检测器电路连接到次级绕组并且适于选择性地感测第一频率并提供输出信号 。 第三基板被布置成在第一和第二基板之间形成桥连接。
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95.
公开(公告)号:US09506637B2
公开(公告)日:2016-11-29
申请号:US14472075
申请日:2014-08-28
Applicant: LG INNOTEK CO., LTD.
Inventor: Hyun Gyu Park , Min Jae Kim , Se Woong Na , In Hee Cho , Man Hue Choi , Seung Kwon Hong
CPC classification number: F21V21/14 , G02B6/0068 , G02B6/0091 , G02F1/133615 , H05K1/0278 , H05K1/028 , H05K1/056 , H05K3/0061 , H05K2201/0394 , H05K2201/09054 , H05K2201/09063 , H05K2201/10106 , H05K2203/0195 , H05K2203/302
Abstract: Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion.
Abstract translation: 提供一种电路板,包括:支撑基板,包括第一区域和从第一区域延伸成弯曲的第二区域; 安装到支撑基板的第一区域的发光器件; 以及在所述第一区域和所述第二区域之间弯曲的弯曲部分,其中所述弯曲部分包括:穿过互连线的互连线布置部分; 以及布置在所述互连线的周边上的互连线路保护部分,其中所述互连线路保护部分比所述互连线路布置部分突出。
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公开(公告)号:US09502387B2
公开(公告)日:2016-11-22
申请号:US14990547
申请日:2016-01-07
Inventor: Ming-Chih Yew , Fu-Jen Li , Po-Yao Lin , Kuo-Chuan Liu
IPC: H05K1/11 , H01L25/065 , H01L23/31 , H01L23/00 , H05K1/02 , H01L21/48 , H01L21/56 , H01L23/498
CPC classification number: H01L25/0657 , H01L21/4853 , H01L21/486 , H01L21/565 , H01L23/3128 , H01L23/3157 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/562 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06548 , H01L2225/06555 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2924/1815 , H01L2924/18161 , H05K1/0271 , H05K1/11 , H05K2201/09063 , H05K2201/10378 , H05K2201/10613 , H05K2201/10734 , H01L2924/00014
Abstract: Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the first package by the connectors. A molding compound is disposed on the first side of the first package and between the first package and the second package. A plurality of stress relief structures (SRSs) are disposed in the molding compound, the plurality of SRSs each comprising a cavity free of metal in the molding compound and spaced apart from each of the plurality of connectors.
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公开(公告)号:US09496664B2
公开(公告)日:2016-11-15
申请号:US14688993
申请日:2015-04-16
Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
Inventor: Terrance F. Little , Chih-Pi Cheng , Hsueh-Lung Hsiao , Ming-Lun Szu , Chao-Chieh Chen
IPC: H01R24/00 , H01R24/60 , H01R13/6587 , H01R107/00 , H01R12/72 , H01R24/28 , H05K1/11 , H05K1/18
CPC classification number: H01R13/6587 , H01R12/724 , H01R24/28 , H01R24/60 , H01R43/24 , H01R2107/00 , H05K1/117 , H05K1/184 , H05K2201/09063 , H05K2201/10189 , Y10T29/4922
Abstract: A plug connector mateable with the receptacle connector, includes an insulative housing enclosed in a metallic shell, defining a receiving cavity to receive the mating tongue, and equipped with a plurality of contacts on opposite sides in the vertical direction. A latch forms a pair of locking heads extending into two opposite lateral sides of the receiving cavity to lock with a shielding plate embedded within a mating tongue of the complementary receptacle connector during mating.
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98.
公开(公告)号:US09482810B2
公开(公告)日:2016-11-01
申请号:US14314920
申请日:2014-06-25
Applicant: LG INNOTEK CO., LTD.
Inventor: Man Hue Choi , Min Jae Kim , Bi Yi Kim , Se Woong Na , Hyun Gyu Park , In Hee Cho , Seung Kwon Hong
IPC: F21V23/00 , F21V29/00 , F21V8/00 , H05K1/02 , G02F1/1335
CPC classification number: G02B6/0083 , G02B6/0068 , G02B6/0073 , G02B6/009 , G02F1/133615 , G02F2001/133612 , H05K1/0284 , H05K2201/09063 , H05K2201/0999 , H05K2201/10106 , H05K2201/10136 , H05K2201/10189
Abstract: Provided is a circuit board including: a supporting substrate; light emitting elements mounted to the supporting substrate; a through hole passing through the supporting substrate; and a connector inserted into the through hole and for supplying an electric current to the light emitting elements.
Abstract translation: 提供一种电路板,包括:支撑基板; 安装在支撑基板上的发光元件; 穿过所述支撑基板的通孔; 以及插入到通孔中并用于向发光元件供给电流的连接器。
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公开(公告)号:US20160299375A1
公开(公告)日:2016-10-13
申请号:US14828512
申请日:2015-08-17
Inventor: Chen-Yun MA , Kuo-Tung LIAO , Chia-Jung FAN
IPC: G02F1/1333 , G02F1/1335 , G02F1/1368
CPC classification number: G02F1/133308 , G02F1/13452 , G02F2001/133314 , H05K1/02 , H05K2201/09063 , H05K2201/10136
Abstract: A panel assembly includes a frame, a cell module, a retaining structure, and a flexible circuit board. The frame has a first surface and a second surface respectively located at opposite sides of the frame. The cell module and the retaining structure are respectively disposed on the first and second surfaces. The flexible circuit board is connected to the cell module and bended to extend over the second surface. The flexible circuit board has a through hole having a passing zone and an inwardly reduced zone communicated with each other. A part of the retaining structure extends from the second surface to a side of the flexible circuit board distal to the second surface via the inwardly reduced zone for preventing the flexible circuit board from moving away from the second surface. The passing zone is configured for the retaining structure to pass through.
Abstract translation: 面板组件包括框架,单元模块,保持结构和柔性电路板。 框架具有分别位于框架相对侧的第一表面和第二表面。 电池模块和保持结构分别设置在第一表面和第二表面上。 柔性电路板连接到电池模块并弯曲以在第二表面上延伸。 柔性电路板具有通孔,该通孔具有彼此连通的通过区域和向内减少的区域。 保持结构的一部分经由向内减小的区域从柔性电路板的第二表面延伸到远离第二表面的一侧,以防止柔性电路板远离第二表面移动。 通过区域被配置为使保持结构通过。
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公开(公告)号:US20160295697A1
公开(公告)日:2016-10-06
申请号:US14442105
申请日:2013-10-29
Applicant: KITAGAWA INDUSTRIES CO., LTD.
Inventor: Tatsuya NAKAMURA
IPC: H05K1/18
CPC classification number: H05K1/181 , H01G2/06 , H05K3/301 , H05K3/3447 , H05K2201/09063 , H05K2201/10015 , H05K2201/10583 , H05K2201/10606
Abstract: A capacitor holder comprises: a holding portion having a cylindrical inner wall surface, at least an outer peripheral portion of the inner wall surface being open, the holding portion being configured to hold a capacitor inserted through the opening into an inside of the inner wall surface; a fixed portion formed integrally with the holding portion and positioned opposite to the opening of the holding portion; a pair of fitting grooves formed at a pair of end surfaces of the fixed portion opposed to each other adjacent to the holding portion, the fitting grooves being configured to fittably engage with end edges of a printed circuit board to extend along a surface of the printed circuit board; and a proximity suppressor configured to suppress portions of the fixed portion where the fitting grooves are formed from being brought into proximity each other.
Abstract translation: 电容器保持器包括:具有圆筒形内壁表面的保持部分,内壁表面的至少外周部分是开放的,保持部分构造成将通过开口插入的电容器保持在内壁表面的内部 ; 与所述保持部一体形成并与所述保持部的开口相对定位的固定部; 一对嵌合槽,形成在所述固定部分的相对于所述保持部分相对的一对端面处,所述嵌合槽被配置为与所述印刷电路板的端部边缘适配地接合以沿着所述印刷电路板的表面延伸 电路板; 以及接近抑制器,被配置为抑制形成有嵌合槽的固定部分的彼此接近的部分。
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