公开(公告)号：US06700800B2

公开(公告)日：2004-03-02

申请号：US10173342

申请日：2002-06-14

Applicant: Christopher Combs ,  Arjang Fartash ,  Tom E. Pearson ,  Raiyomand F. Aspandiar

Inventor： Christopher Combs ,  Arjang Fartash ,  Tom E. Pearson ,  Raiyomand F. Aspandiar

IPC: H02B101

CPC classification number: H05K3/303 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10598 ,  Y02P70/613

Abstract: A retainer for a circuit board and method for using the same are provided. In one embodiment, a circuit board assembly includes a circuit board, an electronic component, a plurality of electric contacts between the circuit board and the electronic component, and a retainer. The retainer has a first component secured to the circuit board and a second component secured to the electronic component. The retainer allows for movement of the electronic component in a first direction towards the circuit board while simultaneously preventing movement of the circuit board and the electronic component in a second direction away from one another when the electric contacts melt.

Abstract translation: 提供一种用于电路板的保持器及其使用方法。 在一个实施例中，电路板组件包括电路板，电子部件，电路板和电子部件之间的多个电触头以及保持器。 保持器具有固定到电路板的第一部件和固定到电子部件的第二部件。 保持器允许电子部件沿着第一方向朝着电路板运动，同时防止当电触头熔化时电路板和电子部件在彼此远离彼此的第二方向上移动。

公开(公告)号：US06691407B2

公开(公告)日：2004-02-17

申请号：US10020859

申请日：2001-12-13

Applicant: Tom E. Pearson ,  Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar

Inventor： Tom E. Pearson ,  Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar

IPC: H05K332

CPC classification number: H05K3/305 ,  H01L2924/15151 ,  H05K3/3415 ,  H05K2201/09072 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method to retain an assembled component on one side of a double-sided printed circuit board. In one embodiment, an adhesive body, in a solid state, is coupled with a component by disposing a coupling member extending from said component within a channel formed in said adhesive body such that the coupling member is engaged with at least one engaging member, said at least one engaging member each extending into said channel from an internal surface defining said channel. The component is then assembled onto a printed circuit board and adhered onto the printed circuit board via the adhesive body when the adhesive body is in semi-liquid state.

Abstract translation: 一种在双面印刷电路板的一侧上保持组装的部件的方法。 在一个实施例中，固体状态的粘合剂体通过将形成在所述粘合体中的通道中的所述部件延伸的连接部件与部件联接，使得所述连接部件与至少一个接合部件接合，所述接合部件 每个至少一个接合构件从限定所述通道的内表面延伸到所述通道中。 然后当粘合体处于半液态时，将组件组装到印刷电路板上并通过粘合体粘附到印刷电路板上。

公开(公告)号：USRE38381E1

公开(公告)日：2004-01-13

申请号：US10023176

申请日：2002-04-23

Applicant: Mark E. Martich

Inventor： Mark E. Martich

IPC: H01H166

CPC classification number: H05K1/141 ,  H01H51/281 ,  H05K1/0219 ,  H05K1/182 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/10083 ,  H05K2201/10477

Abstract: A new board mounted electromechanical device is provided that mounts to a relay substrate to form a low profile reed relay. The reed relay is electrically connected to the electrical contacts via a signal traces and additional electrical traces located on the same side of the relay substrate which connect to the relay's signal and shielding. Additional traces on both sides of the signal traces of the reed relay provide a co-planar wave guide to maintain the desired impedance of the signal path. The reed relay is mounted in an inverted manner into a cut-out in the main circuit board so that the other portion of the reed relay itself is sits within the cut-out in the main circuit board. As a result, the reed relay component is recessed below the surface of the main circuit board resulting in an overall low profile circuit board.

公开(公告)号：US20030226895A1

公开(公告)日：2003-12-11

申请号：US10252484

申请日：2002-09-23

Applicant: Hand Held Products, Inc.

Inventor： William H. Havens ,  Robert J. Hennick ,  John Izzo ,  Michael Robinson

IPC: G06K007/10 ,  G02B026/08

CPC classification number: G06K7/10584 ,  G06K7/10722 ,  G06K7/10801 ,  G06K7/10861 ,  G06K7/14 ,  H05K1/18 ,  H05K3/244 ,  H05K2201/09072 ,  H05K2201/09463 ,  H05K2201/0949 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10121

Abstract: An optical reader including an image sensor, imaging optics, a short range aiming assembly, and a long range aiming assembly. The short range aiming assembly may comprise a plurality of LEDs. The long range aiming assembly may comprise a laser diode assembly which projects an aiming pattern that is readily visible at reading distances of several feet. The optical reader can be configured so that long range aiming assembly is enabled or disabled depending upon a present operating condition.

Abstract translation: 包括图像传感器，成像光学元件，短距离瞄准组件和远程瞄准组件的光学读取器。 短距离瞄准组件可以包括多个LED。 长距离瞄准组件可以包括激光二极管组件，其投射在几英尺的读取距离处容易看见的瞄准图案。 光学读取器可以被配置为使得远程瞄准组件被启用或禁用，这取决于当前的操作条件。

公开(公告)号：US06625031B2

公开(公告)日：2003-09-23

申请号：US09984679

申请日：2001-10-16

Applicant: Naoto Sano ,  Yasuyuki Morishima

Inventor： Naoto Sano ,  Yasuyuki Morishima

IPC: H05K114

CPC classification number: H05K1/142 ,  H05K1/141 ,  H05K1/182 ,  H05K3/368 ,  H05K2201/09072 ,  H05K2201/1034 ,  H05K2201/10477

Abstract: A part having a large height contained in a module part is placed in a first cut-off portion formed in a part-mounting substrate to be mounted. Moreover, the module part itself is placed in a second cut-off portion formed in a mother board to be mounted.

公开(公告)号：US06608763B1

公开(公告)日：2003-08-19

申请号：US09663753

申请日：2000-09-15

Applicant: Carmen D. Burns ,  James G. Wilder ,  Julian Dowden

Inventor： Carmen D. Burns ,  James G. Wilder ,  Julian Dowden

IPC: H01R1216

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A system and method for selectively stacking and interconnecting individual integrated circuit devices to create a high density integrated circuit module. Connections between stack elements are made through carrier structures that provide inter-element connections that substantially follow an axis that is substantially perpendicular to the vertical axis of the stack. The carrier structure provides connection between elements through conductive paths disposed to provide connection between the foot of an upper IC element and the upper shoulder of the lower IC element. This leaves open to air flow most of the vertical transit section of the lower lead for cooling while creating an air gap between elements that encourages cooling airflow between the elements of the stack. A method for creating stacked integrated circuit modules according to the invention is provided.

Abstract translation: 一种用于选择性堆叠和互连各个集成电路器件以创建高密度集成电路模块的系统和方法。 堆叠元件之间的连接通过载体结构制成，所述载体结构提供基本上沿基本上垂直于堆叠的垂直轴线的轴线的元件间连接。 载体结构通过设置成提供上部IC元件的脚和下部IC元件的上部肩部之间的连接的导电路径提供元件之间的连接。 这使得下部引线的大部分垂直运输部分的空气流通过冷却，同时在元件之间产生鼓风在堆叠元件之间的冷却气流的气隙。 提供了一种用于制造根据本发明的堆叠集成电路模块的方法。

公开(公告)号：US20030111259A1

公开(公告)日：2003-06-19

申请号：US10313238

申请日：2002-12-05

Inventor： Tom E. Pearson ,  Christopher D. Combs ,  Arjang Fartash ,  Raiyomand Aspandiar

IPC: H05K001/18

CPC classification number: H05K3/305 ,  H01L2924/15151 ,  H05K3/3415 ,  H05K2201/09072 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2203/1105 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. Being formed from an epoxy material, the retainer is configured to be coupled with a component, which is then positioned onto a printed circuit board. During a subsequent solder reflow stage, an ambient temperature surrounding the printed circuit board increases, and the epoxy material is configured to enter a semi-liquid state, flowing onto, and adhering with, the printed circuit board. Upon reaching a typical solder reflow temperature, the liquefied epoxy material is configured to cure or harden, adhesively coupling the component with the printed circuit board. Thereby, the component is inhibited from separating from the printed circuit board when the printed circuit board is subsequently inverted, populated, and reflowed.

Abstract translation: 一种在随后位于双面印刷电路板的相对侧上的其它部件的回流焊接及其制造和使用双面印刷电路板的相对侧的其它部件的回焊期间将组装部件保持在双面印刷电路板的一侧上的装置。 由环氧树脂材料形成，保持器被构造成与部件联接，然后将其定位在印刷电路板上。 在随后的回流焊步骤期间，印刷电路板周围的环境温度升高，并且环氧树脂材料被配置为进入半液态，流到印刷电路板上并与印刷电路板粘附。 在达到典型的回流焊温度时，液化环氧树脂材料被配置成固化或硬化，将组件与印刷电路板粘合地连接。 因此，当印刷电路板随后被倒置，填充和回流时，该部件被禁止与印刷电路板分离。

公开(公告)号：US06541762B2

公开(公告)日：2003-04-01

申请号：US09984283

申请日：2001-10-29

Applicant: Dong-Hoon Kang ,  Joon-Ki Paik

Inventor： Dong-Hoon Kang ,  Joon-Ki Paik

IPC: H01J4014

CPC classification number: G06F3/0317 ,  H05K1/0274 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/09072 ,  H05K2201/10303 ,  H05K2201/10477 ,  H05K2201/10871

Abstract: A sub chip on board for an optical mouse is disclosed. The chip on board has a sub PCB having both a plurality of input/output pads and a plurality of pin holes. A sensor die has an optical sensor wire-bonded to said input/output pads for sensing received light, and is attached to a bottom surface of the sub PCB. A transparent resin covers the sensor die at the bottom surface of the sub PCB. A cap is attached to the bottom surface of the sub PCB such that the cap covers the transparent resin, and has a hole for guiding the received light to said optical sensor. A main PCB has both a hole for guiding the received light to the optical sensor and a plurality of pin holes corresponding to the pin holes of the sub PCB. A plurality of pins are commonly inserted into the pin holes of both the main PCB and the sub PCB.

Abstract translation: 公开了一种用于光电鼠标的子芯片。 板上的芯片具有具有多个输入/输出焊盘和多个销孔的子PCB。 传感器管芯具有导线接合到所述输入/输出焊盘的光学传感器，用于感测接收到的光，并且附接到子PCB的底表面。 透明树脂覆盖子PCB底面的传感器芯片。 盖子附接到副PCB的底表面，使得帽覆盖透明树脂，并且具有用于将接收的光引导到所述光学传感器的孔。 主PCB具有用于将接收的光引导到光学传感器的孔和与子PCB的针孔对应的多个针孔。 多个引脚通常插入主PCB和副PCB的引脚孔中。

公开(公告)号：US20030003623A1

公开(公告)日：2003-01-02

申请号：US10219515

申请日：2002-08-15

Inventor： Klaus-Peter Galuschki ,  Heinz Pilz

IPC: H01L021/44 ,  H01L023/22

CPC classification number: H01L21/563 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01033 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/18301 ,  H05K3/305 ,  H05K2201/09072 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method of padding an electronic component, mounted on a flat substrate, with a fluid filler, in which the fluid filler that is applied in a tight-fitting manner to the electronic component mounted on the substrate. The arrangement composed of substrate and electronic component is then heated. The substrate is provided with at least one through orifice in the area of the electronic component prior to applying the filler. The filler is applied at the end of the through orifice faring away from the electronic component.

Abstract translation: 一种用流体填充物填充安装在平坦基板上的电子部件的方法，其中以紧密配合方式施加到安装在基板上的电子部件的流体填料。 然后将由基板和电子部件组成的布置加热。 在施加填料之前，基板在电子部件的区域中设置有至少一个通孔。 填充物应用在通孔远离电子部件的端部。

公开(公告)号：US20020175421A1

公开(公告)日：2002-11-28

申请号：US10151416

申请日：2002-05-20

Inventor： Naoto Kimura

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L23/49833 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/021 ,  H05K1/144 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10515 ,  H05K2201/1056 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: The semiconductor device according to the present invention is equipped with a plurality of electronic circuits including at least one semiconductor integrated circuit chip, and a plurality of intermediate substrates interposed between the electronic components and a package and mounting the electronic components directly on its one major face, where each of the electronic component has on the one major face at least a plurality of first electrodes connected to the electronic components, a plurality of second electrodes for external connection, and internal connection electrodes for connecting between the electronic components including the connection between the first electrodes and the second electrodes that are mutually corresponding.

Abstract translation: 根据本发明的半导体器件配备有多个电子电路，其包括至少一个半导体集成电路芯片和插入在电子部件和封装之间的多个中间基板，并将电子部件直接安装在其一个主面上 ，其中每个电子部件在一个主面上具有连接到电子部件的至少多个第一电极，用于外部连接的多个第二电极和用于连接电子部件之间的连接的内部连接电极， 第一电极和第二电极相互对应。