Abstract:
An interdigitated chip capacitor (“IDC”) assembly including an IDC having a semiconductor block with a top portion, a bottom portion opposite the top portion, a plurality of sidewall portions extending between the top and bottom portions, and a plurality of terminals located on the sidewall portions; and a substrate having a top portion with a plurality of generally flat, vertically extending, nonconductive abutment surfaces thereon, the sidewall portions of the IDC being abuttingly engaged with at least some of the plurality of abutment surfaces.
Abstract:
An engine control unit including a substantially rectangular printed circuit board in which a microcontroller is mounted. The printed circuit board includes a connector portion in which connection terminals are provided to be arranged in one side edge portion along the longitudinal direction thereof. The connection terminals of the connector portion include connection terminals for input on one side in the longitudinal direction and connection terminals for output on the other side with respect to a setting position. A microcontroller is disposed at substantially the center portion of the printed circuit board in the longitudinal direction thereof. An electronic component as an input interface circuit is disposed on the one side in the longitudinal direction, and an electronic component as an output interface circuit is disposed on the other side.
Abstract:
A connector has contacts, each including a holding portion inserted from a direction orthogonal to a connector fitting direction and held by a housing, a contact portion continuous with the holding portion and extending in the fitting direction, and a connection portion continuous with the holding portion and connected to an LED mounting substrate. The housing includes a main body inserted in a hole formed in the LED mounting substrate, and a top hoard portion formed thereon. The main body is formed with connector receiving portions which accommodate the contact portions and receive a cable connector. The board portion is formed with contact accommodating portions which communicate with the connector receiving portions and accommodate the holding portions. The main body is formed with slots via which the contacts are inserted into the connector receiving portions and the contact accommodating portions from directions orthogonal to the fitting direction.
Abstract:
The object of the present invention is to provide a suspension substrate such that the thickness of an insulating layer for supporting a connecting terminal having a flying structure is uniform. The present invention attains the object by providing a suspension substrate, comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein a wiring layer projecting section is provided by a plurality; an adjusting section formed on the insulating layer and composed of a first adjusting section and a second adjusting section is provided on both sides of the plural wiring layer projecting sections; and a gap between a first outermost wiring layer projecting section and the first adjusting section, a gap between the adjacent wiring layer projecting sections, and a gap between a second outermost wiring layer projecting section and the second adjusting section are equal.
Abstract:
The present invention relates to a semiconductor memory module and an electronic component socket for coupling with the same. A printed circuit board of the semiconductor memory module includes three signal pad arrays longitudinally formed in a row on one sides of a first surface, a second surface and a third surface thereof. Each signal pad array includes a plurality of signal pads. An electronic component socket for coupling with the printed circuit board includes thee pin arrays. Thus, an increased number of the signal pads can be provided while retaining the size of the memory module and the electronic component socket.
Abstract:
A communication jack has a housing with a face having a plug receiving aperture. A plurality of conductive path pairs extends from corresponding plug interface contacts located at the plug receiving aperture to corresponding output terminals. A first circuit board is connected to the plug interface contacts and a second circuit board is connected to the plug interface contacts and the output terminals. The first circuit board has a first single stage of crosstalk compensation with opposite polarity of the crosstalk of a plug for a first combination of the conductive path pairs. The second circuit board includes a second single stage of opposite polarity crosstalk compensation for some of the conductive path pairs not compensated on the first circuit board. The stages cancel substantially all of the crosstalk caused by the plug, for the signal operating frequencies, for corresponding combinations of the conductive path pairs.
Abstract:
The object of the present invention is to provide a suspension substrate such that the thickness of an insulating layer for supporting a connecting terminal having a flying structure is uniform. The present invention attains the object by providing a suspension substrate, comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein a wiring layer projecting section is provided by a plurality; an adjusting section formed on the insulating layer and composed of a first adjusting section and a second adjusting section is provided on both sides of the plural wiring layer projecting sections; and a gap between a first outermost wiring layer projecting section and the first adjusting section, a gap between the adjacent wiring layer projecting sections, and a gap between a second outermost wiring layer projecting section and the second adjusting section are equal.
Abstract:
A communication jack has a housing with a face having a plug receiving aperture. A plurality of conductive path pairs extends from corresponding plug interface contacts located at the plug receiving aperture to corresponding output terminals. A first circuit board is connected to the plug interface contacts and a second circuit board is connected to the plug interface contacts and the output terminals. The first circuit board has a first single stage of crosstalk compensation with opposite polarity of the crosstalk of a plug for a first combination of the conductive path pairs. The second circuit board includes a second single stage of opposite polarity crosstalk compensation for some of the conductive path pairs not compensated on the first circuit board. The stages cancel substantially all of the crosstalk caused by the plug, for the signal operating frequencies, for corresponding combinations of the conductive path pairs.
Abstract:
The invention concerns an interconnect device comprising a support (200) in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity (203) and one or several slots (205a-205b, 215a-215b) communicating with the cavity, the slots extending in a direction making a non-zero angle with the main plane of the support, several conducting elements (214) being positioned on at least one wall of the hole and passing through the latter part, the conducting elements each being intended to connect conducting areas to each other that are situated on either side of the support, at least one of said slots separating two of said conducting elements from each other.
Abstract:
A printed circuit board assembly includes a first printed circuit board having a plurality of electrical traces that is attached to a second printed circuit board having a plurality of electrical traces in a substantially perpendicular fashion. The first printed circuit board has a plurality of male terminal tabs that fit into a plurality of female terminal slots of the second printed circuit board to make a plurality of electrical connections between the electrical traces of the first printed circuit board and the electrical traces of the second printed circuit board. The assembly has at least two mechanical connections between the first printed circuit board and the second printed circuit board comprising connector blades that are substantially perpendicular to the first printed circuit board and to the second printed circuit board. The connector blades may also make electrical connections between electrical traces of the first and second printed circuit boards. A method of making an alternate printed circuit board for the assembly involves punching or drilling the alternate printed circuit board to provide a plurality of female terminals in an elongate slot.