公开(公告)号：US20120152608A1

公开(公告)日：2012-06-21

申请号：US13329209

申请日：2011-12-16

Applicant: Alexander Weigel ,  Mario Mitzel

Inventor： Alexander Weigel ,  Mario Mitzel

IPC: H05K9/00

CPC classification number: H05K1/0218 ,  H05K1/0228 ,  H05K1/0237 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/09972

Abstract: A printed circuit board having a generally box-like carrier plate with a top side and an underside. The board has at least first and second conductor track plane separated by a first distance and an electrical circuit which occupies at least one section of the carrier plate. The section contains a screen for protecting the circuit from electromagnetic interference. The screen has a first screening conductor track which is arranged on the first conductor track plane and surrounds the section, and a second screening conductor track which is arranged on the second conductor track plane and also surrounds the section. The first and second screening conductor tracks are congruent at least in a circumferential region which surrounds the circuit. The screen has, in the circumferential region, a plurality of plated-through holes which penetrate the carrier plate and connect the first and second screening conductor tracks.

Abstract translation: 一种印刷电路板，其具有通常具有顶侧和下侧的盒状载体板。 板具有至少分开第一距离的第一和第二导体轨道平面和占据载体板的至少一个部分的电路。 该部分包含用于保护电路免受电磁干扰的屏幕。 屏幕具有布置在第一导体轨道平面上并围绕该部分的第一屏蔽导体轨道，以及布置在第二导体轨道平面上并且还包围该部分的第二屏蔽导体轨迹。 第一和第二屏蔽导体轨道至少在围绕电路的圆周区域中是一致的。 该屏幕在圆周区域中具有穿过载体板并连接第一和第二屏蔽导体轨道的多个电镀通孔。

公开(公告)号：US20120087057A1

公开(公告)日：2012-04-12

申请号：US13250071

申请日：2011-09-30

Applicant: Katsutoshi Tahara

Inventor： Katsutoshi Tahara

IPC: H05F3/00

CPC classification number: H05K1/117 ,  G06K13/00 ,  G06K19/00 ,  G06K19/07732 ,  G06K19/07735 ,  H05K1/0259 ,  H05K2201/09354

Abstract: A portable information processing device includes a circuit board portion that has a main body portion side board mounting an electronic circuit thereon and forming a main body portion, and a connector portion side board forming a connector portion for connection to electronic equipment, wherein the main body portion side board mounts an electronic circuit on at least one of a first surface and a second surface opposite to the first surface, and is provided with a main body portion side electro-static discharge line which functions as an electro-static discharge surge arrester at an edge portion of a surface on which at least an electronic circuit is mounted, and wherein the connector portion side board is provided with a connector portion side electro-static discharge line which is connected to the main body portion side electro-static discharge line and functions as an electro-static emission portion.

Abstract translation: 便携式信息处理装置包括：电路板部分，其具有安装其上的电子电路并形成主体部分的主体部分侧板，以及形成用于连接到电子设备的连接器部分的连接器部分侧板，其中主体 部分侧板在与第一表面相对的第一表面和第二表面中的至少一个上安装电子电路，并且设置有用作静电放电避雷器的主体部侧静电放电线 其上安装有至少一个电子电路的表面的边缘部分，并且其中连接器部分侧板设置有连接部分侧静电放电线，其连接到主体部分侧静电放电线和 用作静电发射部分。

公开(公告)号：US07866337B2

公开(公告)日：2011-01-11

申请号：US11482542

申请日：2006-07-07

Applicant: Robert T. Chinnock ,  Clifford Miller ,  Charles Meacham

Inventor： Robert T. Chinnock ,  Clifford Miller ,  Charles Meacham

IPC: F16K31/02

CPC classification number: G01F1/363 ,  G05D7/0635 ,  H05K1/0218 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09354 ,  Y10T137/7759 ,  Y10T137/7761 ,  Y10T137/7895

Abstract: A flow controller including a unitary controller body with a chemically inert fluid conduit having an insertable constriction or orifice disposed within the conduit having a reduced cross-sectional area to thereby restrict the flow of fluid within the conduit allowing for reliable flow measurement. An integrated circuit or controller may be coupled to the control valve and also coupled to the pressure sensors by a lead structure including signal conductors surrounded by a Faraday cage, and a chemically inert housing coupled to the unitary controller body enclosing the control valve and the pressure sensors.

Abstract translation: 流量控制器包括具有化学惰性流体导管的整体控制器主体，其具有设置在导管内的可插入的收缩部或孔口，其具有减小的横截面积，从而限制管道内的流体流动，从而可靠地进行流量测量。 集成电路或控制器可以耦合到控制阀并且还通过包括由法拉第笼围绕的信号导体的引线结构耦合到压力传感器，以及耦合到包围控制阀的单一控制器主体和压力的化学惰性壳体 传感器。

公开(公告)号：US07787255B2

公开(公告)日：2010-08-31

申请号：US11948547

申请日：2007-11-30

Applicant: Ching-Sen Tsai ,  Mei-Tsu Tsao ,  Cheng-Lung Chang

Inventor： Ching-Sen Tsai ,  Mei-Tsu Tsao ,  Cheng-Lung Chang

IPC: H05K9/00

CPC classification number: H05K9/0067 ,  H05K1/0215 ,  H05K1/0393 ,  H05K2201/09354

Abstract: A grounding apparatus (200) includes at least one conductive member (20), a sliding mechanism (30) and a flexible printed circuit board (40). The sliding mechanism is conductive and electrically connected to the conductive member. The flexible printed circuit board includes a conductive layer (421) and a grounding end (4231), the conductive layer and the grounding end are electrically connected to the sliding mechanism.

Abstract translation: 接地装置（200）包括至少一个导电构件（20），滑动机构（30）和柔性印刷电路板（40）。 滑动机构是导电的并且电连接到导电构件。 柔性印刷电路板包括导电层（421）和接地端（4231），导电层和接地端电连接到滑动机构。

公开(公告)号：US07787249B2

公开(公告)日：2010-08-31

申请号：US12364862

申请日：2009-02-03

Applicant: Lance L. Sundstrom

Inventor： Lance L. Sundstrom

IPC: H05K7/20 ,  H05K1/00

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09354 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Systems and methods for printed board assembly isolated heat exchange are provided. In one embodiment, a printed board assembly comprises: at least one electrical power layer; at least one electrical ground layer; a first signal layer having a first signal routing area providing electrical trace connections for signals and a first heat exchange chassis fill conductor area located adjacent to a periphery of the first signal routing area; at least one thermal interface coupled to a chassis for conducting heat from the printed board assembly to the chassis; and at least one via conductively coupling the first heat exchange chassis fill conductor area to the at least one thermal interface.

Abstract translation: 提供印刷电路板组装隔离热交换的系统和方法。 在一个实施例中，印刷电路板组件包括：至少一个电功率层; 至少一个电接地层; 第一信号层，具有提供用于信号的电迹线连接的第一信号路由区域和邻近所述第一信号路由区域的周边定位的第一热交换机箱填充导体区域; 耦合到底架的至少一个热接口，用于将热量从印刷电路板组件传导到底座; 并且至少一个通孔将第一热交换底盘填充导体区域导电地耦合到至少一个热界面。

公开(公告)号：US20100195287A1

公开(公告)日：2010-08-05

申请号：US12364862

申请日：2009-02-03

Applicant: Lance L. Sundstrom

Inventor： Lance L. Sundstrom

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09354 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Systems and methods for printed board assembly isolated heat exchange are provided. In one embodiment, a printed board assembly comprises: at least one electrical power layer; at least one electrical ground layer; a first signal layer having a first signal routing area providing electrical trace connections for signals and a first heat exchange chassis fill conductor area located adjacent to a periphery of the first signal routing area; at least one thermal interface coupled to a chassis for conducting heat from the printed board assembly to the chassis; and at least one via conductively coupling the first heat exchange chassis fill conductor area to the at least one thermal interface.

Abstract translation: 提供印刷电路板组装隔离热交换的系统和方法。 在一个实施例中，印刷电路板组件包括：至少一个电功率层; 至少一个电接地层; 第一信号层，具有提供用于信号的电迹线连接的第一信号路由区域和邻近所述第一信号路由区域的周边定位的第一热交换机箱填充导体区域; 耦合到底架的至少一个热接口，用于将热量从印刷电路板组件传导到底座; 并且至少一个通孔将第一热交换底盘填充导体区域导电地耦合到至少一个热界面。

公开(公告)号：US07658622B2

公开(公告)日：2010-02-09

申请号：US12386592

申请日：2009-04-21

Applicant: Victor L. Bartholomew

Inventor： Victor L. Bartholomew

IPC: H01R12/00

CPC classification number: H05K1/0219 ,  H05K1/0201 ,  H05K1/0293 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/3452 ,  H05K2201/0305 ,  H05K2201/062 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09354 ,  H05K2201/0969 ,  H05K2201/10356 ,  H05K2203/173 ,  Y10S439/943 ,  Y10T29/49155

Abstract: A transition circuit board for transitioning a cable to a connector is provided. A circuit board has an outer surface with a circuit trace, ground plane and ground link provided thereon. A cable pad and a contact pad are provided at opposite ends of the circuit trace. The ground link is electrically common with the ground plane and is located adjacent to, and separated by a space from, the circuit trace. An insulating coating is provided over at least part of the circuit trace, the ground plane and the outer surface of the circuit board. The insulating coating has a mask aperture there-through exposing an uncoated portion of the circuit trace and the ground link. A conductive jumper material is provided on the uncoated portion of the circuit trace and the ground link to electrically join the circuit trace with the ground plane.

Abstract translation: 提供了一种用于将电缆转换到连接器的转换电路板。 电路板具有外表面，其上设置有电路迹线，接地平面和接地链路。 在电路迹线的相对端设有电缆垫和接触垫。 接地链路与接地平面电气相同，并且位于与电路迹线相邻并且与电路迹线隔开的空间中。 在电路板的至少一部分，接地平面和电路板的外表面上提供绝缘涂层。 绝缘涂层在其上具有掩模孔，通过暴露电路迹线的未涂覆部分和接地链路。 在电路迹线的未涂覆部分和接地链路上提供导电跳线材料，以将电路迹线与接地平面电连接。

公开(公告)号：US20090321111A1

公开(公告)日：2009-12-31

申请号：US12396544

申请日：2009-03-03

Applicant: CHUN-HUA WU

Inventor： CHUN-HUA WU

IPC: H05K1/00

CPC classification number: H05K1/0215 ,  H05K1/0259 ,  H05K1/095 ,  H05K1/189 ,  H05K2201/09354 ,  H05K2201/10189

Abstract: A flexible printed circuit module includes a main body and at least one connecting socket. The main body includes a first connecting end, a strip body and a second connecting end. The first connecting end and the second connecting end each includes a connector, disposed thereon respectively. The strip body includes a plurality of internal circuits including a grounding circuit assembled therein, the internal circuits electronically connect with the two connectors. The connecting socket is mounted on the main body and electronically connects with one of the two connectors and has a conductive coating covered on an area of the main body surrounding the connecting socket electronically connecting with the grounding circuit.

Abstract translation: 柔性印刷电路模块包括主体和至少一个连接插座。 主体包括第一连接端，带体和第二连接端。 第一连接端和第二连接端各自包括分别设置在其上的连接器。 带体包括多个内部电路，包括组装在其中的接地电路，内部电路与两个连接器电连接。 连接插座安装在主体上，并与两个连接器中的一个电连接，并且在与主接地电路连接的连接插座周围的主体区域上覆盖有导电涂层。

公开(公告)号：US20090126982A1

公开(公告)日：2009-05-21

申请号：US12270143

申请日：2008-11-13

Applicant: Junichi Nakamura ,  Takaharu Miyamoto

Inventor： Junichi Nakamura ,  Takaharu Miyamoto

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H01L23/49838 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/09354 ,  H05K2201/09781 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A wiring board 10 comprises a wiring board main body 21 having a dielectric layer 25 that is the first dielectric layer, an electronic component attaching pad 24 having a connection surface 24A with which an electronic component 11 is connected, and disposed inside the dielectric layer 25, a dielectric layer 31 that is the second dielectric layer laminated on the dielectric layer 25, and the via holes 27 and 33 and a wiring pattern 28 provided on the dielectric layers 25 and 31 and electrically connected with the electronic component attaching pad 24, wherein a warp reduction member 22 for reducing a warp of the wiring board main body 21 is disposed inside the dielectric layer 25.

Abstract translation: 配线基板10具有：具有作为第一电介质层的电介质层25的布线基板主体21，具有与电子部件11连接的连接面24A的电子部件安装焊盘24，配置在电介质层25的内部 作为层叠在电介质层25上的第二电介质层的电介质层31和设置在电介质层25,31上并与电子部件安装焊盘24电连接的通孔27,33和布线图案28， 用于减小布线板主体21的翘曲的翘曲构件22设置在电介质层25的内部。

公开(公告)号：US20080236883A1

公开(公告)日：2008-10-02

申请号：US12137287

申请日：2008-06-11

Applicant: Roger Allen Booth ,  Matthew Stephen Doyle

Inventor： Roger Allen Booth ,  Matthew Stephen Doyle

IPC: H05K9/00

CPC classification number: H05K1/0218 ,  H05K1/0224 ,  H05K1/0253 ,  H05K3/061 ,  H05K3/3452 ,  H05K2201/09354 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2203/0542 ,  H05K2203/0571

Abstract: A method and structures with an EMI shielding electrically conductive coating are provided for implementing EMI shielding for rigid cards and flexible circuits. An EMI shielding electrically conductive coating is deposited on an outer layer, for example, using a vacuum sputtering deposition, chemical vapor deposition (CVD) or physical vapor deposition (PVD) process. A solder mask is applied. Mechanically cleaning removes the sputtered copper coating in areas of the outer layer that are not protected by the solder mask.

Abstract translation: 提供了具有EMI屏蔽导电涂层的方法和结构，用于实现刚性卡和柔性电路的EMI屏蔽。 EMI屏蔽导电涂层沉积在外层上，例如使用真空溅射沉积，化学气相沉积（CVD）或物理气相沉积（PVD）工艺。 使用焊接掩模。 机械清洁将外部层的不被焊接掩模保护的区域中的溅射铜涂层除去。