公开(公告)号：US20040203237A1

公开(公告)日：2004-10-14

申请号：US10789829

申请日：2004-02-27

Applicant: STMICROELECTRONICS LTD.

Inventor： Brian Laffoley

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H05K1/141 ,  H01L24/05 ,  H01L24/16 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16238 ,  H01L2924/14 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/09427 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2924/00

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract translation: 安装具有延伸穿过其下表面的一部分的至少一个触点的电子部件的方法可以包括提供比部件的下表面更小的面积的支撑件，并具有用于连接到触头的接触垫。 接触垫可以具有延伸穿过支撑件的上表面邻近一个边缘的第一部分和从边缘延伸穿过支撑件的侧表面的第二部分。 该方法还可以包括将电子部件和支撑件定位成邻近支撑件的上表面的部件的下表面。 这样做使得接触垫的第一部分与接触件的第一部分对齐并且与接触垫的第一部分间隔开，并且接触垫的第二部分与接触件的第二部分对齐并设置在接触件的第二部分的内侧。

公开(公告)号：US20030197286A1

公开(公告)日：2003-10-23

申请号：US10243428

申请日：2002-09-12

Inventor： Robert M. Hilton

IPC: H01L023/48

CPC classification number: H01L24/81 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/171 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/381 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09427 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A flip-chip package uses a substrate having bond pad spacing that matches terminal spacing on a chip at an elevated temperature, such as the temperature of the chip during bonding to the substrate, the melting point of solder used on the chip, a temperature within the range of thermal cycling of the chip, or an operating temperature of the chip. Matching spacing at an elevated temperature permits a better alignment at the bonding temperature for formation of stronger bonds.

Abstract translation: 倒装芯片封装使用具有接合焊盘间隔的衬底，其在升高的温度下与芯片上的端子间隔匹配，例如在与衬底结合期间芯片的温度，芯片上使用的焊料的熔点， 芯片的热循环范围或芯片的工作温度。 在升高的温度下的匹配间距允许在结合温度下更好地对准以形成更强的键。

公开(公告)号：US06427901B2

公开(公告)日：2002-08-06

申请号：US09774850

申请日：2001-01-31

Applicant: Mindaugas F. Dautartas

Inventor： Mindaugas F. Dautartas

IPC: B23K3102

CPC classification number: H05K3/341 ,  B23K1/0016 ,  B23K35/3013 ,  B23K2101/36 ,  B23K2101/42 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09036 ,  H05K2201/09427 ,  H05K2201/09472 ,  H05K2203/0465 ,  H05K2203/048 ,  Y02P70/613

Abstract: A solder bonding system that includes a substrate having a recess and a conductive pad having a width. The conductive pad is disposed in the recess of the substrate. The solder bonding system also includes a solder pad contacting the conductive pad. The solder pad has a width greater than the width of the conductive pad. When the solder pad is heated, it forms a stable solder bond between the conductive pads.

Abstract translation: 一种焊接接合系统，其包括具有凹部的基板和具有宽度的导电焊盘。 导电焊盘设置在基板的凹部中。 焊接接合系统还包括与导电焊盘接触的焊盘。 焊盘的宽度大于导电焊盘的宽度。 当焊盘被加热时，它在导电焊盘之间形成稳定的焊料接合。

公开(公告)号：US20020053467A1

公开(公告)日：2002-05-09

申请号：US09951823

申请日：2001-09-13

Inventor： Uta Gebauer ,  Volker Strutz

IPC: H01L023/488 ,  H01L029/40 ,  H01L029/41

CPC classification number: H01L24/16 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/16105 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/81898 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/0373 ,  H05K2201/09427 ,  H05K2201/10242 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: The invention relates to an electronic component (1) with external connection elements (2) and to a method of electrically connecting and/or fixing an electronic component (1) and a printed-circuit board (15). For this purpose, the electronic component (1) has capillary elements (6) as external connection elements (2), which are connected to contact connection areas (3) of a leadframe (4) or to contact areas of a chip (5). The capillary element (6) protrudes out of the electronic component (1) and has on its protruding end (7) a suction opening (8) with capillary action.

Abstract translation: 本发明涉及一种具有外部连接元件（2）的电子部件（1）以及电子部件（1）和印刷电路板（15）的电连接和/或固定方法。 为此，电子部件（1）具有作为外部连接元件（2）的毛细管元件（6），其连接到引线框架（4）的接触连接区域（3）或接触芯片（5）的区域， 。 毛细管元件（6）从电子部件（1）突出，并且在其突出端（7）上具有毛细作用的吸入口（8）。

公开(公告)号：US06326239B1

公开(公告)日：2001-12-04

申请号：US09287016

申请日：1999-04-06

Applicant: Yasutomi Asai ,  Hirokazu Imai ,  Yuji Ootani ,  Takashi Nagasaka

Inventor： Yasutomi Asai ,  Hirokazu Imai ,  Yuji Ootani ,  Takashi Nagasaka

IPC: H01L2328

CPC classification number: H01L23/544 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/245 ,  H05K3/305 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/099 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10992 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A mounting structure includes a laminated ceramic capacitor mounted on a mounting substrate. The laminated ceramic capacitor includes a main body chip made by a ceramic dielectric, internal layer electrodes, and pair of terminal electrodes. The mounting substrate is made by alumina substrate, and has a pair of substrate electrodes made by copper plating. The laminated ceramic capacitor is mounted on the mounting substrate by using an Ag paste. Here, the substrate electrode is set to be smaller than the Ag paste. That is, the Ag paste is extruded from the terminal electrodes and the substrate electrode so as to contact to both of the main body chip and the mounting substrate. Because the Ag paste has a high adhesive strength compared to that when it is bonded with a metal, total adhesive strength can be improved. Consequently, the reliability of mounting can be improved.

Abstract translation: 安装结构包括安装在安装基板上的层叠陶瓷电容器。 层叠陶瓷电容器包括由陶瓷电介质制成的主体芯片，内层电极和一对端子电极。 安装基板由氧化铝基板制成，并具有通过镀铜制成的一对基板电极。 层叠陶瓷电容器通过使用Ag浆料安装在安装基板上。 这里，将基板电极设定为小于Ag糊料。 也就是说，Ag膏从端子电极和基板电极挤出，以便与主体芯片和安装基板接触。 由于Ag糊料与金属粘合时的粘合强度高，所以可以提高总的粘合强度。 因此，可以提高安装的可靠性。

公开(公告)号：US20010020996A1

公开(公告)日：2001-09-13

申请号：US09778812

申请日：2001-02-08

Applicant: ADVANCED DISPLAY INC.

Inventor： Hiroshi Ueda ,  Hitoshi Morishita

IPC: G02F001/1345

CPC classification number: H05K3/361 ,  G02F1/1345 ,  H05K1/117 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427

Abstract: The present invention is directed to a liquid crystal display including: a plurality of electrode terminals arranged on one of end faces of a TFT glass substrate in such a manner as to be aligned on an imaginary line; and a plurality of lead terminals of a tape carrier package aligned on the electrode terminals, said plurality of lead terminals connected through an anisotropic conductive film; wherein the electrode terminals near the end face of the glass substrate is formed obliquely in such a manner as to be extended in the direction of both right and left with respect to the plurality of electrode terminals.

Abstract translation: 本发明涉及一种液晶显示器，它包括：多个电极端子，以在假想线上对齐的方式设置在TFT玻璃基板的一个端面上; 以及在所述电极端子上排列的带状载体封装体的多个引线端子，所述多个引线端子通过各向异性导电膜连接; 其中靠近玻璃基板的端面的电极端子以相对于多个电极端子在左右两个方向上延伸的方式倾斜地形成。

公开(公告)号：US06167615A

公开(公告)日：2001-01-02

申请号：US09056101

申请日：1998-04-06

Applicant: Bao-Tong Ma ,  Amit Kumar Sarkhel ,  Ping Kwong Seto

Inventor： Bao-Tong Ma ,  Amit Kumar Sarkhel ,  Ping Kwong Seto

IPC: H05K334

CPC classification number: H05K3/3421 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/1216 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2201/09427 ,  H05K2201/10689 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00012

Abstract: Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.

Abstract translation: 在基板上的电路和具有非常精细间隔的引线的部件之间需要电连接的情况下，在要与电路形成这种连接的点处，在基板上形成焊盘。 使用具有特定公差的具有厚度和孔径的特定描述的模板来沉积焊膏。 该部件定位成使得其连接的引线与相应的焊盘相邻，并且通过回流形成焊料合金的一致且可靠的电接头的焊膏来完成电连接。

公开(公告)号：US5838070A

公开(公告)日：1998-11-17

申请号：US770406

申请日：1996-12-20

Applicant: Toshimichi Naruse ,  Noriaki Sakamoto

Inventor： Toshimichi Naruse ,  Noriaki Sakamoto

IPC: H05K1/11 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52

CPC classification number: H05K1/111 ,  H05K3/3442 ,  H01L2924/0002 ,  H05K1/11 ,  H05K2201/09427 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2203/042 ,  H05K3/3431 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic circuit apparatus has first and second pad electrodes arranged on a substrate to be separated by a first interval, first and second chip electrodes to be separated by a second interval smaller than the first interval, a first solder for fixedly attaching the first chip electrode to the first pad electrode and a second solder for fixedly attaching the second chip electrode to the second pad electrode. Because the first interval is longer than the second interval, any constricted portion does not exist in each of the first and second solders. Therefore, because any stress is not concentrated on any portion of each of the first and second solders, the occurrence of a crack in each of the first and second solders can be prevented.

Abstract translation: 电子电路装置具有布置在基板上的第一和第二焊盘电极，以第一间隔分开，第一和第二芯片电极以比第一间隔小的第二间隔隔开;第一焊料，用于固定地附接第一芯片电极 到第一焊盘电极和用于将第二芯片电极固定地附接到第二焊盘电极的第二焊料。 因为第一间隔长于第二间隔，所以第一和第二焊料的每一个中都不存在任何收缩部分。 因此，由于任何应力都不集中在第一和第二焊料的每一个的任何部分上，所以可以防止在第一和第二焊料中的每一个中出现裂纹。

公开(公告)号：US5258866A

公开(公告)日：1993-11-02

申请号：US850327

申请日：1992-03-10

Applicant: Takehiro Ishikawa ,  Takao Tanaka ,  Humihiko Sagawa

Inventor： Takehiro Ishikawa ,  Takao Tanaka ,  Humihiko Sagawa

IPC: G02F1/1345 ,  G02F1/13 ,  H05K1/02 ,  H05K3/36 ,  G02F1/1343

CPC classification number: G02F1/13452 ,  H05K3/361 ,  G02F1/1345 ,  H05K1/0271 ,  H05K2201/09427

Abstract: A method of connecting a liquid crystal display element and a flexible circuit board to each other by which electrode terminals of the flexible circuit board and lead terminals of the flexible circuit board are registered accurately with each other after connection. According to this method, the terminal pitch of the electrode terminals of the liquid crystal display element is represented by P, the terminal pitch of the lead electrodes before a pressurizing and heating step is represented by p, and the elongation percentage of a base film of the flexible circuit board by the pressurizing and heating step is represented by .alpha., either one of the terminal pitches P and p is set in advance relative such that the relationship of P=(1+.alpha.)p may be satisfied.

Abstract translation: 将柔性电路板的电极端子与柔性电路板的引线端子的连接后的液晶显示元件和柔性电路基板相互连接的方法彼此精确地对准。 根据该方法，液晶显示元件的电极端子的端子间距用P表示，加压加热工序前的引线电极的端子间距由p表示，基膜的延伸率 通过加压和加热步骤的柔性电路板由α表示，端子间距P和p中的任一个预先相对设定，使得可以满足P =（1 +α）p的关系。

公开(公告)号：US11909134B2

公开(公告)日：2024-02-20

申请号：US18190058

申请日：2023-03-24

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Fei Yu ,  Shiping Cheng

IPC: H01R12/52 ,  H05K1/11 ,  H01R12/55 ,  H01R13/11 ,  H01R13/187 ,  H01R12/72 ,  H05K1/02

CPC classification number: H01R12/52 ,  H01R12/55 ,  H01R12/72 ,  H01R13/11 ,  H01R13/187 ,  H05K1/117 ,  H01R12/721 ,  H05K1/0219 ,  H05K1/0245 ,  H05K2201/0746 ,  H05K2201/094 ,  H05K2201/09145 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/10325 ,  H05K2201/10356

Abstract: An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.