Abstract:
A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.
Abstract:
A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.
Abstract:
A system and method for electrically and thermally coupling adjacent IC packages to one another in a stacked configuration is provided. A flex circuit is inserted in part between ICs to be stacked and provides a connective field that provides plural contact areas that connect to respective leads of the ICs. Thus, the flex does not require discrete leads which must be individually aligned with the individual leads of the constituent ICs employed in the stack. The principle may be employed to aggregate two or more contact areas for respective connection to leads of constituent ICs but is most profitably employed with a continuous connective field that provides contact areas for many leads of the ICs.
Abstract:
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to, higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
Abstract:
A method 10 for producing a circuit assembly 30 having a polymeric member 14 upon which conductors, such as conductors 64, may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.
Abstract:
A flex circuit and cable assembly for interconnecting printed circuit boards includes a flexible insulating substrate having a conductive ground plane formed on one side and first and second sets of longitudinally extending and interdigitated conductive traces on the other side. The traces of the first and second sets alternate with and are laterally spaced from one another and are provided with an array of connection pads formed on the conductive traces for connection to the tails of an electrical connector or header. Each connection array is defined by a first set of laterally enlarged connection pads associated with each conductive trace of the first set of conductive traces and formed along a first lateral axis and by a second set of laterally enlarged connection pads associated with each conductive trace of the second set of conductive traces and formed along a second lateral axis that is longitudinally spaced from the first lateral axis. An electrical connector or header having first and second sets of contacts is assembled to the connection array by folding the flex circuit about a fold axis intermediate the two lateral axes and connecting the tail portions of the first set of electrical contacts to the connection pads of the first set of traces and the tails of the second set electrical contact the connection pads of the second set of traces.
Abstract:
A flexible printed circuit substrate is bent in a flattened rectangular C-shape and electronic parts generating heat are mounted on the inner surface of a central portion of the C-shaped substrate. Then a radiating heat-sink plate is adhered on the outer surface of that central portion. Temperature-sensitive electronic parts are mounted on one end portion of the C-shaped substrate and parts consisting of a power supply circuit are mounted on the other end portion. Then the entire assembly is accommodated in a housing having a connector.
Abstract:
In a printed circuit board having land parts provided for connecting electric circuit forming elements and conductors interconnecting the elements. The conductors interconnect the land parts without the use of intercrossed connection wires over the conductors between the land parts.
Abstract:
A method for increasing the packaging density of discrete electronic components. The components are mounted to a flexible printed circuit board at predetermined locations with normal orientation with respect to the board. The board is then folded in such a manner that the bodies of the components are mutually interleaved and are interleaved with other circuit components and terminals. A package with such interleaved components is also disclosed.
Abstract:
A printed wiring card assembly in which electronic components can be plugged in to mechanically mount and electrically interconnect into the assembly, including a flexible printed wiring sheet held in resilient contact between a component positioner and ridges on a support base. The positioner includes slots and a guide ramp for guiding the component leads insertable between the positioner and conductive connecting portions on the printed wiring sheet. A layer of resilient material on the ridges urges the conductive connecting portions into resilient contact engagement with the component leads.