Circuit module with thermal casing systems and methods
    94.
    发明申请
    Circuit module with thermal casing systems and methods 有权
    具有热套管系统和方法的电路模块

    公开(公告)号:US20060090102A1

    公开(公告)日:2006-04-27

    申请号:US11283355

    申请日:2005-11-18

    Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to, higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

    Abstract translation: 灵活的电路装有沿主要侧面或两侧设置的集成电路(IC)。 触点沿柔性电路分布,以提供模块与应用环境之间的连接。 填充的柔性电路围绕刚性衬底的边缘设置,从而将集成电路放置在衬底的一侧或两侧上,在衬底的一侧或两侧上具有一层或多层集成电路。 衬底形式优选地由导热材料设计,并且一个或多个热扩散器设置成与模块的组成集成电路中的至少一些热接触。 可选地,作为附加的热管理特征,模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。 在优选实施例中,来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小,同时提供用于从模块中排出热能的放大表面。

    Flex circuit and cable assembly
    96.
    发明授权
    Flex circuit and cable assembly 失效
    Flex电路和电缆组件

    公开(公告)号:US4902236A

    公开(公告)日:1990-02-20

    申请号:US271153

    申请日:1988-11-14

    Abstract: A flex circuit and cable assembly for interconnecting printed circuit boards includes a flexible insulating substrate having a conductive ground plane formed on one side and first and second sets of longitudinally extending and interdigitated conductive traces on the other side. The traces of the first and second sets alternate with and are laterally spaced from one another and are provided with an array of connection pads formed on the conductive traces for connection to the tails of an electrical connector or header. Each connection array is defined by a first set of laterally enlarged connection pads associated with each conductive trace of the first set of conductive traces and formed along a first lateral axis and by a second set of laterally enlarged connection pads associated with each conductive trace of the second set of conductive traces and formed along a second lateral axis that is longitudinally spaced from the first lateral axis. An electrical connector or header having first and second sets of contacts is assembled to the connection array by folding the flex circuit about a fold axis intermediate the two lateral axes and connecting the tail portions of the first set of electrical contacts to the connection pads of the first set of traces and the tails of the second set electrical contact the connection pads of the second set of traces.

    Abstract translation: 用于互连印刷电路板的柔性电路和电缆组件包括柔性绝缘基板,其具有形成在一侧上的导电接地平面以及另一侧上的第一组和第二组纵向延伸和交错导电迹线。 第一组和第二组的迹线彼此交替并且横向间隔开,并且设置有形成在导电迹线上的连接焊盘的阵列,用于连接到电连接器或接头的尾部。 每个连接阵列由与第一组导电迹线的每个导电迹线相关联并沿着第一横向轴线形成的第一组横向放大的连接焊盘以及与第二组横向放大的连接焊盘相关联的第二组横向放大的连接焊盘限定, 第二组导电迹线并且沿着与第一横向轴线纵向间隔开的第二横向轴线形成。 具有第一和第二组触点的电连接器或集管通过围绕两个横向轴线的折叠轴线折叠柔性电路而组装到连接阵列,并将第一组电触点的尾部部分连接到 第一组轨迹和第二组的尾部电接触第二组轨迹的连接垫。

    Method and apparatus for improving packaging density of discrete
electronic components
    99.
    发明授权
    Method and apparatus for improving packaging density of discrete electronic components 失效
    用于提高分立电子部件的封装密度的方法和装置

    公开(公告)号:US4085433A

    公开(公告)日:1978-04-18

    申请号:US744136

    申请日:1976-11-22

    Abstract: A method for increasing the packaging density of discrete electronic components. The components are mounted to a flexible printed circuit board at predetermined locations with normal orientation with respect to the board. The board is then folded in such a manner that the bodies of the components are mutually interleaved and are interleaved with other circuit components and terminals. A package with such interleaved components is also disclosed.

    Abstract translation: 一种用于提高分立电子部件的封装密度的方法。 组件在相对于板的正常定向的预定位置安装到柔性印刷电路板。 然后以这样一种方式折叠该板,使得这些部件的主体相互交错并与其他电路部件和端子交错。 还公开了具有这种交错部件的封装。

    Connectorless plug-in printed wiring card
    100.
    发明授权
    Connectorless plug-in printed wiring card 失效
    无连接插入式印刷卡

    公开(公告)号:US3774140A

    公开(公告)日:1973-11-20

    申请号:US3774140D

    申请日:1972-10-24

    Inventor: REIMER W

    Abstract: A printed wiring card assembly in which electronic components can be plugged in to mechanically mount and electrically interconnect into the assembly, including a flexible printed wiring sheet held in resilient contact between a component positioner and ridges on a support base. The positioner includes slots and a guide ramp for guiding the component leads insertable between the positioner and conductive connecting portions on the printed wiring sheet. A layer of resilient material on the ridges urges the conductive connecting portions into resilient contact engagement with the component leads.

    Abstract translation: 一种印刷线路卡组件,其中电子部件可以被插入以机械地安装和电互连到组件中,包括柔性印刷线路板,该柔性印刷线路板在部件定位器和支撑基座上的脊之间保持弹性接触。 定位器包括槽和引导斜面,用于引导可插入定位器和印刷布线板上的导电连接部分之间的部件引线。 脊上的一层弹性材料促使导电连接部分与部件引线弹性接触接合。

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