公开(公告)号：US20080151521A1

公开(公告)日：2008-06-26

申请号：US11737147

申请日：2007-04-19

Applicant: YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K7/04 ,  H01L23/12

CPC classification number: H05K1/0253 ,  H05K1/0224 ,  H05K2201/09681

Abstract: A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.

Abstract translation: 提供电路板用于改善信号质量，包括布置在其上的多个信号迹线的信号平面和由阵列中彼此连接的多个瓦片形成的接地平面。 每个瓷砖由地面痕迹形成。 映射在接地平面上的信号迹线的不同线段以相似的角度交叉瓦片的接地迹线，从而最小化接地迹线和信号迹线之间的相互作用，以减少信号迹线的阻抗的差异。

公开(公告)号：US07378599B2

公开(公告)日：2008-05-27

申请号：US10338720

申请日：2003-01-09

Applicant: Junichi Somei

Inventor： Junichi Somei

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K1/0201 ,  H01Q1/247 ,  H01Q1/38 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0271 ,  H05K1/116 ,  H05K3/42 ,  H05K3/4688 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09681 ,  H05K2201/09718

Abstract: A printed circuit board has a substrate formed of an insulator, a strip line provided on a front surface of the substrate, and a ground metal layer provided on a rear surface of the substrate. An opening is provided in the ground metal layer to reach the substrate. A radio wave receiving converter and an antenna device each include the printed circuit board.

Abstract translation: 印刷电路板具有由绝缘体形成的基板，设置在基板的前表面上的带状线和设置在基板的后表面上的接地金属层。 在接地金属层中设置开口以到达基板。 无线电波接收转换器和天线装置各自包括印刷电路板。

公开(公告)号：US07372144B2

公开(公告)日：2008-05-13

申请号：US10793576

申请日：2004-03-04

Applicant: Achyut Dutta

Inventor： Achyut Dutta

IPC: H01L21/00

CPC classification number: H01L23/66 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01P1/2005 ,  H01P3/08 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/024 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09681 ,  Y02P80/30 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and increase the bandwidth of the interconnects and also reduce the signal propagation delay, respectively. Ideally, the speed of the electrical signal on the signal line can be reached to speed of the light in the air, and the bandwidth can be reached to closer to the optical fiber. The interconnect systems consists of the signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, and the ground plan. The signal line proposed in this invention could be made any type of signal line configuration for example, microstripline, strip line or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations. The interconnect system based on the fundamental techniques provided in this invention, can be used for on-chip interconnects where the high speed electronics devices are connected by the signal line laid on the oxide or dielectric material. Again, the interconnect system based on the fundamental techniques provided in this invention, can also be used for off-chip interconnects (chip-to-chip interconnects), where the whole portion or portion of the PCB on which high speed chips are to be connected, are having the dielectric system with opened trench or slot to reduce the microwave loss. High scale chip-to-chip interconnection using of the multilayered PCB is possible. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. The main advantages of this invention are to make high speed interconnects systems for on-chip and off-chip interconnects. More over, this fundamental technology is also used for the high sped die package, high speed connector, and high speed cables where conventional manufacturing technology can be used and yet to increase the bandwidth of the interconnects.

公开(公告)号：US20080087456A1

公开(公告)日：2008-04-17

申请号：US11871498

申请日：2007-10-12

Applicant: Franz Michael Schuette

Inventor： Franz Michael Schuette

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K1/0207 ,  H05K1/0272 ,  H05K3/4641 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0379 ,  H05K2201/064 ,  H05K2201/09681 ,  Y10T29/49124

Abstract: Circuit board assemblies and methods that employ integrated heatspreaders to cool the assemblies and serve as electrical ground planes for the assemblies. Such a circuit board assembly includes a substrate having at least one circuit device on at least a first surface thereof and an electrical ground plane. The circuit device has a first set of solder connections electrically connected to the electrical ground plane and a second set of solder connections electrically connected to power and signal traces on the first surface of the substrate. The assembly further includes a heatspreader embedded in the substrate and defining an electrical element of the electrical ground plane as a result of being electrically connected to the first set of solder connections. The heatspreader is configured as a plate-mesh-plate laminate that defines a cavity containing a fluid for transferring heat from the circuit device.

Abstract translation: 电路板组件和方法采用集成散热器来冷却组件并用作组件的电接地平面。 这种电路板组件包括在其至少第一表面上具有至少一个电路装置的基板和电接地平面。 电路装置具有电连接到电接地平面的第一组焊接连接和电连接到衬底的第一表面上的功率和信号迹线的第二组焊接连接。 组件还包括嵌入在基板中并且由于电连接到第一组焊接连接而限定电接地平面的电元件的散热器。 散热器被配置为板网板层压板，其限定包含用于从电路装置传递热量的流体的空腔。

公开(公告)号：US20080079146A1

公开(公告)日：2008-04-03

申请号：US11902620

申请日：2007-09-24

Applicant: Yasuyuki Hattori ,  Toshikazu Endo ,  Masashi Katsumata ,  Takaaki Morita ,  Kenichi Kawabata

Inventor： Yasuyuki Hattori ,  Toshikazu Endo ,  Masashi Katsumata ,  Takaaki Morita ,  Kenichi Kawabata

IPC: H01L23/36

CPC classification number: H01L23/3735 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/0224 ,  H05K1/0298 ,  H05K1/185 ,  H05K3/0058 ,  H05K2201/09681 ,  H05K2201/09781 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A semiconductor-embedded substrate device according to the present invention can relax a thermal stress during fabrication or use and therefore has sufficient heat radiation properties and reliability. A semiconductor-embedded substrate (100) is a multilayer substrate obtained by stacking resin layers and has, inside of the resin layer (2), a semiconductor device (30) having a bump (32) connected to a terminal electrode (11) via an internal wiring (13) and connection plug (12). A heat radiation member (20) having an opening P in which one or more openings H have been formed is arranged immediately above and opposite to the back surface (30b) of the semiconductor device (30) and heat generated therein is transferred to and released from the heat radiation member (20).

Abstract translation: 根据本发明的半导体嵌入式衬底器件可以在制造或使用期间放松热应力，因此具有足够的散热性能和可靠性。 半导体嵌入式基板（100）是通过层叠树脂层而获得的多层基板，并且在树脂层（2）内部具有通过连接到端子电极（11）的具有凸块（32）的半导体装置（30） 内部布线（13）和连接插头（12）。 在半导体装置（30）的背面（30b）的正上方且相对配置有具有形成有一个或多个开口H的开口P的散热构件（20），并且将其中产生的热量转移到 从散热构件（20）释放。

公开(公告)号：US20080068313A1

公开(公告)日：2008-03-20

申请号：US11853309

申请日：2007-09-11

Applicant: Hyun-Min JANG

Inventor： Hyun-Min JANG

IPC: G09G3/36

CPC classification number: G02F1/13452 ,  G02F1/133608 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/118 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/09354 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09681 ,  H05K2201/10136

Abstract: A display device includes a display panel provided with an electrode pad, a light source to emit light to the display panel, a mold frame to support the light source; a bottom chassis to accommodate the mold frame, a driving part to apply a driving signal to the display panel connected to the electrode pad, and a driving circuit part that controls the driving part. The driving circuit part includes a first driving circuit board connected to the driving part and on which circuit components are mounted toward the mold frame, and a second driving circuit board connected to the first driving circuit board. The display device further includes a flexible circuit board to connect the first driving circuit board and the second driving circuit board.

Abstract translation: 显示装置包括：显示面板，设置有电极焊盘，向显示面板发光的光源;支撑光源的模架; 用于容纳模具框架的底部底盘，用于将驱动信号施加到连接到电极垫的显示面板的驱动部件，以及控制驱动部件的驱动电路部件。 驱动电路部分包括连接到驱动部分的第一驱动电路板，并且电路部件被安装到模架上，以及连接到第一驱动电路板的第二驱动电路板。 显示装置还包括用于连接第一驱动电路板和第二驱动电路板的柔性电路板。

公开(公告)号：US20080062688A1

公开(公告)日：2008-03-13

申请号：US11756971

申请日：2007-06-01

Applicant: Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

Inventor： Ellen O. Aeling ,  John R. David ,  Michael A. Meis ,  Ronald S. Steelman

IPC: F21V7/00 ,  B05D5/06

CPC classification number: F21V19/0015 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21K9/90 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/60 ,  H05K1/0287 ,  H05K1/11 ,  H05K1/189 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/09681 ,  H05K2201/10106 ,  H05K2201/10363 ,  H05K2203/063 ,  Y10T156/10

Abstract: The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures.

Abstract translation: 本公开一般涉及照明装置及其制造方法。 该器件特别地包括第一导体层，第一绝缘体层，设置在第一导体层上并且具有通过第一绝缘体层限定在其中的至少一个第一孔;第二导体层，设置在第一绝缘体层上并具有 通过所述第二导体层限定的至少一个第二孔，并且定位成与所述至少一个第一孔对准，以及光操纵层，其设置在所述第二导体层上并且具有通过所述光操纵层限定在其中的至少一对孔，包括 第三孔和第四孔，其中所述第三孔被定位成与所述至少一个第二孔和第一孔对准。

公开(公告)号：US20080029298A1

公开(公告)日：2008-02-07

申请号：US11462875

申请日：2006-08-07

Applicant: Roger Allen Booth ,  Matthew Stephen Doyle

Inventor： Roger Allen Booth ,  Matthew Stephen Doyle

IPC: H05K9/00

CPC classification number: H05K1/0218 ,  H05K1/0224 ,  H05K1/0253 ,  H05K3/061 ,  H05K3/3452 ,  H05K2201/09354 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2203/0542 ,  H05K2203/0571

Abstract: A method and structures with an EMI shielding electrically conductive coating are provided for implementing EMI shielding for rigid cards and flexible circuits. An EMI shielding electrically conductive coating is deposited on an outer layer, for example, using a vacuum sputtering deposition, chemical vapor deposition (CVD) or physical vapor deposition (PVD) process. A solder mask is applied. Mechanically cleaning removes the sputtered copper coating in areas of the outer layer that are not protected by the solder mask.

Abstract translation: 提供了具有EMI屏蔽导电涂层的方法和结构，用于实现刚性卡和柔性电路的EMI屏蔽。 EMI屏蔽导电涂层沉积在外层上，例如使用真空溅射沉积，化学气相沉积（CVD）或物理气相沉积（PVD）工艺。 使用焊接掩模。 机械清洁将外部层的不被焊接掩模保护的区域中的溅射铜涂层除去。

公开(公告)号：US07304369B2

公开(公告)日：2007-12-04

申请号：US11198285

申请日：2005-08-06

Applicant: Ronald J. Barnett

Inventor： Ronald J. Barnett

IPC: H01L23/552 ,  H01L23/34

CPC classification number: H01L23/66 ,  H01L23/49822 ,  H01L23/585 ,  H01L23/60 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/167 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2201/0969 ,  H01L2924/00

Abstract: A capacitive structure and technique for allowing near-instantaneous charge transport and reliable, wide-band RF ground paths in integrated circuit devices such as integrated circuit dies, integrated circuit packages, printed circuit boards, and electronic circuit substrates is presented. Methods for introducing resistive loss, dielectric loss, magnetic loss, and/or radiation loss in a signal absorption ring implemented around a non-absorptive area of one or more conductive layers of an integrated circuit structure to dampen laterally flowing Electro-Magnetic (EM) waves between electrically adjacent conductive layers of the device are also presented.

Abstract translation: 提出了用于在集成电路器件（例如集成电路管芯，集成电路封装，印刷电路板和电子电路基板）的集成电路器件中允许近瞬时电荷传送和可靠的宽带RF接地路径的电容结构和技术。 在集成电路结构的一个或多个导电层的非吸收区域周围实现的信号吸收环中引入电阻损耗，介电损耗，磁损耗和/或辐射损耗的方法，以阻尼侧向流动的电磁（EM） 还提供了装置的电相邻导电层之间的波。

公开(公告)号：US20070261882A1

公开(公告)日：2007-11-15

申请号：US11383185

申请日：2006-05-12

Applicant: Tse-Hsine Laio ,  Ting-Kuo Kao

Inventor： Tse-Hsine Laio ,  Ting-Kuo Kao

IPC: H05K1/00

CPC classification number: H05K1/0209 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2203/043

Abstract: In a printed circuit board and its heat dissipating metal surface layout, a layer of copper foil is coated onto the printed circuit board for dissipating heat, and the surface of the copper foil is covered by an insulating coating, and a bare copper is formed on the surface of copper foil which is not covered by the insulating coating, and the bare copper is arranged in a cross shape, or in the shape of “#”, so that when the printed circuit board goes through a soldering furnace, the cohesion of solder is even instead of aggregating at a same position or the center, so as to obtain a larger protruding area and facilitate dissipating heat and transmitting current.

Abstract translation: 在印刷电路板及其散热金属表面布置中，将一层铜箔涂覆在印刷电路板上用于散热，铜箔的表面被绝缘涂层覆盖，并且裸铜形成在 未被绝缘涂层覆盖的铜箔的表面和裸铜布置成十字形或“＃”形，使得当印刷电路板通过焊接炉时，其内聚力 焊料是均匀的，而不是在相同的位置或中心处聚集，以便获得更大的突出面积并且有助于散热和传输电流。