公开(公告)号：US20070152692A1

公开(公告)日：2007-07-05

申请号：US11323757

申请日：2005-12-30

Applicant: Thomas Kinsley

Inventor： Thomas Kinsley

IPC: G01R31/02

CPC classification number: B23K1/0016 ,  G01R31/048 ,  H05K1/0268 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10734 ,  H05K2203/163 ,  H05K2203/175 ,  Y02P70/611 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed.

Abstract translation: 本发明的实施例一般涉及测试存储器件与电路板或其他器件的连接。 在一个实施例中，公开了一种被配置为便于该设备与印刷电路板或其他设备之间的连续性测试的存储器件。 存储器件包括一个基片和两个通过测试路径彼此电耦合的连接焊盘。 还公开了一种用于测试存储器件和电路板或其它器件之间的连接的系统和方法。

公开(公告)号：US20070149027A1

公开(公告)日：2007-06-28

申请号：US11377867

申请日：2006-03-16

Applicant: Chao-Jung Chen ,  Chien-Lung Tseng ,  Yi-Lun Wu

Inventor： Chao-Jung Chen ,  Chien-Lung Tseng ,  Yi-Lun Wu

IPC: H01R13/625

CPC classification number: H01R12/7052 ,  H01R24/50 ,  H05K1/0243 ,  H05K1/182 ,  H05K2201/09063 ,  H05K2201/09809 ,  H05K2201/10446 ,  H05K2201/10568 ,  H05K2203/167

Abstract: A signal connector comprises a main body for receiving a coaxial cable, thereby conducting electric connection between the signal connector and the coaxial cable; a first mounting portion coupled to and extending from the main body in a first direction and having a first mounting surface attachable to a circuit board; and a first coupling member coupled to the first mounting portion and protruding from the first mounting surface to be inserted into a hole in the circuit board, thereby securing the signal connector on the circuit board. The aforementioned structure makes the signal connector resistant to frequent plugging/unplugging actions.

Abstract translation: 信号连接器包括用于接收同轴电缆的主体，由此在信号连接器和同轴电缆之间进行电连接; 第一安装部分，其沿着第一方向联接到主体并且从主体延伸并且具有可附接到电路板的第一安装表面; 以及耦合到所述第一安装部分并且从所述第一安装表面突出以插入所述电路板中的孔中的第一联接构件，从而将所述信号连接器固定在所述电路板上。 上述结构使得信号连接器抵抗频繁的插拔/拔出动作。

公开(公告)号：US20070018757A1

公开(公告)日：2007-01-25

申请号：US11524112

申请日：2006-09-19

Applicant: William McKinzie

Inventor： William McKinzie

IPC: H01P7/00

CPC classification number: H01G4/35 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/16 ,  H01P1/2005 ,  H01P1/211 ,  H05K1/0216 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/115 ,  H05K1/116 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/09809 ,  H01L2924/00

Abstract: Systems and methods are taught for blocking the propagation of electromagnetic waves in parallel-plate waveguide (PPW) structures. Periodic arrays of resonant vias are used to create broadband high frequency stop bands in the PPW, while permitting DC and low frequency waves to propagate. Particular embodiments include clusters of small vias that effectively function as one large via, thereby increasing stop band bandwidth and maximizing parallel plate capacitance. Cluster vias can be configured to additionally provide a shielded and impedance matched route within the interior area of the cluster through which signal vias can connect transmission lines disposed in planes lying above and below the PPW. Important applications include electromagnetic noise reduction in layered electronic devices such as circuit boards, ceramic modules, and semiconductor chips.

Abstract translation: 教导系统和方法阻止平行板波导（PPW）结构中电磁波的传播。 谐振通孔的周期阵列用于在PPW中产生宽带高频阻带，同时允许DC和低频波传播。 具体实施例包括有效地用作一个大通孔的小通孔簇，从而增加阻带带宽并最大化平行板电容。 集群通孔可以被配置为在簇的内部区域内另外提供屏蔽和阻抗匹配的路由，信号通孔可以通过该通孔连接布置在PPW上方和下方的平面中的传输线。 重要的应用包括诸如电路板，陶瓷模块和半导体芯片的分层电子设备中的电磁降噪。

公开(公告)号：US20070010141A1

公开(公告)日：2007-01-11

申请号：US11483303

申请日：2006-07-06

Applicant: Toshiro Izuchi ,  Kazuo Ono ,  Kensuke Nakanishi ,  Hiroaki Onishi

Inventor： Toshiro Izuchi ,  Kazuo Ono ,  Kensuke Nakanishi ,  Hiroaki Onishi

IPC: H01R4/02

CPC classification number: H05K3/341 ,  H04R1/06 ,  H04R19/016 ,  H04R31/006 ,  H05K1/0243 ,  H05K3/3452 ,  H05K2201/09809 ,  H05K2201/0989 ,  H05K2201/10083 ,  H05K2201/10583 ,  H05K2203/1178 ,  Y02P70/613

Abstract: To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape. In the case where a component having a central terminal and a peripheral terminal is mounted on the mounting substrate, each part of the mounting substrate has the characteristics described below. That is, the electrode formed on the mounting substrate includes a central electrode part that faces the central terminal, a plurality of outer electrode parts that face part of the peripheral terminal, and a linkage electrode part that interconnects the outer electrode parts. The solder part is formed on each of the central electrode part and the outer electrode parts. The gas-escape groove is configured to allow the gas inside the peripheral terminal to escape to the outside.

Abstract translation: 为了提供一种安装基板，其需要减少量的焊料并减少焊料在电子部件内部的热效应，以及要安装在基板上的麦克风。 根据本发明的安装基板包括：形成在形成在安装基板上的电极的一部分上的焊料部分; 形成为防止焊料部分的焊料流出预定范围的抗蚀剂膜; 以及由不存在电极和抗蚀剂膜构成的气体排出槽，能够使焊接时产生的气体逸出。 在具有中心端子和外围端子的部件安装在安装基板上的情况下，安装基板的各部分具有下述特征。 也就是说，形成在安装基板上的电极包括面向中心端子的中心电极部件，与外围端子的一部分相对的多个外部电极部件和互连外部电极部件的连接电极部件。 焊料部分形成在每个中心电极部分和外部电极部分上。 排气槽构造成允许外围端子内的气体逸出到外部。

公开(公告)号：US07149092B2

公开(公告)日：2006-12-12

申请号：US10828307

申请日：2004-04-21

Applicant: Daisuke Iguchi

Inventor： Daisuke Iguchi

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0251 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/12042 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/0245 ,  H05K1/115 ,  H05K1/162 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/0949 ,  H05K2201/09636 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10689 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In a printed circuit board of the invention, a first signal wiring layer, a first ground layer, a second ground layer and a second signal wiring layer are laminated via an insulating material. A first signal wiring is formed on the first signal wiring layer and a second signal wiring is formed on the second signal wiring layer. The two signal wirings are connected via a first through hole. The conductive first ground layer and the conductive second ground layer are connected via a second through hole. The second through hole is insulated from the first through hole and formed so as to surround the first through hole.

Abstract translation: 在本发明的印刷电路板中，通过绝缘材料层叠第一信号布线层，第一接地层，第二接地层和第二信号布线层。 第一信号布线形成在第一信号布线层上，第二信号布线形成在第二信号布线层上。 两个信号布线通过第一通孔连接。 导电第一接地层和导电第二接地层经由第二通孔连接。 第二通孔与第一通孔绝缘并形成为围绕第一通孔。

公开(公告)号：US20060255877A1

公开(公告)日：2006-11-16

申请号：US11301382

申请日：2005-12-12

Applicant: Shin-Shing Jiang ,  Sheng-Yuan Lee

Inventor： Shin-Shing Jiang ,  Sheng-Yuan Lee

IPC: H01P5/08

CPC classification number: H01P5/085 ,  H01R24/50 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/3405 ,  H05K2201/093 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2201/10356

Abstract: A signal transmission structure is at the edge of a circuit board, and the circuit board is connected with a coaxial cable connector through the signal transmission structure. The coaxial cable connector has a signal pin and a plurality of supporting pins for clipping the circuit board. The signal transmission structure includes a reference plane and a conductive layer. The reference plane with a non-conductive area is inside the circuit board. The conductive layer is disposed on the surface of the circuit board and above one side of the reference plane. The conductive layer includes a signal pad and a signal line. The signal line is connected with the signal pad, and the signal pad is further connected with the signal pin of the coaxial connector. The projections of the signal pad and the portion of the signal line on the reference plane are in the non-conductive area.

Abstract translation: 信号传输结构位于电路板的边缘，并且电路板通过信号传输结构与同轴电缆连接器连接。 同轴电缆连接器具有用于限制电路板的信号引脚和多个支撑引脚。 信号传输结构包括参考平面和导电层。 具有不导电区域的参考平面位于电路板的内部。 导电层设置在电路板的表面上并在基准平面的一侧上方。 导电层包括信号焊盘和信号线。 信号线与信号焊盘连接，信号焊盘进一步与同轴连接器的信号引脚连接。 信号焊盘和参考平面上的信号线部分的投影在非导电区域中。

公开(公告)号：US20060214010A1

公开(公告)日：2006-09-28

申请号：US11401401

申请日：2006-04-11

Applicant: Benson Chan ,  Frank Egitto ,  Roy Magnuson ,  Voya Markovich ,  David Thomas

Inventor： Benson Chan ,  Frank Egitto ,  Roy Magnuson ,  Voya Markovich ,  David Thomas

IPC: G06K19/06

CPC classification number: G06K7/084 ,  G06K17/00 ,  G06K19/005 ,  G06K19/07354 ,  G06K2017/0064 ,  H05K1/0221 ,  H05K1/0222 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09809 ,  H05K2203/0733 ,  Y10T29/49165

Abstract: A circuitized substrate in which selected ones of the signal conductors are substantially surrounded by shielding members which shield the conductors during passage of high frequency signals, e.g., to reduce noise. The shielding members may form solid members which lie parallel and/or perpendicular to the signal conductors, and may also be substantially cylindrical in shape to surround a conductive thru-hole which also forms part of the substrate. An electrical assembly and an information handling system are also defined.

Abstract translation: 电路化基板，其中所选择的信号导体基本上由在高频信号通过期间屏蔽导体的屏蔽构件包围，例如降低噪声。 屏蔽构件可以形成平行和/或垂直于信号导体的固体构件，并且也可以基本上为圆柱形，以包围也形成衬底的一部分的导电通孔。 还定义了电组件和信息处理系统。

公开(公告)号：US20060185892A1

公开(公告)日：2006-08-24

申请号：US11335125

申请日：2006-01-19

Applicant: Volker Guengerich ,  Horst Theuss

Inventor： Volker Guengerich ,  Horst Theuss

IPC: H05K1/16

CPC classification number: H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/66 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45033 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45686 ,  H01L2224/45688 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/86205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/1903 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0243 ,  H05K3/341 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10356 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/83205

Abstract: A semiconductor device with micro connecting elements and method for producing the same disclosed. In one embodiment, the semiconductor device includes a number of micro connecting elements for the high-frequency coupling of components of the semiconductor device. The micro connecting elements have an at least three-layered structural form with a first layer of conducting material, a second layer of insulating material and a third layer of conducting material. In this configuration, the first and third layers and extend along a common center line and shield one another against electromagnetic interference fields. The first and third layers and are fixed on correspondingly adapted pairs of contact terminal areas of the components.

Abstract translation: 具有微连接元件的半导体器件及其制造方法。 在一个实施例中，半导体器件包括用于半导体器件的部件的高频耦合的多个微连接元件。 微连接元件具有至少三层结构形式，其具有第一层导电材料，第二层绝缘材料和第三层导电材料。 在该配置中，第一和第三层沿公共中心线延伸并相互屏蔽电磁干扰场。 第一和第三层并且固定在部件的相应适应的接触端子区域对上。

公开(公告)号：US20060164190A1

公开(公告)日：2006-07-27

申请号：US11316417

申请日：2005-12-22

Applicant: David Sherrer ,  John Fisher

Inventor： David Sherrer ,  John Fisher

IPC: H01P3/06

CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

公开(公告)号：US20060152322A1

公开(公告)日：2006-07-13

申请号：US11296579

申请日：2005-12-07

Applicant: Ronald Whittaker ,  Joe Guerra ,  Ciprian Marcoci

Inventor： Ronald Whittaker ,  Joe Guerra ,  Ciprian Marcoci

IPC: H01F5/00

CPC classification number: H01F27/266 ,  H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.