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    Printed wiring board and a method of production thereof
    91.
    发明授权
    Printed wiring board and a method of production thereof 有权
    印刷电路板及其制造方法

    公开(公告)号：US08324506B2

    公开(公告)日：2012-12-04

    申请号：US12641498

    申请日：2009-12-18

    Applicant: Tomoyuki Ikeda

    Inventor： Tomoyuki Ikeda

    IPC: H05K1/03

    CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

    Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

    Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

    Method of manufacturing an interposer
    92.
    发明授权
    Method of manufacturing an interposer 失效
    制造插入件的方法

    公开(公告)号：US08322031B2

    公开(公告)日：2012-12-04

    申请号：US12211529

    申请日：2008-09-16

    Applicant: Chin Hui Chong ,  Choon Kuan Lee

    Inventor： Chin Hui Chong ,  Choon Kuan Lee

    IPC: H01K3/10

    CPC classification number: H01R12/526 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09836 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/4922

    Abstract: Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to a first electronic component. A second terminal is disposed on the second surface of the dielectric portion for connection to a second electronic component. The apparatus further includes a passage extending through the dielectric portion along a longitudinal axis oriented at an oblique angle relative to the first surface. The passage is at least partially filled with conductive material electrically connecting the first terminal to the second terminal.

    Abstract translation: 本文公开了具有倾斜通孔的电路板，微电子器件和其它设备。 在一个实施例中，用于互连电子部件的装置包括具有第一表面和第二表面的电介质部分。 第一端子设置在电介质部分的第一表面上，用于连接到第一电子部件。 第二端子设置在电介质部分的第二表面上，用于连接到第二电子部件。 该装置还包括沿着相对于第一表面以倾斜角定向的纵向轴线延伸通过电介质部分的通道。 该通道至少部分地填充有将第一端子与第二端子电连接的导电材料。

    INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    93.
    发明申请
    INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    插件基板及其制造方法

    公开(公告)号：US20120261179A1

    公开(公告)日：2012-10-18

    申请号：US13529729

    申请日：2012-06-21

    Applicant: Satoshi YAMAMOTO ,  Takanao SUZUKI ,  Masami MATSUYAMA

    Inventor： Satoshi YAMAMOTO ,  Takanao SUZUKI ,  Masami MATSUYAMA

    IPC: H05K1/11 ,  H05K3/42

    CPC classification number: H05K3/0029 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

    Abstract: An interposer substrate of the present invention includes a planar substrate, and through hole wiring that is formed by filling a through hole that connects together a first main surface and a second main surface of this substrate with a conductor. When the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape whose side walls are formed by an inside surface of the through hole, and two side faces of the trapezoid are not parallel to each other. The two side faces of the trapezoid are both inclined towards the same side relative to two perpendicular lines that are perpendicular to the first main surface or the second main surface at two apex points forming a top face or a bottom face of the trapezoid.

    Abstract translation: 本发明的内插基板包括平面基板和通孔布线，该通孔布线通过填充将该基板的第一主表面和第二主表面连接在一起的通孔而形成。 当在基板的垂直剖视图中看到通孔时，通孔具有梯形，其侧壁由通孔的内表面形成，并且梯形的两个侧面不平行于每个 其他。 梯形的两个侧面都相对于形成梯形的顶面或底面的两个顶点处垂直于第一主表面或第二主表面的两条垂直线而朝向相同侧倾斜。

    Spacer, and its manufacturing method
    94.
    发明授权
    Spacer, and its manufacturing method 有权
    隔板及其制造方法

    公开(公告)号：US08174116B2

    公开(公告)日：2012-05-08

    申请号：US12674761

    申请日：2008-08-25

    Applicant: Koichiro Masuda ,  Tooru Mori

    Inventor： Koichiro Masuda ,  Tooru Mori

    IPC: H01L23/34

    CPC classification number: H01L23/49816 ,  H01G2/06 ,  H01L23/49805 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09836 ,  H05K2201/10378 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

    Abstract: Provided are a spacer capable of avoiding a poor connection due to the suction of solder when the clearance width between a soldered semiconductor device and a printed circuit board is made constant, and a manufacturing method for the spacer. The spacer includes an electrically insulating base member, and at least one solder guiding terminal. The base member has a bottom face, a top face and at least one side face, of which the bottom face and the top face are out of contact with each other whereas the side face contacts one or both the bottom face and the top face. The solder guiding terminal covers the bottom face partially, the top face partially, and the side face partially or wholly. A solder guiding face as the surface of a portion of the solder guiding terminal covering the side face is not normal to the bottom face.

    Abstract translation: 提供了当焊接的半导体器件和印刷电路板之间的间隙宽度恒定时，能够避免由于焊料的吸引引起的连接不良的隔离件以及间隔件的制造方法。 间隔件包括电绝缘基底构件和至少一个焊料引导端子。 基部构件具有底面，顶面和至少一个侧面，底面和顶面彼此不接触，而侧面接触底面和顶面中的一个或两个。 焊料引导端子部分或全部部分覆盖底面，部分地覆盖侧面。 作为覆盖侧面的焊料引导端子的一部分的表面的焊料引导面与底面不正交。

    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
    97.
    发明申请
    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF 审中-公开
    印刷电路板及其生产方法

    公开(公告)号：US20120012464A1

    公开(公告)日：2012-01-19

    申请号：US13242166

    申请日：2011-09-23

    Applicant: Tomoyuki IKEDA

    Inventor： Tomoyuki IKEDA

    IPC: C25D5/02

    CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

    Abstract: A method for manufacturing a printed wiring board including providing an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface such that a first opening portion having an opening on the first surface and tapering inward is formed, irradiating laser upon the second surface such that a second opening portion having an opening on the second surface, tapering inward and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming an electroless plated film on an inner wall surface of the penetrating-hole, and forming an electrolytic plated film on the electroless plated film such that a through hole conductor structure is formed in the penetrating-hole. The opening of the first portion has an axis of the center of gravity offset with respect to that of the opening of the second opening portion.

    Abstract translation: 一种制造印刷电路板的方法，包括：提供具有第一和第二表面的绝缘树脂基板，在第一表面上照射激光，使得形成在第一表面上具有开口并向内逐渐变细的第一开口部分，在第二表面上照射激光 形成第二开口部，该第二开口部在第二面上形成有向内侧逐渐变细并且与第一开口部连通的第二开口部，形成有具有第一开口部和第二开口部的贯通孔，在内部形成无电解电镀膜 并且在所述化学镀膜上形成电解镀膜，使得在所述贯通孔中形成贯通孔导体结构。 第一部分的开口具有相对于第二开口部分的开口偏心的重心轴线。

    Devices including sloped vias in a substrate and devices including spring-like deflecting contacts
    98.
    发明授权
    Devices including sloped vias in a substrate and devices including spring-like deflecting contacts 有权
    设备包括衬底中的倾斜通孔和包括弹簧状偏转接触件的装置

    公开(公告)号：US07928579B2

    公开(公告)日：2011-04-19

    申请号：US11588977

    申请日：2006-10-27

    Applicant: James M. Wark ,  Syed S. Ahmad

    Inventor： James M. Wark ,  Syed S. Ahmad

    IPC: H01L23/02 ,  H01L23/34 ,  H01L23/48

    CPC classification number: H01L23/5226 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/0029 ,  H05K3/0041 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09836 ,  H01L2924/00

    Abstract: Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. The vias are formed within the substrate to have a longitudinal axis sloped at an angle with respect to a reference line extending perpendicular to the first surface and the second surface of the substrate. The vias may be formed from the first surface to the opposing second surface, or the via may be formed as a first blind opening from the first surface, then a second opening may be formed from the second surface to be aligned with the first opening. Vias may be formed completely through a first substrate and a second substrate, and the substrates may be bonded together. Semiconductor devices including the vias of the present invention are also disclosed. A method of forming spring-like contacts is also disclosed.

    Abstract translation: 公开了形成通孔的方法。 所述方法包括提供具有第一表面和相对的第二表面的基底。 通孔形成在衬底内，以具有相对于垂直于衬底的第一表面和第二表面延伸的参考线成一定角度倾斜的纵向轴线。 通孔可以由第一表面形成到相对的第二表面，或者通孔可以从第一表面形成为第一盲孔，然后可以从第二表面形成第二开口以与第一开口对准。 可以通过第一基板和第二基板完全形成通孔，并且基板可以结合在一起。 还公开了包括本发明的通孔的半导体器件。 还公开了一种形成弹簧状触点的方法。

    Slanted vias for electrical circuits on circuit boards and other substrates
    100.
    发明授权
    Slanted vias for electrical circuits on circuit boards and other substrates 失效
    电路板和其他基板上的电路的倾斜通孔

    公开(公告)号：US07435913B2

    公开(公告)日：2008-10-14

    申请号：US11475479

    申请日：2006-06-26

    Applicant: Chin Hui Chong ,  Choon Kuan Lee

    Inventor： Chin Hui Chong ,  Choon Kuan Lee

    IPC: H01R12/04 ,  H05K1/00

    CPC classification number: H01R12/526 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09836 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/4922

    Abstract: Circuit boards, microelectronic devices, and other apparatuses having slanted vias are disclosed herein. In one embodiment, an apparatus for interconnecting electronic components includes a dielectric portion having a first surface and a second surface. A first terminal is disposed on the first surface of the dielectric portion for connection to a first electronic component. A second terminal is disposed on the second surface of the dielectric portion for connection to a second electronic component. The apparatus further includes a passage extending through the dielectric portion along a longitudinal axis oriented at an oblique angle relative to the first surface. The passage is at least partially filled with conductive material electrically connecting the first terminal to the second terminal.

    Abstract translation: 本文公开了具有倾斜通孔的电路板，微电子器件和其它设备。 在一个实施例中，用于互连电子部件的装置包括具有第一表面和第二表面的电介质部分。 第一端子设置在电介质部分的第一表面上，用于连接到第一电子部件。 第二端子设置在电介质部分的第二表面上，用于连接到第二电子部件。 该装置还包括沿着相对于第一表面以倾斜角定向的纵向轴线延伸通过电介质部分的通道。 该通道至少部分地填充有将第一端子与第二端子电连接的导电材料。

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