公开(公告)号：US07342180B2

公开(公告)日：2008-03-11

申请号：US11288749

申请日：2005-11-28

Applicant: Bing-Hoang Ko ,  Feng-Yi Chang ,  Chih-Wen Wu

Inventor： Bing-Hoang Ko ,  Feng-Yi Chang ,  Chih-Wen Wu

IPC: H05K1/16

CPC classification number: H05K3/361 ,  G02F1/13452 ,  H05K1/117 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/09918

Abstract: An exemplary liquid crystal display device (200) includes a liquid crystal display panel (21), and a flexible printed circuit (2) joined to the liquid crystal display panel. The flexible printed circuit includes a substrate (20). The substrate includes a plurality of first conductive lines (210) and second conductive lines (230). The first conductive lines include a plurality of first patches (220). The second conductive lines include a plurality of second patches (240). The first patches are arranged side by side oppositely oriented relative to each other in alternating fashion. The second patches are arranged side by side oppositely oriented relative to each other in alternating fashion.

Abstract translation: 示例性液晶显示装置（200）包括液晶显示面板（21）和与液晶显示面板接合的柔性印刷电路（2）。 柔性印刷电路包括基板（20）。 衬底包括多个第一导线（210）和第二导线（230）。 第一导线包括多个第一贴片（220）。 第二导线包括多个第二贴片（240）。 第一贴片以交替的方式相对于彼此并排布置。 第二贴片以交替的方式相对于彼此相对定向并排布置。

公开(公告)号：US07335571B2

公开(公告)日：2008-02-26

申请号：US10917681

申请日：2004-08-12

Applicant: Brad D. Rumsey ,  Matt E. Schwab

Inventor： Brad D. Rumsey ,  Matt E. Schwab

IPC: H01L21/76 ,  H01L21/00

CPC classification number: H01L24/49 ,  B33Y10/00 ,  B33Y80/00 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73215 ,  H01L2224/85207 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0266 ,  H05K3/0008 ,  H05K3/0052 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09918 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/49222 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial are also described.

Abstract translation: 一种用于基准和引脚一指示器的方法，其利用管芯安装衬底中的单个阻焊开口来执行现有技术基准和引脚一指示器的组合功能。 还描述了使用组合销一个指示器和对准基准来制造载体衬底和制造半导体器件封装的方法。

公开(公告)号：US20080037230A1

公开(公告)日：2008-02-14

申请号：US11826754

申请日：2007-07-18

Applicant: Yuki Yoneu

Inventor： Yuki Yoneu

IPC: H01L23/12 ,  H01R12/04 ,  H05K5/00

CPC classification number: H05K1/148 ,  H01L2224/48091 ,  H01L2924/19107 ,  H05K1/0237 ,  H05K1/0286 ,  H05K3/0052 ,  H05K3/0058 ,  H05K3/366 ,  H05K2201/091 ,  H05K2201/09154 ,  H05K2201/09918 ,  H05K2203/175 ,  H01L2924/00014

Abstract: A circuit board has circuitry including a first part and a second part connected to each other via a given first dividing plane. After the circuitry is divided by the first dividing plane, the circuitry can be restored by reconnecting the first part and the second part. The circuit board further has: first division assisting means for facilitating division of the circuit board; and first connection assisting means for facilitating reconnection of the first part and the second part. This eliminates the need to prepare different circuit boards having different specifications, making it possible to efficiently incorporate the circuit board in as many types of devices as possible.

Abstract translation: 电路板具有包括经由给定的第一分割平面相互连接的第一部分和第二部分的电路。 在电路被第一分割平面分割之后，可以通过重新连接第一部分和第二部分来恢复电路。 电路板还具有：便于划分电路板的第一分区辅助装置; 以及用于促进第一部分和第二部分的重新连接的第一连接辅助装置。 这样就不需要准备具有不同规格的不同电路板，从而可以将电路板有效地并入尽可能多的器件类型。

公开(公告)号：US20070275578A1

公开(公告)日：2007-11-29

申请号：US11754723

申请日：2007-05-29

Applicant: Kazuyuki YAMADA

Inventor： Kazuyuki YAMADA

IPC: H05K1/00

CPC classification number: H05K1/0269 ,  H05K1/117 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/09418 ,  H05K2201/09918 ,  H05K2203/166

Abstract: There is provided a wiring board including: a terminal group including a plurality of terminals arrayed along a specified array axis; and a pair of alignment marks disposed on opposite sides of the terminal group in the direction of the array axis. The alignment marks each have a first portion extending so as to intersect at an angle to the array axis. The first portions of the alignment marks and the plurality of terminals extend from the terminal group to a common phantom center point that is apart from the terminal group in the direction intersecting the array axis.

Abstract translation: 提供了一种布线板，包括：端子组，包括沿着指定的阵列轴排列的多个端子; 以及在阵列轴的方向上设置在端子组的相对侧上的一对对准标记。 对准标记各自具有延伸以与阵列轴成一定角度相交的第一部分。 对准标记和多个端子的第一部分从端子组延伸到在与阵列轴相交的方向上离开端子组的公共幻影中心点。

公开(公告)号：US20070266546A1

公开(公告)日：2007-11-22

申请号：US11797841

申请日：2007-05-08

Applicant: Kenji Yanagisawa

Inventor： Kenji Yanagisawa

IPC: H01S4/00

CPC classification number: G02B6/4201 ,  B82Y20/00 ,  G02B1/007 ,  G02B6/12 ,  G02B6/42 ,  G02B6/4214 ,  H05K1/0269 ,  H05K1/0274 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/09918 ,  H05K2203/166 ,  Y10T29/49002 ,  Y10T29/49128

Abstract: There is provided a method for fabricating a wiring board including: a mounting step of mounting a light transmitting member, the mounting step including: an arranging step of holding the light transmitting member by light transmitting holder to arrange the light transmitting member at a wiring board main body, and a step of curing a photo-curing resin material between the light transmitting member and the wiring board main body by light transmitted through the light transmitting member and the holder.

Abstract translation: 提供了一种制造布线板的方法，包括：安装透光构件的安装步骤，安装步骤包括：安置步骤，通过透光夹持器保持透光构件，以将透光构件布置在布线板 主体，以及通过透光部件和保持器的光固化透光部件与布线基板主体之间的光固化树脂材料的工序。

公开(公告)号：US07283660B2

公开(公告)日：2007-10-16

申请号：US10045651

申请日：2001-11-07

Applicant: Amnon Ganot ,  Hanan Gino ,  Golan Hanina ,  Zeev Kantor ,  Boris Kling ,  Shabtay Spinzi ,  Barry Ben-Ezra

Inventor： Amnon Ganot ,  Hanan Gino ,  Golan Hanina ,  Zeev Kantor ,  Boris Kling ,  Shabtay Spinzi ,  Barry Ben-Ezra

IPC: G06K9/00

CPC classification number: H05K3/4679 ,  G03F7/2053 ,  G03F9/00 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0082 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09918

Abstract: A method for aligning an image to be recorded by a direct image scanner on an upper layer of a printed circuit board with an image recorded on a lower layer thereof, the method comprising: visually imaging a portion of the image on the lower layer; and recording a pattern on the upper layer, referenced to coordinates of the visual image of the portion.

Abstract translation: 一种用于将由直接图像扫描仪记录的图像与印刷电路板的上层对准的方法，其中记录在其下层上的图像，所述方法包括：对所述下层上的图像的一部分进行目视成像; 并在上层记录图案，参考该部分的视觉图像的坐标。

公开(公告)号：US20070224856A1

公开(公告)日：2007-09-27

申请号：US11714165

申请日：2007-03-06

Applicant: Satoshi Torii ,  Hisataka Yoshimura

Inventor： Satoshi Torii ,  Hisataka Yoshimura

IPC: H05K1/00

CPC classification number: H05K13/0015 ,  H05K3/0008 ,  H05K3/3468 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/09918 ,  H05K2203/166

Abstract: Disclosed are a positioning method and a board for swiftly and accurately adjusting the position of a warpage-preventive rail for preventing warpage of the board in flow soldering. A mark of a width B provided with a slit having a width A in a direction perpendicular to a dip direction indicated by an arrow is silk-screen printed at an end of a surface opposite to a flow solder surface of a board. The width B of the mark is set to such a value that an operator who adjusts the position can easily recognize the mark. The slit is formed on a surface opposite to a support band where the upper surface of the warpage-preventive rail supports the board, and the width A of the slit is set to a value approximately equal to the width of the upper surface of the warpage-preventive rail.

Abstract translation: 公开了一种定位方法和板，用于快速且精确地调整防翘曲轨道的位置，以防止流动焊接中的板的翘曲。 在与板的流动焊料表面相对的表面的端部处丝网印刷宽度B的标记，该宽度B在与箭头所示的倾斜方向垂直的方向上具有宽度A的狭缝。 标记的宽度B被设置为使得调整位置的操作者可以容易地识别标记的值。 狭缝形成在与防翘曲轨道的上表面支撑基板的支撑带相反的表面上，并且狭缝的宽度A被设定为大致等于翘曲上表面的宽度的值 预防铁路

公开(公告)号：US20070138153A1

公开(公告)日：2007-06-21

申请号：US11326675

申请日：2005-12-20

Applicant: Dean Redman

Inventor： Dean Redman

IPC: B23K26/38

CPC classification number: H05K3/027 ,  H05K1/0266 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0097 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/1545

Abstract: Circuits on a wide web are made by a method in which a circuit and an index marker are patterned on a first row of the wide web. The wide web is then shifted to a second row. The index marker in the first row of the wide web is sensed, and a circuit in the second row is patterned in the wide web in response to sensing the index marker in the first row, thereby ensuring that circuits in the first and second rows are aligned in the cross-web direction.

Abstract translation: 通过一种方法制造宽网上的电路，其中电路和索引标记在宽网的第一行上被图案化。 然后，宽网被移动到第二行。 响应于感测第一行中的索引标记，感测宽幅的第一行中的索引标记，并且第二行中的电路被绘制在宽幅面中，从而确保第一行和第二行中的电路为 在横向方向对齐。

公开(公告)号：US20070085452A1

公开(公告)日：2007-04-19

申请号：US11251568

申请日：2005-10-14

Applicant: Allan Coleman

Inventor： Allan Coleman

IPC: H01L41/00

CPC classification number: H05K1/0269 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0008 ,  H05K3/0044 ,  H05K2201/053 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0228 ,  H05K2203/1327

Abstract: A method and system include a cable including a plurality of conductors terminating at a leading edge of the cable, and markers disposed at the leading edge providing visual reference points at one or more predetermined positions, the markers being separate from the plurality of conductors.

Abstract translation: 一种方法和系统包括电缆，其包括终止于电缆前缘的多个导体，以及设置在前缘的标记，其提供在一个或多个预定位置处的视觉参考点，所述标记与所述多个导体分离。

公开(公告)号：US20070075426A1

公开(公告)日：2007-04-05

申请号：US11531381

申请日：2006-09-13

Applicant: Michinari TETANI ,  Takayuki TANAKA ,  Hiroyuki IMAMURA ,  Nozomi SHIMOISHIZAKA ,  Kouichi NAGAO

Inventor： Michinari TETANI ,  Takayuki TANAKA ,  Hiroyuki IMAMURA ,  Nozomi SHIMOISHIZAKA ,  Kouichi NAGAO

IPC: H01L23/48

CPC classification number: H01L23/544 ,  H01L23/4985 ,  H01L24/81 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/81121 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0097 ,  H05K3/303 ,  H05K2201/0367 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10674 ,  H05K2203/1545 ,  H05K2203/166

Abstract: A flexible insulating base, a plurality of conductor wirings aligned on the flexible insulating base, and bump electrodes provided respectively in end portions of the plurality of conductor wirings in a region where a semiconductor chip is to be placed are provided. The semiconductor chip is mounted on the conductor wirings by bonding electrode pads formed on the semiconductor chip to the bump electrodes. An auxiliary conductor wiring formed similarly to the conductor wirings is provided on the insulating base, and an auxiliary bump electrode formed similarly to the bump electrodes is provided on the auxiliary conductor wiring, so that the electrode pads formed on the semiconductor chip can be registered with respect to the bump electrodes on the conductor wirings by positioning the semiconductor chip with reference to the auxiliary bump electrode. It is possible to configure a wiring board having register marks capable of positioning electrode pads of a semiconductor chip with respect to bump electrodes with high accuracy.

Abstract translation: 提供柔性绝缘基座，在柔性绝缘基座上对准的多个导体布线和分别设置在要放置半导体芯片的区域中的多个导体布线的端部中的凸起电极。 通过将形成在半导体芯片上的电极焊盘接合到凸块电极，将半导体芯片安装在导体布线上。 在导体布线上形成类似于导体布线的辅助导体布线设置在绝缘基底上，并且在辅助导体布线上设置类似于隆起电极形成的辅助凸起电极，使得形成在半导体芯片上的电极焊盘可以被注册 通过相对于辅助凸起电极定位半导体芯片，相对于导体布线上的凸块电极。 可以配置具有能够高精度地相对于凸块电极定位半导体芯片的电极焊盘的对准标记的布线板。