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公开(公告)号：US2763119A
公开(公告)日：1956-09-18
申请号：US33135753
申请日：1953-01-15
Applicant: HELFELD ELMER C
Inventor： HELFELD ELMER C
CPC classification number: A01D87/06 , H05K3/325 , H05K2201/09072 , H05K2201/1031 , H05K2201/10469 , H05K2201/10636 , H05K2201/10643 , Y02P70/611
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92.发明授权公开(公告)号：US12133342B2
公开(公告)日：2024-10-29
申请号：US17870977
申请日：2022-07-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Geuna Lee , Jinho Lim , Minsu Jung , Kwonho Son
CPC classification number: H05K5/0069 , H04M1/0277 , H05K1/189 , H05K5/0217 , H05K1/0281 , H05K1/147 , H05K2201/10151 , H05K2201/1031 , H05K2201/2009 , H05K2201/2036
Abstract: According to an embodiment, an electronic device is provided. the electronic device may comprise: a housing including a conductive portion and a non-conductive portion; a first substrate; at least one electronic component disposed on the first substrate; a second substrate electrically coupled to the first substrate, the second substrate including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; at least one contact member disposed between the first surface of the second substrate and the conductive portion of the housing; and a support member disposed between the first surface of the second substrate and the non-conductive portion of the housing.
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公开(公告)号：US20240114618A1
公开(公告)日：2024-04-04
申请号：US18374481
申请日：2023-09-28
Applicant: SEIKO EPSON CORPORATION
Inventor： Yu MASAGO , Toshiyuki OMORI , Masaaki ITO , Takeshi HIRAI
CPC classification number: H05K1/11 , H05K1/0216 , H05K2201/1031
Abstract: A circuit board unit includes a first circuit board having a first ground layer, a second circuit board having a second ground layer and arranged so as to be opposed to the first circuit board, a connector unit having a first connector attached to the first circuit board, and a second connector attached to the second circuit board and coupled to the first connector, and a metal member arranged between the first circuit board and the second circuit board, and configured to electrically couple the first ground layer and the second ground layer to each other. The metal member is arranged so as to be adjacent to the connector unit.
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公开(公告)号：US20180077807A1
公开(公告)日：2018-03-15
申请号：US15552112
申请日：2015-04-03
Applicant: MITSUBISHI ELECTRIC CORPORATION
Inventor： Susumu OKUDA
CPC classification number: H05K5/0017 , G05B2219/23258 , H05K1/181 , H05K7/1427 , H05K7/1469 , H05K7/1481 , H05K2201/10053 , H05K2201/10189 , H05K2201/1031
Abstract: A control panel includes: a cable formed by a plurality of signal lines connected to an input/output unit of the control apparatus; a terminal block to which a plurality of external wirings connecting to a control target device are electrically connected; and an I/F terminal block between the terminal block and the cable. The I/F terminal block includes: a plurality of first terminals provided on the terminal block side and each having a corresponding one of the plurality of external wirings electrically connected thereto; a plurality of second terminals provided on the control apparatus side and each electrically connected to a corresponding one of the plurality of signal lines; and a switching circuit to change a combination of one of the plurality of first terminals and one of the plurality of second terminals connected in a one-to-one relation.
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公开(公告)号：US09799975B2
公开(公告)日：2017-10-24
申请号：US15164198
申请日：2016-05-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok Park
CPC classification number: H01R12/79 , H01R12/714 , H01R12/771 , H01R13/24 , H01R13/6205 , H05K3/325 , H05K2201/0311 , H05K2201/10189 , H05K2201/10265 , H05K2201/1031 , H05K2203/104 , Y02P70/611
Abstract: An electronic device may include: a printed circuit board (PCB); a plurality of electronic components electrically connected to the PCB; and a connection member comprising a first portion fixed to one of the PCB and an electronic component and a second portion magnetically connected to the other one of the PCB and the electronic component. The second portion of the connection member may be moveably connected to the first portion. The connection member may further include a stopper, and may be designed to minimize the repulsive force provided by the connection member when excessive pressure is applied to the electronic device.
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Patent Agency Ranking
公开(公告)号：US20170274927A1
公开(公告)日：2017-09-28
申请号：US15616097
申请日：2017-06-07
Applicant: Hitachi Automotive Systems, Ltd.
Inventor： Katsumasa HAGIWARA
CPC classification number: B62D5/0406 , H01R12/523 , H01R12/7088 , H01R13/115 , H05K3/0061 , H05K3/4015 , H05K5/0004 , H05K5/0017 , H05K5/0047 , H05K5/0069 , H05K2201/0999 , H05K2201/1031 , H05K2201/10409 , Y02P70/611
Abstract: An electronic control unit includes a casing and a cover which are mutually bonded. A drive circuit board which drives a motor unit is fixed to the cover and, on the other hand, a control circuit board which controls the drive circuit board is fixed to the casing. An electrical connector which supplies an electric power to each board and a motor unit is attached on an opening section of the casing. First power supply terminals of this electrical connector and the motor unit and second power supply terminals of the drive circuit board are directly electrically connected by a bonding of both of casing and the cover.
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公开(公告)号：US09705216B2
公开(公告)日：2017-07-11
申请号：US15350239
申请日：2016-11-14
Applicant: GE Aviation Systems Limited
Inventor： Denis Vaughan Weale , Julian Peter Mayes
CPC classification number: H01R12/7088 , H01R12/718 , H01R13/2414 , H01R13/658 , H05K1/0216 , H05K1/0263 , H05K1/181 , H05K3/4015 , H05K2201/0314 , H05K2201/10265 , H05K2201/10272 , H05K2201/1031 , H05K2201/10371 , H05K2201/10409 , H05K2201/10757 , H05K2201/2036 , Y02P70/611
Abstract: The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.
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公开(公告)号：US20170196090A1
公开(公告)日：2017-07-06
申请号：US14985760
申请日：2015-12-31
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Steven KUMMERL
CPC classification number: H05K1/181 , H01R43/205 , H05K2201/1031 , H05K2201/10515 , Y02P70/611
Abstract: An apparatus includes an electrical device having a surface. The electrical device includes a first surface conductor spaced apart from a second surface conductor on the surface to provide circuit contacts to the device. A first standoff connector is bonded to the first surface conductor. The first standoff connector includes a leg having a proximal end bonded to the first surface conductor. The leg of the first standoff connector extends outwardly from the first surface conductor to a bend that is spaced apart from the surface of the electrical device. A second standoff connector is bonded to the second surface conductor. The second standoff connector includes a leg having a proximal end bonded to the second surface conductor. The leg of the second standoff connector extends outwardly from the second surface conductor to a bend that is spaced apart from the surface of the electrical device.
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公开(公告)号：US09661753B1
公开(公告)日：2017-05-23
申请号：US15366158
申请日：2016-12-01
Applicant: HARRIS CORPORATION
Inventor： Gregory M. Jandzio , Brinnan C. Riley , Charlie Dull , Jason Naylor
CPC classification number: H05K1/182 , H05K3/34 , H05K3/3426 , H05K2201/10287 , H05K2201/1031 , H05K2201/10333 , H05K2201/2027 , Y02P70/611 , Y02P70/613
Abstract: Microclip appliance formed from a single conductive planar metal sheet includes portions defined along an elongated length including a pin receiver, a solder paddle and a bridge. The pin receiver includes first and second planar rings, and a spring bar extending from a periphery of the first ring to a periphery of the second ring. The solder paddle is comprised of a portion of the conductive metal sheet distal from the pin receiver and the bridge extends from a peripheral portion of the solder paddle to the second ring. Lateral bends are disposed along a length of the conductive planar metal sheet to facilitate the various portions of the microclip.
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公开(公告)号：US09642231B2
公开(公告)日：2017-05-02
申请号：US14956285
申请日：2015-12-01
Applicant: Egis Technology Inc.
Inventor： Cheng-Chung Wang
CPC classification number: H05F3/02 , G06K9/0002 , G06K9/00053 , H05K1/0215 , H05K1/0254 , H05K1/0259 , H05K1/115 , H05K2201/10151 , H05K2201/1031
Abstract: A fingerprint sensor is provided. The fingerprint sensor includes a sensing array sensing fingerprint information of a user, an insulating surface disposed on the sensing array, and a printed circuit board (PCB) disposed under the sensing array. The PCB includes a substrate, a ground plane disposed on the second surface of the substrate, and an electrostatic discharge (ESD) ring disposed on the first surface of the substrate and surrounding the sensing array. The substrate includes a first surface and a second surface opposite the first surface. The ESD ring surrounds the sensing array. When an ESD event occurs, ESD energy is discharged from the ESD ring to the ground plane through a plurality of vias in the substrate without passing the sensing array.
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