公开(公告)号：US09516756B2

公开(公告)日：2016-12-06

申请号：US14583145

申请日：2014-12-25

Applicant: EZEK LAB COMPANY LIMITED

Inventor： Sheng-Che Huang ,  Yu-Tse Liu ,  Wei-Han Hu ,  Chien-Hung Lee

IPC: H05K1/11 ,  H05K1/14 ,  H01R12/71

CPC classification number: H05K1/144 ,  H01R9/2408 ,  H01R9/2458 ,  H01R12/718 ,  H01R12/732 ,  H05K1/142 ,  H05K1/184 ,  H05K2201/10189 ,  H05K2201/2072 ,  H05K2201/209

Abstract: A circuit module system includes a first and a second circuit module, the first circuit module includes a first circuit board and a first connecting housing, the first connecting housing includes a first base connected to a side of the first circuit board and at least one first conductor. A top surface of the first base forms a fillister connecting to outside, the first conductor is clamped on the first base and electrically connects the first circuit board to outside. The second circuit module includes a second circuit board and a second connecting housing, the second connecting housing includes a second base connected to a side of the second circuit board and at least one second conductor. A protruding part protrudes from an outer side of the second base, the second conductor is clamped on the second base and electrically connects the second circuit board to outside.

Abstract translation: 电路模块系统包括第一和第二电路模块，第一电路模块包括第一电路板和第一连接壳体，第一连接壳体包括连接到第一电路板一侧的第一基座和至少一个第一电路板 导体。 第一基座的顶表面形成连接到外部的填充器，第一导体夹在第一基座上并将第一电路板电连接到外部。 第二电路模块包括第二电路板和第二连接壳体，第二连接壳体包括连接到第二电路板侧面的第二基座和至少一个第二导体。 突出部分从第二基座的外侧突出，第二导体被夹紧在第二基座上并将第二电路板电连接到外部。

公开(公告)号：US20160268034A1

公开(公告)日：2016-09-15

申请号：US14657466

申请日：2015-03-13

Applicant: BOSE CORPORATION

Inventor： Bradford Kyle Subat ,  Remco Terwal ,  Daniel Hodgkins

IPC: H01F27/06 ,  H01F27/29 ,  H05K1/14 ,  H01F27/28

CPC classification number: H01F27/06 ,  H01F27/2804 ,  H01F27/29 ,  H01F2027/065 ,  H01F2027/2819 ,  H05K1/141 ,  H05K1/165 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/048 ,  H05K2201/086 ,  H05K2201/09172 ,  H05K2201/209

Abstract: A planar magnetic component includes a printed circuit board, a coil formed on one or more electrically conductive metal layers of the printed circuit board, terminals electrically connected to the coil for energizing the coil, and a magnetic core mounted to the printed circuit board for confining magnetic flux of the coil. The printed circuit board defines an alignment feature for engaging with a mating feature on a mating circuit board, thereby to align the planar magnetic component with the mating circuit board.

Abstract translation: 平面磁性部件包括印刷电路板，形成在印刷电路板的一个或多个导电金属层上的线圈，电连接到用于激励线圈的线圈的端子和安装到印刷电路板的磁芯以限制 线圈的磁通量。 印刷电路板限定了用于与匹配电路板上的配合特征接合的对准特征，从而使平面磁性部件与配对电路板对准。

公开(公告)号：US20160230963A1

公开(公告)日：2016-08-11

申请号：US15132243

申请日：2016-04-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang Ho SHIN ,  Seok Chan HONG ,  Sung Oh AHN

IPC: F21V13/04 ,  G02F1/1335 ,  F21V5/04 ,  F21K99/00 ,  F21V7/05

CPC classification number: F21V13/04 ,  F21K9/60 ,  F21V5/04 ,  F21V7/05 ,  G02F1/133611 ,  H01L33/60 ,  H05K3/0052 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2201/209

Abstract: A light emitting module includes a circuit board having a plurality of reflective portions arranged in one direction and connection portions connecting the plurality of reflective portions, light emitting devices mounted on the plurality of reflective portions, and lens units disposed to cover the light emitting devices within boundaries of surfaces, of the plurality of reflective portions, on which the light emitting devices are mounted. A width of each of the connection portions in the other direction, perpendicular to the one direction thereof, is smaller than a diameter of each of the lens units, thus reducing a generation of a dark portion.

Abstract translation: 发光模块包括电路板，其具有沿一个方向布置的多个反射部分和连接多个反射部分的连接部分，安装在多个反射部分上的发光器件以及设置成覆盖发光器件内部的透镜单元 在其上安装有发光装置的多个反射部分中的表面的边界。 每个连接部分在垂直于其一个方向的另一个方向上的宽度小于每个透镜单元的直径，从而减少了暗部分的产生。

公开(公告)号：US20140092596A1

公开(公告)日：2014-04-03

申请号：US14042238

申请日：2013-09-30

Applicant: Linear Lighting Corp.

Inventor： Lawrence Adam Deutsch ,  Richard J. Coffin ,  Arkady Orlov

IPC: F21K99/00 ,  F21V29/00

CPC classification number: F21K9/23 ,  F21S4/28 ,  F21V5/002 ,  F21V5/007 ,  F21V5/008 ,  F21V5/08 ,  F21V7/0091 ,  F21V15/013 ,  F21V17/164 ,  F21V19/0055 ,  F21V21/005 ,  F21V29/763 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0815 ,  H05K1/0209 ,  H05K1/0286 ,  H05K1/142 ,  H05K2201/0909 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10416 ,  H05K2201/209 ,  H05K2203/302

Abstract: A light source is provided including a heat sink and a printed circuit board (PCB) with a driver and lamps disposed in the central cavity of the heat sink. Each lamp is a semi-spherical solid state lamp, and multiple optical structures in operable registration with lamps. The PCB may further have two heat conducting strips proximate opposing edges of the PCB. The optical structures emit substantially shadowless, substantially homogeneous, and substantially monochromatic light. The optical structure includes an optical element for each lamp that substantially collimates the lamp's light and an optical element receiving a portion of the substantially collimated beam and provides multiple optical images of the collimated beam with a focal point that is practically infinite.

Abstract translation: 提供了一种光源，其包括散热器和布置在散热器的中心腔中的驱动器和灯的印刷电路板（PCB）。 每个灯是一个半球形固态灯，和多个光学结构可操作地与灯配准。 PCB还可以具有邻近PCB的相对边缘的两个导热条。 光学结构发射基本上无阴影的，基本均匀的和基本上单色的光。 光学结构包括用于每个灯的光学元件，其基本上准直灯的光和接收基本上准直的光束的一部分的光学元件，并且提供准直光束的多个光学图像，其具有几乎无限的焦点。

公开(公告)号：US08572839B2

公开(公告)日：2013-11-05

申请号：US12500041

申请日：2009-07-09

Applicant: Yasushi Hasegawa

Inventor： Yasushi Hasegawa

IPC: H05K3/20

CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2201/209 ,  H05K2203/0169 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/166 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49789 ,  Y10T29/49895

Abstract: A fabrication method for a multi-piece board having a frame part and multi piece parts each having a printed wiring board includes producing the frame part having a first coupling portion, and the multi-piece parts including piece parts each having a second coupling portion coupled to the first coupling portion at a production panel with at least the frame part and the piece parts being separated from each other, separating the frame part and the multi-piece parts from the production panel, and coupling the first coupling portion to the second coupling portion to couple the frame part and the piece parts and combine the frame part and the multi piece parts so as to yield the multi-piece board.

Abstract translation: 一种具有框架部分和多片部分的多片板的制造方法，每个具有印刷线路板包括制造具有第一联接部分的框架部分，并且所述多片部件包括件部件，每个部件具有联接的第二联接部分 在至少框架部分和零件彼此分离的生产面板处的第一联接部分处，将框架部分和多件部件与生产面板分离，并将第一联接部分连接到第二联接器 联接框架部分和零件，并且组合框架部分和多件部件以产生多片板。

公开(公告)号：US08315065B2

公开(公告)日：2012-11-20

申请号：US12568017

申请日：2009-09-28

Applicant: Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy

Inventor： Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K3/303 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09036 ,  H05K2201/1059 ,  H05K2201/209 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released.

Abstract translation: 描述了多芯片模块（MCM）。 该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。 这些积极和消极的特征可以彼此交配和自锁。 例如，其中一个表面上的阳性特征可以包括成对的相对的微弹簧，并且负特征可以包括在另一个表面上的凹坑或凹槽。 当基板机械耦合时，给定的一对正特征可以在另一表面的平面中提供力。 此外，通过压缩MCM使得基板的表面彼此推动，可以释放机械联接。

公开(公告)号：US08150071B2

公开(公告)日：2012-04-03

申请号：US12376602

申请日：2007-09-19

Applicant: Mitsuru Kobayashi

Inventor： Mitsuru Kobayashi

IPC: H03G3/00

CPC classification number: H05K1/142 ,  H01R13/514 ,  H04B1/08 ,  H04R25/60 ,  H04R25/604 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/119 ,  H05K1/183 ,  H05K3/326 ,  H05K2201/09118 ,  H05K2201/0919 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/1059 ,  H05K2201/209

Abstract: An appliance is provided which can be easily assembled, assures quality and reliability, and can be downsized. A voice output unit includes: a power source supplying power; a signal processing module which processes voice signals received from an external source, and amplifies the processed voice signals processed; a speaker module transmitting the amplified voice signals as voice signals; and a stereoscopic circuit board on which the power source, signal processing module, and speaker module are assembled, and includes electrodes which are in electric contact with electrodes of the foregoing components.

Abstract translation: 提供易于组装的设备，确保质量和可靠性，并且可以小型化。 语音输出单元包括：电源供电; 信号处理模块，处理从外部源接收的语音信号，并放大所处理的已处理语音信号; 将放大的语音信号作为语音信号发送的扬声器模块; 以及其上组装有电源，信号处理模块和扬声器模块的立体电路板，并且包括与上述部件的电极电接触的电极。

公开(公告)号：US08026603B2

公开(公告)日：2011-09-27

申请号：US11408072

申请日：2006-04-21

Applicant: Yung-Yu Hsu ,  Chih-Yuan Cheng ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

Inventor： Yung-Yu Hsu ,  Chih-Yuan Cheng ,  Shyi-Ching Liau ,  Min-Lin Lee ,  Ra-Min Tain ,  Rong-Chang Feng

IPC: H01L23/52

CPC classification number: H01L24/12 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/326 ,  H05K2201/0373 ,  H05K2201/209 ,  H01L2924/00

Abstract: An interconnect structure of an integrated circuit and manufacturing method therefore are provided, relating to an interconnect structure of flexible packaging. The interconnect structure includes a first and a second conductive pads. A plurality of tiny and conductive first pillars is respectively formed on the first and second pads. With different densities and thicknesses of the first and second pillars, a contact strength can be generated when the pillars interconnecting with each other, such that the pillars are connected closely. Furthermore, the interconnect structure can also be used to connect with fibers made of conductive materials. Moreover, the higher the density of the pillars, the stronger the contact strength. And, electronic substrates and active or passive electronic elements can be stuck on the other side of each pad. Therefore, the interconnect structure can maintain flexibility and have high reliability without being enhanced by any thermosetting polymer.

Abstract translation: 因此，提供了与柔性包装的互连结构相关的集成电路和制造方法的互连结构。 互连结构包括第一和第二导电焊盘。 多个微小且导电的第一支柱分别形成在第一和第二垫上。 当第一和第二支柱具有不同的密度和厚度时，当支柱互相连接时，可以产生接触强度，使得支柱紧密连接。 此外，互连结构也可以用于与由导电材料制成的纤维连接。 此外，支柱的密度越高，接触强度越强。 并且，电子基板和有源或无源电子元件可以卡在每个垫的另一侧上。 因此，互连结构可以保持柔性并且具有高可靠性，而不会被任何热固性聚合物增强。

公开(公告)号：US20110075380A1

公开(公告)日：2011-03-31

申请号：US12568017

申请日：2009-09-28

Applicant: Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy

Inventor： Jing Shi ,  Hiren D. Thacker ,  Ashok V. Krishnamoorthy

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K3/303 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09036 ,  H05K2201/1059 ,  H05K2201/209 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released.

Abstract translation: 描述了多芯片模块（MCM）。 该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。 这些积极和消极的特征可以彼此交配和自锁。 例如，其中一个表面上的阳性特征可以包括成对的相对的微弹簧，并且负特征可以包括在另一个表面上的凹坑或凹槽。 当基板机械耦合时，给定的一对正特征可以在另一表面的平面中提供力。 此外，通过压缩MCM使得基板的表面彼此推动，可以释放机械联接。

公开(公告)号：US20110021016A1

公开(公告)日：2011-01-27

申请号：US12923590

申请日：2010-09-29

Applicant: Yuji Awano ,  Masataka Mizukoshi

Inventor： Yuji Awano ,  Masataka Mizukoshi

IPC: H01L21/60

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/12 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1134 ,  H01L2224/13193 ,  H01L2224/13582 ,  H01L2224/13693 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/026 ,  H05K2201/09472 ,  H05K2201/209 ,  H01L2224/13099 ,  H01L2224/0401

Abstract: A semiconductor package is disclosed that includes a semiconductor device; a circuit board; and a connection mechanism including a first conductive terminal provided on the semiconductor device, and a second conductive terminal provided on the circuit board side, the connection mechanism electrically connecting the semiconductor device and the circuit board via the first conductive terminal and the second conductive terminal. At least one of the first conductive terminal and the second conductive terminal of the connection mechanism includes one or more carbon nanotubes each having one end thereof fixed to the surface of the at least one of the first conductive terminal and the second conductive terminal, and extending in a direction away from the surface. The first conductive terminal and the second conductive terminal engage each other through the carbon nanotubes.

Abstract translation: 公开了一种包括半导体器件的半导体封装; 电路板; 以及连接机构，其包括设置在所述半导体器件上的第一导电端子和设置在所述电路板侧的第二导电端子，所述连接机构经由所述第一导电端子和所述第二导电端子电连接所述半导体器件和所述电路板。 连接机构的第一导电端子和第二导电端子中的至少一个包括一个或多个碳纳米管，每个碳纳米管的一端固定到第一导电端子和第二导电端子中的至少一个的表面，并且延伸 在远离表面的方向上。 第一导电端子和第二导电端子通过碳纳米管彼此接合。