公开(公告)号：US08519989B2

公开(公告)日：2013-08-27

申请号：US12597195

申请日：2009-02-06

Applicant: Kazuyoshi Nakamura ,  Yoshihiro Matsui

Inventor： Kazuyoshi Nakamura ,  Yoshihiro Matsui

IPC: G09G3/28 ,  G09G5/00 ,  G06F3/038

CPC classification number: H05K3/368 ,  G09G3/2965 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10409

Abstract: In a plasma display device, the scan electrode drive circuit is mounted at least on a first circuit board generating a sustain pulse and a second circuit board outputting a scan pulse to the scan electrodes. The first circuit board includes a plurality of first metal fittings, each having a screw hole, as an output terminal. The second circuit board includes a plurality of second metal fittings, each having a through-hole, as an input terminal. The first circuit board and the second circuit board are connected to each other by inserting and screwing screws into the screw holes of the first metal fittings via the through-holes of the second metal fittings.

Abstract translation: 在等离子体显示装置中，扫描电极驱动电路至少安装在产生维持脉冲的第一电路板和向扫描电极输出扫描脉冲的第二电路板。 第一电路板包括多个第一金属配件，每个第一金属配件具有螺孔，作为输出端子。 第二电路板包括多个第二金属配件，每个具有通孔作为输入端。 第一电路板和第二电路板通过第二金属配件的通孔将螺钉插入并拧入第一金属配件的螺孔中而相互连接。

公开(公告)号：US08516691B2

公开(公告)日：2013-08-27

申请号：US12490711

申请日：2009-06-24

Applicant: Zvika Gilad ,  Semion Khait ,  Chen Mann ,  Nathan Rubin

Inventor： Zvika Gilad ,  Semion Khait ,  Chen Mann ,  Nathan Rubin

IPC: H05K3/30

CPC classification number: A61B1/041 ,  A61B1/051 ,  A61B5/6861 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/10037 ,  H05K2201/10121 ,  H05K2201/2009 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/5313

Abstract: A method of assembling an in-vivo imaging device with a flexible circuit board. The flexible circuit board may include a plurality of flexible installation units connected to one another through flexible connection units. The flexible installation units may be capable of having electrical components disposed thereon at a size suitable for being included in an in-vivo imaging device which may be inserted into a body lumen, e.g., a capsule endoscope.

Abstract translation: 一种使用柔性电路板组装体内成像装置的方法。 柔性电路板可以包括通过柔性连接单元彼此连接的多个柔性安装单元。 灵活的安装单元可以能够以适于被包括在体内成像装置中的尺寸设置在其上的电气部件，该体内成像装置可插入体腔，例如胶囊型内窥镜。

公开(公告)号：US08498125B2

公开(公告)日：2013-07-30

申请号：US12135556

申请日：2008-06-09

Applicant: David R. Hall ,  Jim Shumway

Inventor： David R. Hall ,  Jim Shumway

IPC: H05K1/00

CPC classification number: H05K7/1417 ,  E21B47/011 ,  H05K1/189 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/0133 ,  H05K2201/042 ,  H05K2201/2009

Abstract: A downhole tool string component has a through-bore intermediate first and second tool joints adapted for connection to adjacent tool string components. An instrumentation package is disposed within an outer diameter of the component. The instrumentation package comprises a circuit board assembly. The circuit board assembly comprises alternating rigid and elastomeric layers. The rigid layers are in electrical communication with each other.

Abstract translation: 井下工具串组件具有通孔中间的第一和第二工具接头，适于连接到相邻的工具组件。 仪器包装被设置在部件的外径内。 仪表组件包括电路板组件。 电路板组件包括交替的刚性和弹性体层。 刚性层彼此电连通。

公开(公告)号：US20130148322A1

公开(公告)日：2013-06-13

申请号：US13492895

申请日：2012-06-10

Applicant: Greg Fosnes ,  Aaron Miletich ,  Chris Ligtenberg ,  Jay Anastas ,  Erik James Shahoian ,  Eric Knopf ,  Peter Arnold

Inventor： Greg Fosnes ,  Aaron Miletich ,  Chris Ligtenberg ,  Jay Anastas ,  Erik James Shahoian ,  Eric Knopf ,  Peter Arnold

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/141 ,  H01R12/73 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2203/167 ,  Y10T29/49147

Abstract: Non-rectangular or rectangular interposers for space efficient, reliable to manufacture, high speed interconnections between two printed circuit boards, such as a motherboard and a mating board. One example provides space efficiency with a non-rectangular interposer, where the interposer may be at least approximately circular. Reliable manufacturing may be provided by the inclusion of one or more openings to accept one or more alignment features. In one example, a first opening is provided to accept a threaded boss, which may be used to fasten the two printed circuit boards and interposer together. In another example, a second opening may be provided to accept an alignment post, wherein the post aligns the interposer to the two printed circuit boards. Contacts may be provided on each side to mate with contacts on each of the two printed circuit boards.

Abstract translation: 非矩形或矩形内插器，用于空间高效，可靠地制造，两个印刷电路板（如主板和配对板）之间的高速互连。 一个示例使用非矩形插入器提供空间效率，其中插入件可以至少近似为圆形。 可以通过包括一个或多个开口来接受一个或多个对准特征来提供可靠的制造。 在一个示例中，提供第一开口以接纳螺纹凸台，其可用于将两个印刷电路板和插入件紧固在一起。 在另一示例中，可以提供第二开口以接受对准柱，其中柱将插入件对准到两个印刷电路板。 可以在每一侧设置触点以与两个印刷电路板中的每一个上的触点配合。

公开(公告)号：US08461693B2

公开(公告)日：2013-06-11

申请号：US13061261

申请日：2008-08-26

Applicant: Hock Peng Lim ,  Meng Kiang Lim

Inventor： Hock Peng Lim ,  Meng Kiang Lim

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L25/0657 ,  H01L23/5387 ,  H01L25/16 ,  H01L2224/32145 ,  H01L2225/06579 ,  H01L2924/15192 ,  H01L2924/19106 ,  H05K1/189 ,  H05K2201/042

Abstract: In an embodiment, a substrate arrangement is provided. The substrate arrangement may include a semiconductor substrate including a first contact portion and a second contact portion on a first surface of the semiconductor substrate, wherein the semiconductor substrate is arranged such that the first contact portion and the second contact portion face each other. The substrate arrangement may further include an electrical connector configured to connect the first contact portion and the second contact portion.

Abstract translation: 在一个实施例中，提供了衬底布置。 衬底布置可以包括在半导体衬底的第一表面上包括第一接触部分和第二接触部分的半导体衬底，其中半导体衬底被布置成使得第一接触部分和第二接触部分彼此面对。 衬底布置还可以包括被配置为连接第一接触部分和第二接触部分的电连接器。

公开(公告)号：US20130133190A1

公开(公告)日：2013-05-30

申请号：US13668982

申请日：2012-11-05

Applicant: Olympus Corporation

Inventor： Mikio Nakamura ,  Yu Kondo

IPC: H05K3/30

CPC classification number: H05K3/368 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/19 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/274 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/144 ,  H05K3/284 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/4046 ,  H05K3/4647 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10318 ,  H05K2203/025 ,  H05K2203/1316 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A stacked mounting structure and a method of manufacturing stacked mounting structure are provided. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.

Abstract translation: 提供一种堆叠安装结构和制造堆叠安装结构的方法。 堆叠的安装结构包括多个构件，其设置有安装和操作要安装在至少一个主表面上的部件所需的安装区域，以及用于操作要安装的部件的信号传送的连接区域，以及 布置在相互面对构件之间的连接区域上的导电构件和导电构件的横截面与连接区域相同或更小，并且导电构件的端部从主表面延伸 一个构件直到另一构件的主表面，并且导电构件的高度调节安装区域的距离。

公开(公告)号：US08446733B2

公开(公告)日：2013-05-21

申请号：US13209870

申请日：2011-08-15

Applicant: Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

Inventor： Richard J. Hampo ,  Slobodan Pavlovic ,  Nadir Sharaf ,  Rutunj Rai ,  Aftab Ali Khan

IPC: H01R9/00

CPC classification number: H01R12/71 ,  H01R12/718 ,  H05K1/0262 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10303

Abstract: In at least one embodiment, a vehicle power module comprises a first printed circuit board (PCB) including a first plurality of electrical components for providing a first voltage and a second voltage. The vehicle power module further comprises a second PCB including a second plurality of electrical components, the second PCB being spaced away from the first printed circuit board and a first connector assembly being coupled to the first PCB and to the second PCB for providing the first voltage to the second PCB. The vehicle power module further comprises a second connector assembly being coupled to the first PCB and to the second PCB for providing the second voltage to the second PCB. The first connector assembly provides the first voltage of up to 14V and the second connector assembly provides the second voltage of 200V or greater.

Abstract translation: 在至少一个实施例中，车辆功率模块包括第一印刷电路板（PCB），其包括用于提供第一电压和第二电压的第一多个电气部件。 所述车辆动力模块还包括包括第二多个电气部件的第二PCB，所述第二PCB与所述第一印刷电路板间隔开;以及第一连接器组件，其耦合到所述第一PCB和所述第二PCB，以提供所述第一电压 到第二个PCB。 车辆动力模块还包括耦合到第一PCB和第二PCB的第二连接器组件，用于向第二PCB提供第二电压。 第一连接器组件提供高达14V的第一电压，并且第二连接器组件提供200V或更大的第二电压。

公开(公告)号：US08424197B2

公开(公告)日：2013-04-23

申请号：US13332888

申请日：2011-12-21

Applicant: Steven E. Garcia ,  Randall J. Boudreaux

Inventor： Steven E. Garcia ,  Randall J. Boudreaux

IPC: B23P19/00

CPC classification number: B23P19/00 ,  H01R12/523 ,  H01R43/205 ,  H05K3/308 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/096 ,  H05K2201/10287 ,  H05K2203/0195 ,  Y10T29/49151 ,  Y10T29/49169 ,  Y10T29/49194 ,  Y10T29/5193 ,  Y10T29/53209 ,  Y10T29/53213 ,  Y10T29/53217

Abstract: Twist pin z-axis interconnectors are assembled in columns of aligned vias in stacked printed circuit boards of a circuit module in automated assembly cycles. Each assembly cycle involves singulating a single twist pin from a plurality of twist pins, inserting the twist pin into the via column, gripping a leader portion of the twist pin, pulling the gripped leader portion until a connection portion moves into contact with the vias of the column, severing the leader portion from the connection portion, extracting the severed leader portion, and automatically repeating assembly cycles until interconnectors have been assembled into a substantial majority of the via columns of the circuit module.

Abstract translation: 在自动组装循环中，扭曲销Z轴互连器以电路模块的堆叠印刷电路板的排列通孔的列组装。 每个组装循环包括从多个扭转销中分离单个捻销，将扭转销插入通孔柱中，夹持扭转销的引导部分，拉动夹持的引导部分，直到连接部分移动接触到 从连接部分切断引导部分，提取切断的引导部分，并自动重复组装循环，直到互连器已组装成电路模块的大部分通孔列为止。

公开(公告)号：US20130089992A1

公开(公告)日：2013-04-11

申请号：US13419715

申请日：2012-03-14

Applicant: Hyun Mo YANG

Inventor： Hyun Mo YANG

IPC: H05K1/11

CPC classification number: H05K1/144 ,  H05K1/0218 ,  H05K1/141 ,  H05K9/0032 ,  H05K9/0035 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/1031 ,  H05K2201/10371 ,  Y02P70/611

Abstract: A structure for stacking Printed Board Assemblies (PBAs) in an electronic device is provided. The structure for stacking PBAs in an electronic device includes a clip mounted on a main Printed Circuit Board (PCB), a sub-PCB including a ground portion, a sub-PBA including the sub-PCB, and a clip header mounted on a lower part of the sub-PBA, wherein the clip header is inserted into the clip. Therefore, electronic components mounted on a main PCB can be shielded from outer electromagnetic waves while reducing material costs without using a shield can, and a sub-PBA can be stacked on the main PBA.

Abstract translation: 提供了一种用于在电子设备中堆叠印刷电路板组件（PBA）的结构。 用于在电子设备中堆叠PBA的结构包括安装在主印刷电路板（PCB）上的夹子，包括接地部分的子PCB，包括子PCB的子PBA和安装在下部PCB上的夹头 子片段的一部分，其中剪辑头部插入到剪辑中。 因此，安装在主PCB上的电子部件可以屏蔽外部电磁波，同时在不使用屏蔽壳的同时降低材料成本，并且可以在主PBA上堆叠副PBA。

公开(公告)号：US20130062111A1

公开(公告)日：2013-03-14

申请号：US13282554

申请日：2011-10-27

Applicant: HSUN-FA LI ,  YUN-TSUNG LI ,  CHUN-CHI CHIU

Inventor： HSUN-FA LI ,  YUN-TSUNG LI ,  CHUN-CHI CHIU

IPC: H05K1/11

CPC classification number: H01L23/13 ,  H01L23/49805 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/117 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2201/10477 ,  H05K2201/2018 ,  H05K2203/0465 ,  H01L2924/00

Abstract: A stacked substrate module includes a first and a second substrate. The first substrate has several pads which extend respectively from a stacked area of the first substrate to the outside of the stacked area. The second substrate has several welding areas arranged on the outer lateral side thereof; each welding area extends respectively from the outer lateral side of the second substrate to an upper and a lower surface of the second substrate. The second substrate is stacked in the stacked area of the first substrate, wherein the lateral side of the second substrate is aligned to the edge of the stacked area of the first substrate. The aforementioned pads correspond to the welding areas respectively. It is suitable to position a solder paste between the pads and the welding areas which can be reflowed to connect the pads and the welding areas.

Abstract translation: 堆叠的衬底模块包括第一和第二衬底。 第一基板具有分别从第一基板的堆叠区域延伸到堆叠区域的外部的多个焊盘。 第二基板具有布置在其外侧上的多个焊接区域; 每个焊接区域分别从第二衬底的外侧面延伸到第二衬底的上表面和下表面。 第二基板被堆叠在第一基板的堆叠区域中，其中第二基板的横向侧与第一基板的堆叠区域的边缘对准。 上述焊盘分别对应于焊接区域。 适于将焊膏定位在焊盘与焊接区域之间，焊接区域可以被回流以连接焊盘和焊接区域。