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公开(公告)号：US20140218873A1
公开(公告)日：2014-08-07
申请号：US14166277
申请日：2014-01-28
Applicant: MOTOROLA MOBILITY LLC
Inventor： XiaoPing Bai , John W. Kaehler , Weihong Zhang , Zhiming Zhuang
IPC: H05K1/11
CPC classification number: H05K1/118 , H01L27/3276 , H01L27/3288 , H01L27/3297 , H01L51/524 , H05K2201/05
Abstract: A display includes an encapsulation layer and a substrate. The substrate includes a chip on glass (COG) seat and a flexible printed circuit (FPC) connector seat. The COG seat and the FPC seats are positioned on different edges of the substrate. A cross-connection layer between the substrate layer and the encapsulation layer, the cross-connection layer including traces connected between the COG seat and the FPC seat. A device incorporating the display may take advantage of the symmetrical display to achieve new designs.
Abstract translation: 显示器包括封装层和衬底。 衬底包括玻璃上的芯片（COG）座和柔性印刷电路（FPC）连接座。 COG座椅和FPC座椅位于基板的不同边缘上。 衬底层和封装层之间的交叉连接层，交联连接层包括连接在COG座和FPC座之间的迹线。 结合显示器的装置可以利用对称显示器来实现新的设计。
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公开(公告)号：US07631424B2
公开(公告)日：2009-12-15
申请号：US11928698
申请日：2007-10-30
Applicant: Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
Inventor： Robert J. Greenberg , Neil Hamilton Talbot , Jordan Matthew Neysmith , James Singleton Little , Brian V. Mech
CPC classification number: A61N1/0543 , A61N1/36046 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/0014 , H05K2201/05 , H05K2201/053 , H05K2201/09063 , H05K2201/09409 , Y10T29/49002 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49174 , Y10T29/49176
Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape.The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.
Abstract translation: 本发明提供一种适用于神经刺激的柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基层上的聚合物顶层和所述金属迹线至少一个粘性开口; 其中所述聚合物基层，所述金属迹线和所述聚合物顶层被热成型为三维形状。 本发明还提供一种制造柔性电路电极阵列的方法，包括沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 准备至少一个开口; 并将所述柔性电路电极阵列加热到模具中，以在所述柔性电路电极阵列中形成三维形状。
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公开(公告)号：US20080058875A1
公开(公告)日：2008-03-06
申请号：US11928698
申请日：2007-10-30
Applicant: Robert Greenberg , Neil Talbot , Jordan Neysmith , James Little , Brian Mech
Inventor： Robert Greenberg , Neil Talbot , Jordan Neysmith , James Little , Brian Mech
IPC: A61N1/18
CPC classification number: A61N1/0543 , A61N1/36046 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/0014 , H05K2201/05 , H05K2201/053 , H05K2201/09063 , H05K2201/09409 , Y10T29/49002 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49174 , Y10T29/49176
Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on said polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on said polymer base layer and said metal traces at least one tack opening; wherein said polymer base layer, said metal traces and said polymer top layer are thermoformed in a three dimensional shape. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on said polymer base layer; patterning said metal to form metal traces; depositing a polymer top layer on said polymer base layer and said metal traces; preparing at least one tack opening; and heating said flexible circuit electrode array in a mold to form a three dimensional shape in said flexible circuit electrode array.
Abstract translation: 本发明提供一种适用于神经刺激的柔性电路电极阵列，包括：聚合物基层; 沉积在所述聚合物基层上的金属痕迹，包括适于刺激神经组织的电极; 沉积在所述聚合物基层上的聚合物顶层和所述金属迹线至少一个粘性开口; 其中所述聚合物基层，所述金属迹线和所述聚合物顶层被热成型为三维形状。 本发明还提供一种制造柔性电路电极阵列的方法，包括沉积聚合物基层; 在所述聚合物基层上沉积金属; 图案化所述金属以形成金属痕迹; 在所述聚合物基底层和所述金属迹线上沉积聚合物顶层; 准备至少一个开口; 并将所述柔性电路电极阵列加热到模具中，以在所述柔性电路电极阵列中形成三维形状。
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公开(公告)号：US11977275B2
公开(公告)日：2024-05-07
申请号：US17172034
申请日：2021-02-09
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Yueqiang Wang , Haofeng Zhang , Yongjian Li , Yunbin Chen , Fen You , Lei Zhang
IPC: G02C11/00 , G02C5/14 , G02C5/22 , G02C11/06 , H04R1/02 , H04R1/04 , H04R1/06 , H04R1/10 , H04R1/28 , H04R9/02 , H04R9/06 , H04R25/00 , H05K1/02 , H05K1/18
CPC classification number: G02C11/10 , G02C5/14 , G02C5/143 , G02C5/22 , G02C5/2254 , G02C11/06 , H04R1/02 , H04R1/028 , H04R1/04 , H04R1/06 , H04R1/10 , H04R1/1008 , H04R1/1033 , H04R1/1041 , H04R1/1075 , H04R1/1083 , H04R1/28 , H04R9/02 , H04R9/025 , H04R9/06 , H04R25/65 , H05K1/028 , H05K1/189 , H04R2460/13 , H05K2201/05
Abstract: The present disclosure embodiment may disclose a glasses including a glasses frame and two speakers. The glasses frame may include a glasses rim and two glasses temples. The two glasses temples may be rotatably connected to the glasses rim, respectively. The two speakers may include an earphone core. The two speakers may be connected to the two glasses temples via hinge components of the two glasses temples, respectively. The hinge components may be rotatable to change a position of each of the speakers relative to connected one of the glasses temples. The glasses temple may include a circuit component or a battery to drive the earphone core to vibrate to generate a sound. In the present disclosure, the glasses rim and the glasses temple may be connected through a rotating shaft, thereby protecting the connection wire in the glasses and extending the life of the connection wire.
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公开(公告)号：US11899284B2
公开(公告)日：2024-02-13
申请号：US18150785
申请日：2023-01-05
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Yueqiang Wang , Haofeng Zhang , Yongjian Li , Yunbin Chen , Fen You , Lei Zhang
IPC: G02C11/00 , G02C5/22 , G02C5/14 , H04R1/02 , H04R1/10 , H04R9/06 , H04R1/06 , H04R9/02 , G02C11/06 , H04R1/28 , H05K1/02 , H04R25/00 , H04R1/04 , H05K1/18
CPC classification number: G02C11/10 , G02C5/14 , G02C5/22 , G02C5/2254 , G02C11/06 , H04R1/02 , H04R1/028 , H04R1/04 , H04R1/06 , H04R1/10 , H04R1/1008 , H04R1/1033 , H04R1/1041 , H04R1/1075 , H04R1/1083 , H04R1/28 , H04R9/02 , H04R9/025 , H04R9/06 , H04R25/65 , H05K1/028 , H05K1/189 , H04R2460/13 , H05K2201/05
Abstract: The present disclosure provides eyeglasses including: an eyeglass rim; an eyeglass temple, the eyeglass temple comprising a control circuit or a battery; a rotating shaft, the rotating shaft being configured to connect the eyeglass rim and the eyeglass temple, so that the eyeglass rim and the eyeglass temple are relatively rotated around the rotating shaft, and the rotating shaft being disposed with a rotating shaft wiring channel along an axial direction; and a speaker, the speaker comprising an earphone core, the speaker being connected to the eyeglass temple, the control circuit or battery in the eyeglass temple driving the earphone core to vibrate through the connection wire, wherein the earphone core vibrates to generate a driving force to drive a housing panel of the speaker to vibrate, and a straight line of the driving force being not parallel to a normal line of the housing panel.
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Patent Agency Ranking
公开(公告)号：US11846831B2
公开(公告)日：2023-12-19
申请号：US17098437
申请日：2020-11-15
Applicant: SHENZHEN SHOKZ CO., LTD.
Inventor： Yueqiang Wang , Haofeng Zhang , Yongjian Li , Yunbin Chen , Fen You , Lei Zhang
IPC: G02C11/00 , G02C5/22 , H04R1/02 , H04R1/10 , H04R9/06 , H04R1/06 , H04R9/02 , G02C5/14 , G02C11/06 , H04R1/28 , H05K1/02 , H04R25/00 , H04R1/04 , H05K1/18
CPC classification number: G02C11/10 , G02C5/14 , G02C5/22 , G02C5/2254 , G02C11/06 , H04R1/02 , H04R1/028 , H04R1/04 , H04R1/06 , H04R1/10 , H04R1/1008 , H04R1/1033 , H04R1/1041 , H04R1/1075 , H04R1/1083 , H04R1/28 , H04R9/02 , H04R9/025 , H04R9/06 , H04R25/65 , H05K1/028 , H05K1/189 , H04R2460/13 , H05K2201/05
Abstract: The present disclosure provides eyeglasses including: an eyeglass rim; an eyeglass temple, the eyeglass temple comprising a control circuit or a battery; a rotating shaft, the rotating shaft being configured to connect the eyeglass rim and the eyeglass temple, so that the eyeglass rim and the eyeglass temple are relatively rotated around the rotating shaft, and the rotating shaft being disposed with a rotating shaft wiring channel along an axial direction; a connection wire, the connection wire passing through the rotating shaft wiring channel and extending to the eyeglass rim and the eyeglass temple, respectively; and a loud speaking component, the loud speaking component comprising an earphone core, the loud speaking component being connected to the eyeglass temple, the control circuit or battery in the eyeglass temple driving the earphone core to vibrate to generate a sound through the connection wire, and the sound comprising at least two formants. In the present disclosure, a wiring approach in a speaker may be simplified through a flexible circuit board. The eyeglass rim and the eyeglass temple may be connected through a rotating shaft, thereby protecting the connection wire in the eyeglasses and extending the life of the connection wire.
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107.发明公开公开(公告)号：US20230309225A1
公开(公告)日：2023-09-28
申请号：US18326426
申请日：2023-05-31
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Han-Sung BAE , Wonkyu KWAK , Cheolgeun AN
IPC: H05K1/11 , H01L23/00 , G02F1/1345
CPC classification number: H05K1/118 , H05K1/111 , H01L24/06 , G02F1/13458 , H05K2201/058 , H05K2201/05 , H05K2201/09418 , H05K2201/094 , H05K3/361
Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.
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公开(公告)号：US20230199291A1
公开(公告)日：2023-06-22
申请号：US17752262
申请日：2022-05-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Se Yeon HWANG , Hyun Sang KWAK , Yeo Ok JEON , Joon Woo GI , Seok Hwan KIM
CPC classification number: H04N5/2253 , H04N5/2257 , H05K1/181 , H05K2201/10151 , H05K2201/05
Abstract: A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.
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公开(公告)号：US11678538B2
公开(公告)日：2023-06-13
申请号：US17523153
申请日：2021-11-10
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Shunpei Yamazaki , Kensuke Yoshizumi
CPC classification number: H01L27/3276 , G04G9/0088 , H01L27/3262 , H01L51/0097 , H01L27/1244 , H01L2227/323 , H01L2251/5338 , H05K1/028 , H05K1/0277 , H05K1/0283 , H05K1/147 , H05K1/189 , H05K2201/05 , H05K2201/051 , H05K2201/052 , H05K2201/053 , H05K2201/055 , Y02E10/549
Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.
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公开(公告)号：US10064282B2
公开(公告)日：2018-08-28
申请号：US15158645
申请日：2016-05-19
Applicant: TactoTek Oy
Inventor： Mikko Heikkinen , Jarmo Sääski , Jarkko Torvinen
IPC: H01L23/00 , H05K1/18 , H05K1/02 , H01L33/52 , H01L23/498 , H01L23/538 , H01L51/00
CPC classification number: H05K1/186 , H01L23/4985 , H01L23/5387 , H01L33/52 , H01L51/0097 , H01L2224/1319 , H01L2933/005 , H05K1/0274 , H05K1/0298 , H05K1/189 , H05K3/284 , H05K2201/0129 , H05K2201/05 , H05K2201/09872 , H05K2201/10106 , H05K2201/10151 , H05K2203/1316 , H05K2203/1322
Abstract: A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device.
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