公开(公告)号：US09426890B2

公开(公告)日：2016-08-23

申请号：US14474643

申请日：2014-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyo Jae Jang ,  Chan Hong Park ,  Jeong Ho Bang ,  Jong Myung Lee ,  Sun Weon Jeong ,  Hyeong Sik Choi

IPC: G02F1/1345 ,  H05K1/14 ,  G06F1/16 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/147 ,  G06F1/16 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/148 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10128

Abstract: Disclosed herein is a display apparatus that reduces a magnitude of a tension applied to a flexible PCB when a display panel is provided with a curved surface, and prevents damage of a driving chip. The display apparatus in accordance with exemplary embodiments includes a display panel configured to display an image, a source printed circuit board configured to control the display panel, and a flexible PCB that connects the display panel and the source printed circuit board. A length of at least one side edge of the flexible PCB is formed longer than a minimum length from the display panel to the source printed circuit board.

Abstract translation: 这里公开了一种显示装置，当显示面板设置有弯曲表面时，减小施加到柔性PCB的张力的大小，并且防止驱动芯片的损坏。 根据示例性实施例的显示装置包括被配置为显示图像的显示面板，被配置为控制显示面板的源印刷电路板以及连接显示面板和源印刷电路板的柔性PCB。 柔性PCB的至少一个侧边缘的长度形成为比从显示面板到源印刷电路板的最小长度更长。

公开(公告)号：US20160135309A1

公开(公告)日：2016-05-12

申请号：US14674615

申请日：2015-03-31

Applicant: Inventec (Pudong) Technology Corporation ,  INVENTEC CORPORATION

Inventor： Chia-Liang HSIAO

IPC: H05K5/02

CPC classification number: H05K7/142 ,  H05K2201/09145

Abstract: A secure device is used for securing a printed circuit board assembly. The secure device includes a fixed base and a plurality of removable securing member. The fixed base includes a base body, a plurality of locking structures and fixed structures. The fixed structure has a key-shape hole. Each of the removable securing members respectively includes a post, an interference portion and a lock portion. When the printed circuit board assembly is operated to be secured by the removable securing members, a first side of the printed circuit board assembly needs to be locked by the locking structure firstly; the interference portion of each removable securing member needs to be inserted into the key-shape hole, and interfered with the key-shape hole after the respective of the removable securing members is turned along a rotation direction, thereby to make the printed circuit board assembly secured by the removable securing members.

Abstract translation: 安全装置用于固定印刷电路板组件。 安全装置包括固定基座和多个可移除的固定构件。 固定基座包括基体，多个锁定结构和固定结构。 固定结构有一个键形孔。 每个可移除的固定构件分别包括柱，干涉部和锁定部。 当印刷电路板组件被可移除的固定构件固定时，印刷电路板组件的第一面首先被锁定结构锁定; 每个可拆卸的固定构件的干涉部分需要插入钥匙形孔中，并且在各个可拆卸的固定构件沿着旋转方向转动之后，与钥匙形孔相干涉，从而使印刷电路板组件 由可拆卸的固定构件固定。

公开(公告)号：US09160087B2

公开(公告)日：2015-10-13

申请号：US13899799

申请日：2013-05-22

Applicant: YAZAKI CORPORATION

Inventor： Hideki Yamanaka ,  Hiromi Watanabe

IPC: H01R12/55 ,  H01R12/57 ,  H01R12/72 ,  H05K3/34

CPC classification number: H01R12/57 ,  H01R12/55 ,  H01R12/724 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/09145 ,  H05K2201/1034

Abstract: A board connecting terminal includes a contact which comes into contact with a mate side terminal, and a solder part soldered to a pad part formed in a circuit board and connected to the contact. The solder part includes a solder part main body soldered to the pad part, a first engaging piece extended from the solder part main body and a second engaging piece extended from the solder part main body. The solder part main body is soldered to the pad part under a state that the first engaging piece and the second engaging piece are engaged with the circuit board.

Abstract translation: 板连接端子包括与配合侧端子接触的触点和焊接到形成在电路板中并连接到触点的焊盘部分的焊接部分。 焊料部分包括焊接到焊盘部分的焊料部分主体，从焊料部分主体延伸的第一接合件和从焊料部分主体延伸的第二接合件。 焊料部分主体在第一接合件和第二接合件与电路板接合的状态下焊接到焊盘部分。

公开(公告)号：US20150282313A1

公开(公告)日：2015-10-01

申请号：US14428526

申请日：2013-09-17

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

Inventor： Kiminori Ozaki ,  Yasuhiro Koike ,  Hiroaki Asano ,  Hitoshi Shimazu ,  Tomoaki Asai

IPC: H05K1/11 ,  H05K3/00 ,  H05K1/02 ,  H05K3/36 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K1/11 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0213 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0073 ,  H05K3/36 ,  H05K3/368 ,  H05K3/4069 ,  H05K2201/0305 ,  H05K2201/09145 ,  H05K2201/10287 ,  H05K2201/2072 ,  H05K2203/043 ,  Y10T29/49126

Abstract: A wiring board includes a first substrate including a first surface and a second substrate including a first surface. A solder hole is arranged at least in the first surface of the first substrate. A solder hole is arranged at least in the first surface of the second substrate. The second substrate is coupled to the first substrate. The first substrate and the second substrate are electrically connected with each other. The first surface of the first substrate and the first surface of the second substrate are flush with each other and configured such that a part of one surface of a mask is placed on the first surface of the first substrate and another part of the surface of the mask is placed on the first surface of the second substrate.

Abstract translation: 布线基板包括包括第一表面的第一基板和包括第一表面的第二基板。 至少在第一基板的第一表面中布置有焊料孔。 至少在第二基板的第一表面中布置有焊料孔。 第二衬底耦合到第一衬底。 第一基板和第二基板彼此电连接。 第一基板的第一表面和第二基板的第一表面彼此齐平并且被配置为使得掩模的一个表面的一部分被放置在第一基板的第一表面上，另一部分表面的 掩模放置在第二基板的第一表面上。

公开(公告)号：US20150270227A1

公开(公告)日：2015-09-24

申请号：US14218384

申请日：2014-03-18

Applicant: Apple Inc.

Inventor： Richard H. Dinh ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H01L23/552 ,  H01L23/58 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02 ,  H01L23/538 ,  H05K1/18

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L27/14618 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81801 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K1/0218 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/363 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09145 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/10378 ,  H05K2201/2018 ,  H01L2924/014 ,  H01L2924/00

Abstract: An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.

Abstract translation: 电气部件可以安装在诸如陶瓷基板的基板上。 可以在基板的上表面和下表面上形成接触。 电气部件可以焊接到上表面上的触点。 下表面上的触点可用于将基板焊接到印刷电路。 在制造过程中，可能需要在陶瓷板上使用金属迹线来连接到基板上的触点。 在陶瓷面板分层以形成陶瓷衬底之后，一些金属迹线可以流到陶瓷衬底的边缘。 印刷电路的折叠片可以形成覆盖这些暴露痕迹的屏蔽。 沿着衬底的每个边缘延伸的划分的金属涂覆的凹槽或一排划分的金属涂覆的通孔也可以提供屏蔽。

公开(公告)号：US09136522B2

公开(公告)日：2015-09-15

申请号：US13031059

申请日：2011-02-18

Applicant: Myung-Jun Lee

Inventor： Myung-Jun Lee

IPC: H01M2/00 ,  H01M2/10 ,  H01M10/42 ,  H01M2/30 ,  H01M2/34 ,  H01M10/04 ,  H01M2/22 ,  H05K3/40 ,  H01M2/02 ,  H05K1/18 ,  H05K3/00

CPC classification number: H01M2/30 ,  H01M2/0212 ,  H01M2/22 ,  H01M2/34 ,  H01M10/04 ,  H01M10/425 ,  H01M2200/00 ,  H05K1/189 ,  H05K3/0064 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/10037 ,  H05K2201/2009

Abstract: A protection circuit module of a rechargeable battery comprises a substrate formed of a flexible insulator and including a circuit supporting unit and a wiring supporting unit extending from the circuit supporting unit; a conductive circuit pattern unit formed on the circuit supporting unit; a conductive wiring unit formed on the wiring supporting unit, wherein the wiring unit is electrically connected to the circuit pattern unit and extends along the wiring supporting unit; circuit elements electrically connected to the circuit pattern unit and formed on one surface of the circuit supporting unit; and a reinforcement unit formed on an opposing surface of the circuit supporting unit and supporting the circuit supporting unit.

Abstract translation: 可充电电池的保护电路模块包括由柔性绝缘体形成的基板，包括电路支撑单元和从电路支撑单元延伸的布线支撑单元; 形成在所述电路支撑单元上的导电电路图案单元; 形成在所述布线支撑单元上的导电布线单元，其中所述布线单元电连接到所述电路图案单元并沿着所述布线支撑单元延伸; 电路元件电连接到电路图案单元并形成在电路支撑单元的一个表面上; 以及形成在所述电路支撑单元的相对表面上并且支撑所述电路支撑单元的加强单元。

公开(公告)号：US09090062B2

公开(公告)日：2015-07-28

申请号：US13420803

申请日：2012-03-15

Applicant: Toshimitsu Watanabe

Inventor： Toshimitsu Watanabe

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00 ,  B41J2/14 ,  H05K1/02 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36

CPC classification number: B41J2/14201 ,  B41J2002/14362 ,  H05K1/02 ,  H05K3/00 ,  H05K3/3405 ,  H05K3/363 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2203/0165 ,  Y10T29/49124

Abstract: According to one embodiment, a circuit board includes a board main body, an electrode, a circuit plate and a connector. The board main body includes a first surface, a second surface located opposite to the first surface, a first side edge that extends between the first surface and the second surface, and a second side edge that extends between the first surface and the second surface and intersects the first side edge. The second side edge is provided with a fitting part. The electrode is provided on the first surface. The circuit plate is soldered to the electrode and has flexibility. The connector is attached to the board main body. A cable is inserted into the connector in a direction perpendicular to the first side edge.

Abstract translation: 根据一个实施例，电路板包括板主体，电极，电路板和连接器。 板主体包括第一表面，与第一表面相对的第二表面，在第一表面和第二表面之间延伸的第一侧边缘，以及在第一表面和第二表面之间延伸的第二侧边缘，以及 与第一侧边缘相交。 第二侧边缘设有配合部。 电极设置在第一表面上。 电路板焊接到电极并具有柔性。 连接器连接到板主体。 电缆沿垂直于第一侧边缘的方向插入连接器中。

公开(公告)号：US09035454B2

公开(公告)日：2015-05-19

申请号：US14092320

申请日：2013-11-27

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Masayuki Nagamatsu ,  Mayumi Nakasato ,  Masurao Yoshii ,  Yasuhiro Kohara ,  Kotaro Deguchi

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/05 ,  H01L23/373 ,  H01L21/56 ,  H01L23/31 ,  H05K3/00 ,  H01L23/498

CPC classification number: H01L23/48 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/053 ,  H05K1/056 ,  H05K3/0052 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/09145 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Prepared in advance is a substrate formed of metallic material where slits are formed between mounting regions. Oxide films are generated all over the substrate including end faces of the substrate. Exposed are only lateral faces corresponding to the cross sections cut when tie bars are cut. This structure and the fabrication method minimize the area of cutting faces in the metallic material.

Abstract translation: 预先制备的是由金属材料形成的基板，其中在安装区域之间形成狭缝。 在包括衬底的端面的衬底上产生氧化物膜。 暴露的仅是与切断连接条时切断的横截面对应的侧面。 该结构和制造方法使金属材料中的切割面的面积最小化。

公开(公告)号：US08981869B2

公开(公告)日：2015-03-17

申请号：US12694450

申请日：2010-01-27

Applicant: Angelo M. Puzella ,  Joseph M. Crowder ,  Patricia S. Dupuis ,  Michael C. Fallica ,  John B. Francis ,  Joseph A. Licciardello

Inventor： Angelo M. Puzella ,  Joseph M. Crowder ,  Patricia S. Dupuis ,  Michael C. Fallica ,  John B. Francis ,  Joseph A. Licciardello

IPC: H03H7/38 ,  H01Q21/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01Q21/0087 ,  H03H7/38 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/09145 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09718 ,  H05K2201/09727 ,  H05K2201/209 ,  H05K2203/061 ,  Y10T29/49165

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract translation: 多层电路板组件包括构成电路板组件的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 RF互连可以包括一个或多个RF匹配焊盘，其提供用于匹配RF短截线的阻抗特性的机制，以在期望的RF工作频带上提供具有期望的插入损耗和阻抗特性的RF互连。 RF匹配焊盘允许制造具有RF互连的电路板，而不需要执行任何后钻和反向填充操作以去除多层电路板组件中的RF互连的短截线部分。

公开(公告)号：US20150070849A1

公开(公告)日：2015-03-12

申请号：US14090445

申请日：2013-11-26

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masaya SHIMAMURA ,  Takehiko KAI ,  Eiji MUGIYA ,  Tetsuo SAJI ,  Hiroshi NAKAMURA

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/0215 ,  H05K1/0269 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0037 ,  H05K9/0083 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09972 ,  H05K2201/1056 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.

Abstract translation: 提供一种电路模块，包括具有安装表面的电路基板; 安装在安装表面上的安装部件; 所述密封体形成在所述安装表面上，所述密封体覆盖所述安装部件，并且具有从所述密封体的主表面到所述安装表面形成的沟槽; 以及屏蔽体，其具有形成在所述沟槽内的内屏蔽部和覆盖所述密封体和所述内屏蔽部的外屏蔽部，所述外屏蔽部具有形成在所述屏蔽体的主表面上的平坦面的第一部， 形成在所述内屏蔽部上并从所述第一部分突出或下垂的第二部分。