公开(公告)号：US20050242437A1

公开(公告)日：2005-11-03

申请号：US11172325

申请日：2005-06-30

Applicant: Stephen Moxham ,  William Stephenson

Inventor： Stephen Moxham ,  William Stephenson

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/113 ,  H05K1/116 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The apparatus can further include a first connection structure carried by the support member. The first connection structure can have a first bond site configured to receive a flowable conductive material, and can further have at least two first elongated members connected and extending outwardly from the first bond site. Each first elongated member can be configured to receive at least a portion of the flowable conductive material from the first bond site, with none of the first elongated members being electrically coupled to the microelectronic substrate. The assembly can further include a second connection structure that is electrically coupled to the microelectronic substrate and that can include second elongated members extending away from a second bond site. The number of second elongated members can be equal to the number of first elongated members.

Abstract translation: 一种用于支撑微电子衬底的方法和装置。 该装置可以包括微电子衬底和承载微电子衬底的支撑构件。 该装置还可以包括由支撑构件承载的第一连接结构。 第一连接结构可以具有构造成接收可流动的导电材料的第一接合位置，并且还可以具有连接并从第一接合位置向外延伸的至少两个第一细长构件。 每个第一细长构件可以被构造成从第一接合位置接收可流动的导电材料的至少一部分，而第一细长构件没有一个电耦合到微电子衬底。 组件还可以包括电耦合到微电子衬底的第二连接结构，并且可以包括远离第二接合位置延伸的第二细长构件。 第二细长构件的数量可以等于第一细长构件的数量。

公开(公告)号：US20050217894A1

公开(公告)日：2005-10-06

申请号：US11100005

申请日：2005-04-05

Applicant: Chun-Chieh Pan

Inventor： Chun-Chieh Pan

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K3/34

CPC classification number: H01L24/73 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2224/16237 ,  H01L2224/17104 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A fabrication method and structure for a PBCA, and tool for assembly of the structure. The structure includes a circuit board, at least one first solder joint, a plurality of second solder joints, and an electronic device. The circuit board has a solder mask, having a plurality of openings exposing at least one first pad and a plurality of second pads arranged beyond the first pad, on a surface. The first solder joint has a maximum width J1 and electrically connects to the first pad. The second solder joints respectively have a maximum width J2 exceeding J1 and respectively electrically connect to the second pads. The electronic device has a plurality of third pads, arranged substantially corresponding to the openings, respectively electrically connecting to the first pad and second pads.

Abstract translation: 一种PBCA的制造方法和结构，以及该结构的装配工具。 该结构包括电路板，至少一个第一焊接接头，多个第二焊点和电子器件。 电路板具有焊接掩模，其具有在表面上暴露至少一个第一焊盘和布置成超过第一焊盘的多个第二焊盘的多个开口。 第一焊点具有最大宽度J 1和电连接到第一焊盘。 第二焊点分别具有超过J 1的最大宽度J 2，并且分别电连接到第二焊盘。 电子设备具有多个第三焊盘，其大致对应于开口分别电连接到第一焊盘和第二焊盘。

公开(公告)号：US20050202722A1

公开(公告)日：2005-09-15

申请号：US11057262

申请日：2005-02-14

Applicant: Kent Regnier ,  David Brunker ,  Martin Ogbuokiri

Inventor： Kent Regnier ,  David Brunker ,  Martin Ogbuokiri

IPC: H01R12/16 ,  H01R13/648 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0245 ,  H01R12/523 ,  H05K1/0222 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09381 ,  H05K2201/09718

Abstract: A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board.

Abstract translation: 公开了一种在高速差分信号应用中使用电路板设计或电路走线出口结构的电路板设计。 电路板中的一对差分信号通孔被形成在布置在电路板的另一层上的接地平面内的开口包围。 通孔通过出口结构连接到电路板上的迹线，该出口结构包括将标志部分连接到电路板迹线的两个标记部分和相关联的倾斜部分。 在替代实施例中，将差分信号通路的电路板迹线设置在设置在电路板的另一层上的宽接地条上的电路板的一层中。

公开(公告)号：US06940179B2

公开(公告)日：2005-09-06

申请号：US10800058

申请日：2004-03-12

Applicant: Teck Kheng Lee

Inventor： Teck Kheng Lee

IPC: H01L23/485 ,  H05K1/11 ,  H05K3/28 ,  H01L23/48 ,  H01L23/52

CPC classification number: H05K1/112 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/28 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/0969 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A solder ball pad is provided for mounting and connecting of electronic devices and, more particularly, apparatus and methods are disclosed providing an improved solder ball pad structure on a substrate, such as a printed circuit board (“PCB”) or a semiconductor die, while enabling better use of the spaces between adjacent solder ball pads, and at the same time providing increased surface area for bonding to a solder ball. More particularly, the inventive solder ball pad structure comprises a terminal pad exposed through an aperture in an insulative mask having a bond pad layer comprising at least another metal layer formed over, at most, a portion of the exposed portion of the terminal pad. Methods of manufacture and substrates incorporating same are also disclosed.

Abstract translation: 提供了用于安装和连接电子器件的焊球垫，更具体地，公开了一种在诸如印刷电路板（“PCB”）或半导体管芯的衬底上提供改进的焊球焊盘结构的装置和方法， 同时能够更好地利用相邻焊球之间的空间，并且同时提供用于粘合到焊球的增加的表面积。 更具体地，本发明的焊球焊盘结构包括通过绝缘掩模中的孔暴露的端子焊盘，其具有接合焊盘层，该接合焊盘层至少包括在端子焊盘的暴露部分的至多一部分上形成的另一金属层。 还公开了制造方法和结合其的基板。

公开(公告)号：US06917118B2

公开(公告)日：2005-07-12

申请号：US10689097

申请日：2003-10-21

Applicant: Kouji Omori ,  Masayuki Yukawa ,  Toshiyuki Nakazawa ,  Seishi Oida ,  Takashi Ogawa ,  Shigeki Sakaguchi

Inventor： Kouji Omori ,  Masayuki Yukawa ,  Toshiyuki Nakazawa ,  Seishi Oida ,  Takashi Ogawa ,  Shigeki Sakaguchi

IPC: B23K35/26 ,  C22C13/00 ,  H01L23/12 ,  H01L23/485 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L29/40

CPC classification number: H01L24/10 ,  H01L23/49838 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/09381 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164

Abstract: On a surface of an electronic component facing a substrate, a plurality of electrode terminals are provided which are of circular plane shapes. On regions of the main surface of the substrate facing the electrode terminals, a plurality of interconnect electrodes are provided which are of circular plane shapes.

Abstract translation: 在面向基板的电子部件的表面上设置有圆形平面形状的多个电极端子。 在面向电极端子的基板的主表面的区域上，设置有圆形平面形状的多个互连电极。

公开(公告)号：US20050061545A1

公开(公告)日：2005-03-24

申请号：US10669982

申请日：2003-09-23

Applicant: Steven Rosenau ,  Mohammed Ali ,  Jonathan Simon ,  Brian Lemoff ,  Lisa Windover

Inventor： Steven Rosenau ,  Mohammed Ali ,  Jonathan Simon ,  Brian Lemoff ,  Lisa Windover

IPC: H01L23/12 ,  H01L23/498 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K7/06

CPC classification number: H01L24/49 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/6627 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85207 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1903 ,  H05K1/0237 ,  H05K1/113 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/10674 ,  H05K2203/049 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads. The flexible circuit also includes vias disposed proximate the first type of electrical connection pads and extended through the ground plane to provide for electrically coupling the first transmission line and the second transmission line, such that the vias reduce discontinuity in the ground plane and aggregate discontinuity in the flex circuit.

Abstract translation: 具有通孔的柔性电路，其设置成使分离相对传输线的接地平面中的不连续性最小化。 柔性电路包括耦合到第一表面的第一传输线，耦合到第二相对表面的第二传输线和分离第一传输线和第二传输线的接地平面。 柔性电路还包括设置在第一表面上并电耦合到第一传输线的第一类型的电连接焊盘。 柔性电路还包括设置在第二表面上的第二类型的电连接焊盘，并且电耦合到第二传输线，其中第二类型的电连接焊盘具有比第一类型的电连接焊盘更高的面密度。 柔性电路还包括设置在第一类型的电连接焊盘附近并延伸穿过接地平面以提供电耦合第一传输线和第二传输线的通孔，使得通孔减小接地平面中的不连续性并且聚集不连续性 柔性电路。

公开(公告)号：US06870276B1

公开(公告)日：2005-03-22

申请号：US10034924

申请日：2001-12-26

Applicant: Stephen Moxham ,  William Stephenson

Inventor： Stephen Moxham ,  William Stephenson

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/113 ,  H05K1/116 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/099 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

Abstract: 058804113 A method and apparatus for supporting a microelectronic substrate. The apparatus can include a microelectronic substrate and a support member carrying the microelectronic substrate. The apparatus can further include a first connection structure carried by the support member. The first connection structure can have a first bond site configured to receive a flowable conductive material, and can further have at least two first elongated members connected and extending outwardly from the first bond site. Each first elongated member can be configured to receive at least a portion of the flowable conductive material from the first bond site, with none of the first elongated members being electrically coupled to the microelectronic substrate. The assembly can further include a second connection structure that is electrically coupled to the microelectronic substrate and that can include second elongated members extending away from a second bond site. The number of second elongated members can be equal to the number of first elongated members.

Abstract translation: 058804113一种用于支撑微电子基板的方法和装置。 该装置可以包括微电子衬底和承载微电子衬底的支撑构件。 该装置还可以包括由支撑构件承载的第一连接结构。 第一连接结构可以具有构造成接收可流动的导电材料的第一接合位置，并且还可以具有连接并从第一接合位置向外延伸的至少两个第一细长构件。 每个第一细长构件可以被构造成从第一接合位置接收可流动的导电材料的至少一部分，而第一细长构件没有一个电耦合到微电子衬底。 组件还可以包括电耦合到微电子衬底的第二连接结构，并且可以包括远离第二接合位置延伸的第二细长构件。 第二细长构件的数量可以等于第一细长构件的数量。

公开(公告)号：US06867504B2

公开(公告)日：2005-03-15

申请号：US10615533

申请日：2003-07-07

Applicant: Guy Lichtenwalter ,  Norman D. Marschke

Inventor： Guy Lichtenwalter ,  Norman D. Marschke

IPC: H01R43/02 ,  H05K1/11 ,  H05K3/34 ,  H05K13/00 ,  H05K13/04 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01R43/0256 ,  H01R43/0263 ,  H05K1/111 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/3421 ,  H05K13/0015 ,  H05K13/0465 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2203/043 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component lead. Solder is disposed on the pad and heated to a molten state so that surface tension and wetting effects form the molten solder into a solder mound having a U-shaped lateral cross section conforming to the U-shaped metalized pad. The solder mound has a first arm and a second arm, and a lateral aperture extending therebetween for receiving an extremity of the component lead, and registering the extremity of the component lead with respect to the pad.

Abstract translation: 一种用于印刷电路板焊盘的方法和装置，其具有用于部件引线的配准特征。 U形金属化垫设置在印刷电路板上用于焊接到部件引线。 将焊料放置在焊盘上并加热至熔融状态，使得表面张力和润湿效果从熔融焊料形成具有符合U形金属化焊盘的U形横截面的焊料堆焊。 焊料墩具有第一臂和第二臂以及在其间延伸的侧向孔，用于接收元件引线的末端，并且将元件引线的末端相对于焊盘进行配准。

公开(公告)号：US20050030467A1

公开(公告)日：2005-02-10

申请号：US10939383

申请日：2004-09-14

Applicant: Hiroshi Ueda ,  Hitoshi Morishita

Inventor： Hiroshi Ueda ,  Hitoshi Morishita

IPC: G02F1/1343 ,  G02F1/1345 ,  H05K1/11 ,  H05K3/36

CPC classification number: H05K3/361 ,  G02F1/1345 ,  H05K1/117 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427

Abstract: The present invention is directed to a liquid crystal display including: a plurality of electrode terminals arranged on one of end faces of a TFT glass substrate in such a manner as to be aligned on an imaginary line; and a plurality of lead terminals of a tape carrier package aligned on the electrode terminals, said plurality of lead terminals connected through an anisotropic conductive film; wherein the electrode terminals near the end face of the glass substrate is formed obliquely in such a manner as to be extended in the direction of both right and left with respect to the plurality of electrode terminals.

Abstract translation: 本发明涉及一种液晶显示器，它包括：多个电极端子，以在假想线上对齐的方式设置在TFT玻璃基板的一个端面上; 以及在所述电极端子上排列的带状载体封装体的多个引线端子，所述多个引线端子通过各向异性导电膜连接; 其中靠近玻璃基板的端面的电极端子以相对于多个电极端子在左右两个方向上延伸的方式倾斜地形成。

公开(公告)号：US06853091B2

公开(公告)日：2005-02-08

申请号：US10627710

申请日：2003-07-28

Applicant: Yoshiyuki Miyajima

Inventor： Yoshiyuki Miyajima

IPC: B23K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01K23/48

CPC classification number: H05K1/116 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/0201 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/062 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/0989

Abstract: A printed circuit board having circuit patterns printed thereon has a plurality of composite lands each including a first land having a terminal hole formed at its center for inserting the terminal of a selected electric or electronic part or device, and a plurality of second lands each being contiguous to and extending outwards from the first land. The areas contiguous to the contours of the first and second lands have no conductive foils, such as copper foils, thereon such that the substrate surface of the printed circuit board is exposed in these areas. The exposed areas are effective to confine the thermal energy in the limited areas for soldering. And the composite land shape defines a ridged cone-like solder lump, which can fixedly grip the terminal of the part or device.

Abstract translation: 具有印刷电路图案的印刷电路板具有多个复合凸台，每个复合凸台包括第一凸台，该第一凸台具有形成在其中心的端子孔，用于插入所选择的电气或电子部件或装置的端子，以及多个第二凸台 与第一个土地相邻并向外延伸。 与第一和第二焊盘的轮廓相邻的区域在其上没有导电箔，例如铜箔，使得印刷电路板的衬底表面暴露在这些区域中。 暴露的区域有效地将热能限制在有限的焊接区域。 并且复合平台形状限定了脊状的锥形焊料块，其可以固定地夹持部件或装置的端子。