公开(公告)号：US20010042637A1

公开(公告)日：2001-11-22

申请号：US09797916

申请日：2001-03-05

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K001/03

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 nullm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20010027842A1

公开(公告)日：2001-10-11

申请号：US09871555

申请日：2001-05-31

Applicant: International Business Machines Corporation

Inventor： Brian E. Curcio ,  Peter Alfred Gruber ,  Frederic Maurer ,  Konstantinos I. Papathomas ,  Mark David Poliks

IPC: B32B031/00

CPC classification number: H05K3/4069 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0126 ,  H05K2203/085 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/53191 ,  H01L2924/00

Abstract: High aspect ratio (5:1-30:1) and small (5 nullm-125 nullm) diameter holes in a dielectric substrate are provided, which are filled with a solidified conductive material, as well as a method of filling such holes using pressure and vacuum. In certain embodiments, the holes are lined with conductive material and/or capped with a conductive material. The invention also contemplates a chip carrier formed by such material.

Abstract translation: 提供介电基片中的高纵横比（5：1-30：1）和小（5毫米-125毫米）直径的孔，填充有凝固的导电材料，以及使用压力填充这些孔的方法 和真空。 在某些实施例中，孔用导电材料衬里和/或用导电材料封盖。 本发明还考虑由这种材料形成的芯片载体。

公开(公告)号：US6005198A

公开(公告)日：1999-12-21

申请号：US946297

申请日：1997-10-07

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01R12/55 ,  H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46 ,  H01R9/09

CPC classification number: H05K3/005 ,  H05K1/115 ,  H05K3/107 ,  H05K3/4652 ,  H05K1/095 ,  H05K1/112 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/041 ,  H05K2203/0746 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/1572 ,  H05K3/0014 ,  H05K3/061 ,  H05K3/1241 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/465 ,  Y10T29/49126 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped recess in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.

Abstract translation: 布线板结构包括设置在基底基板中的至少一个微孔，并且在其顶表面中包括深刻刻的杯形凹部。 导体材料设置在凹部内，并且具有设置在其底部的部分。 设置在与导体材料底部相对的基板的底表面处的导体有助于完成穿过基板的导电路径，以帮助完成穿过基板的导电路径。

公开(公告)号：US5451722A

公开(公告)日：1995-09-19

申请号：US317326

申请日：1994-10-04

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: B29C33/38 ,  B29C33/42 ,  B29C33/56 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H05K1/02

CPC classification number: H05K1/111 ,  B29C33/3878 ,  B29C33/42 ,  B29C33/56 ,  H05K3/0014 ,  H05K3/205 ,  B29L2031/3425 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0315 ,  H05K3/025 ,  H05K3/061 ,  H05K3/107 ,  H05K3/384 ,  H05K3/385 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24917

Abstract: A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.

Abstract translation: 一种新的改进的印刷电路板工具及其制造和使用方法，用于生产具有在其中具有强粘合或层压金属垫的凹槽的三维印刷电路板。 印刷电路板工具包括具有设置在基板表面中的多个凹槽形成突起的金属化阳模基板。 制造金属化模具的方法包括形成可用于生产大量用于生产新的和改进的三维印刷电路板的金属化阳模的母本或前驱主工具。 新型改进的三维印刷电路板包括由高热偏转塑料构成的基板和模制到基板表面中的多个凹槽或凹槽，用于在其中接收集成电路的细间距，紧密间隔的引线。 多个金属化的凹陷垫或焊盘粘合或粘合在凹槽内，以在每个凹槽内建立电路径。

公开(公告)号：US5390412A

公开(公告)日：1995-02-21

申请号：US45366

申请日：1993-04-08

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: B29C33/38 ,  B29C33/42 ,  B29C33/56 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H01K3/22 ,  H01K3/10

CPC classification number: H05K1/111 ,  B29C33/3878 ,  B29C33/42 ,  B29C33/56 ,  H05K3/0014 ,  H05K3/205 ,  B29L2031/3425 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09981 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0315 ,  H05K3/025 ,  H05K3/061 ,  H05K3/107 ,  H05K3/384 ,  H05K3/385 ,  Y02P70/611 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24917

Abstract: A new and improved printed circuit board tool and method of making and using it, to produce three dimensional printed circuit boards having grooves with strongly bonded or laminated metallic pads therein. The printed circuit board tool includes a metallized male mold substrate having a plurality of groove forming projections disposed in the substrate surface. The method of making the metallized mold includes forming a female parent or predecessor master tool that may be used to produce a large number of the metallized male molds for producing new and improved three-dimensional printed circuit boards. The new and improved three-dimensional printed circuit board includes a substrate composed of a high heat deflective plastic, and a plurality of recesses or grooves molded into the substrate surface for receiving therein the fine pitch, closely spaced-apart leads of an integrated circuit. A plurality of metallized sunken pads or lands are adhered or bonded within the grooves for establishing an electrical path within each groove.

Abstract translation: 一种新的改进的印刷电路板工具及其制造和使用方法，用于生产具有在其中具有强粘合或层压金属垫的凹槽的三维印刷电路板。 印刷电路板工具包括具有设置在基板表面中的多个凹槽形成突起的金属化阳模基板。 制造金属化模具的方法包括形成可用于生产大量用于生产新的和改进的三维印刷电路板的金属化阳模的母本或前驱主工具。 新型改进的三维印刷电路板包括由高热偏转塑料构成的基板和模制到基板表面中的多个凹槽或凹槽，用于在其中接收集成电路的细间距，紧密间隔的引线。 多个金属化的凹陷垫或焊盘粘合或粘合在凹槽内，以在每个凹槽内建立电路径。