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公开(公告)号：US11937369B2
公开(公告)日：2024-03-19
申请号：US15733672
申请日：2019-03-28
Applicant: AT&S (China) Co. Ltd.
Inventor： Seok Kim Tay , Azmi Ibrahim , Wenping Dai , Chunjie Shen
CPC classification number: H05K1/0268 , G06K7/1413 , G06K19/06028 , H05K1/0269 , H05K3/0005 , H05K2201/09927 , H05K2201/09936 , H05K2203/163
Abstract: A component carrier related body which includes a stack with a plurality of electrically conductive and/or electrically insulating layer structures, and at least two information carrying structures formed vertically displaced on at least two different of the layer structures, wherein at least two of the at least two information carrying structures are laterally displaced in a plan view on the stack.
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公开(公告)号：US20190250447A1
公开(公告)日：2019-08-15
申请号：US16269906
申请日：2019-02-07
Applicant: Japan Display Inc.
Inventor： Hideaki ABE , Yasuhito ARUGA , Hiroyuki ONODERA , Hiroki KATO , Yasushi NAKANO , Hitoshi KAWAGUCHI , Keisuke ASADA
CPC classification number: G02F1/13452 , G02F1/13458 , G02F1/1368 , G02F2001/133354 , G02F2202/28 , H01L27/1214 , H05K1/0266 , H05K1/11 , H05K1/144 , H05K1/181 , H05K3/368 , H05K2201/041 , H05K2201/049 , H05K2201/09936 , H05K2201/10136 , H05K2203/166
Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.
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103.发明申请公开(公告)号：US20180088471A1
公开(公告)日：2018-03-29
申请号：US15681720
申请日：2017-08-21
Applicant: KANTATSU CO., LTD.
Inventor： Eiji OSHIMA
IPC: G03F7/20
CPC classification number: G03F7/70791 , G03F7/203 , G03F7/2053 , G03F7/343 , G03F7/38 , G03F7/70191 , G03F7/70208 , G03F7/7045 , G03F7/70541 , H05K2201/09936
Abstract: A pattern forming photo-curing layer is heated, thereby enabling quick shaping. A pattern manufacturing apparatus (100) includes a controller (101), a laser projector (102), and a heater (103). The controller (101) controls the laser projector (102) to form a pattern on a pattern forming sheet (130) placed on a stage (140). The laser projector (102) includes an optical engine (121), and the controller (101) controls the laser projector (102) to irradiate the pattern forming sheet (130) with a light beam from the optical engine (121). The heater (103) heats the pattern forming sheet (130).
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公开(公告)号：US09801280B2
公开(公告)日：2017-10-24
申请号：US14940624
申请日：2015-11-13
Applicant: ALSON TECHNOLOGY LIMITED
Inventor： Han-Hung Cheng , Chi-Fen Kuo
CPC classification number: H05K1/18 , G06F1/185 , G09F13/04 , G09F13/22 , G09F23/00 , G09F2013/222 , H05K1/0269 , H05K1/0274 , H05K2201/0108 , H05K2201/09936 , H05K2201/10106 , H05K2201/10121
Abstract: A circuit module includes a main body and a PCI-E insert row, the main body has a substrate portion and a light-emitting portion, the substrate portion includes a board and a first coating layer, the board has a light-transmittable portion and a first face, the first coating layer is coated on the first face, the first coating layer has an emergent light-transmittable portion corresponding to the light-transmittable portion. The PCI-E insert row is disposed on the substrate portion. The electronic device includes the circuit module mentioned above and further includes a shell portion. The shell portion is covered on two opposite lateral faces of the circuit module and at least shields the light-emitting portion, and the shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion.
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公开(公告)号：US20170288495A1
公开(公告)日：2017-10-05
申请号：US15509308
申请日：2014-12-22
Applicant: Mitsubishi Electric Corporation
Inventor： Takuma AOSHIMA
CPC classification number: H02M7/003 , F24F11/74 , F24F13/1426 , F24F2013/1433 , H02K5/225 , H02M7/106 , H05K1/02 , H05K1/0262 , H05K1/0269 , H05K1/029 , H05K1/181 , H05K2201/09936 , H05K2201/1009 , H05K2201/10189 , H05K2201/10363 , H05K2201/10522 , H05K2203/173
Abstract: A printed wiring board includes a primary circuit that receives power supply of a high voltage from a high power source; a pattern for a low voltage circuit that is used when a low voltage component used for a low voltage lower than the high voltage and a power supply terminal block that receives power supply of the low voltage from a low power source are provided; a pattern for a common circuit that is used when a high voltage component used for the high voltage and the low voltage that insulates the pattern for the primary circuit from the pattern for the common circuit; a first insulator which insulates the pattern of the primary circuit from the pattern of the common circuit; and a second insulator that insulates the pattern for the common circuit from the pattern for the low voltage circuit.
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Patent Agency Ranking
公开(公告)号：US20170196095A1
公开(公告)日：2017-07-06
申请号：US15058138
申请日：2016-03-01
Applicant: Unimicron Technology Corp.
Inventor： Hung-Lin Chang , Chen-Wei Tseng
CPC classification number: H05K3/4679 , H05K1/0266 , H05K2201/083 , H05K2201/09936
Abstract: A circuit board includes a core layer, at least one metal contraposition component and at least one build-up circuit structure. The metal contraposition component is disposed on the core layer. The build-up circuit structure is disposed on the core layer and covers the metal contraposition component by using a position of the metal contraposition component as a fiducial mark.
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公开(公告)号：US20170150611A1
公开(公告)日：2017-05-25
申请号：US15075454
申请日：2016-03-21
Inventor： XUE-QIN ZHANG
CPC classification number: H05K3/1225 , H05K1/0266 , H05K1/0268 , H05K1/092 , H05K3/0047 , H05K3/1216 , H05K3/4611 , H05K2201/09936
Abstract: A method for silkscreen printing during manufacture of a printed circuit board includes forming a circuit pattern on a trepanned circuit board using a first silkscreen plate that has the circuit pattern, the scraper, and conductive inks, forming a solder mask layer on the circuit board using a second silkscreen plate, the scraper, and a solder material, forming words and marks on the circuit board using a third silkscreen plate, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth silkscreen plate, the scraper, and solder paste.
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公开(公告)号：US20170142832A1
公开(公告)日：2017-05-18
申请号：US14940624
申请日：2015-11-13
Applicant: AVEXIR TECHNOLOGIES CORPORATION
Inventor： Han-Hung CHENG , Chi-Fen KUO
CPC classification number: H05K1/18 , G06F1/185 , G09F13/04 , G09F13/22 , G09F23/00 , G09F2013/222 , H05K1/0269 , H05K1/0274 , H05K2201/0108 , H05K2201/09936 , H05K2201/10106 , H05K2201/10121
Abstract: A circuit module includes a main body and a PCI-E insert row, the main body has a substrate portion and a light-emitting portion, the substrate portion includes a board and a first coating layer, the board has a light-transmittable portion and a first face, the first coating layer is coated on the first face, the first coating layer has an emergent light-transmittable portion corresponding to the light-transmittable portion. The PCI-E insert row is disposed on the substrate portion. The electronic device includes the circuit module mentioned above and further includes a shell portion. The shell portion is covered on two opposite lateral faces of the circuit module and at least shields the light-emitting portion, and the shell portion further has a second light-transmittable portion corresponding to the emergent light-transmittable portion.
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公开(公告)号：US20170040739A1
公开(公告)日：2017-02-09
申请号：US14817886
申请日：2015-08-04
Applicant: GOODRICH CORPORATION
Inventor： Michael Abbott , Andrew Slanker , Brian Syverson , Eric Joseph Reed , Scott R. Durkee , Alexander White
CPC classification number: H01R13/58 , H01R12/7076 , H01R43/205 , H05K1/0257 , H05K1/0271 , H05K1/115 , H05K1/116 , H05K2201/09063 , H05K2201/09936 , H05K2201/10287 , H05K2201/10356
Abstract: A circuit card is disclosed. The circuit card may have a strain relief aperture and a conductor contact. A conductor may extend through the strain relief aperture and connect in electrical continuity with the conductor contact. The circuit card may have a conformal coating, such as poly(p-xylylene) polymer applied. The conformal coating may be applied in layers, and the layers may have different thicknesses.
Abstract translation: 公开了电路卡。 电路卡可以具有应变消除孔和导体接触。 导体可以延伸穿过应变消除孔，并与导体触点电连接。 电路卡可以具有适形涂层，例如施加的聚（对二甲苯）聚合物。 保形涂层可以以层施加，并且这些层可以具有不同的厚度。
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公开(公告)号：US20150359085A1
公开(公告)日：2015-12-10
申请号：US14317254
申请日：2014-06-27
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Yi-Wen Chen , Yin-Chen Lin , Ming-Hsiao Ke , Yu-Chen Ma
IPC: H05K1/02
CPC classification number: H05K1/0269 , H05K1/0274 , H05K1/028 , H05K1/0298 , H05K2201/09781 , H05K2201/0989 , H05K2201/09936
Abstract: A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein above the perpendicular direction of the at least one bottom block of the metallic layer, a pre-marked area is defined on an exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, and the identifying code is formed within the pre-marked area of the solder mask layer.
Abstract translation: 柔性基板包括基底层，金属层，焊接掩模层和识别代码，金属层设置在基底层的第一表面，金属层包括多个迹线和至少一个使用的底部块 用于限定标记位置，其中所述迹线和所述至少一个底部块被所述焊接掩模层覆盖，其中在所述金属层的所述至少一个底部块的垂直方向上方，预先标记的区域被限定在曝光 焊料掩模层的表面和至少一个底部块的轮廓边缘，并且识别代码形成在焊料掩模层的预先标记的区域内。
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