公开(公告)号：US09928762B2

公开(公告)日：2018-03-27

申请号：US13770527

申请日：2013-02-19

Applicant: Apple Inc.

Inventor： Jeremy C. Franklin ,  Kevin D. Gibbs ,  Amy Qian ,  John Raff ,  Carl R. Peterson

IPC: G09F13/04 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18

CPC classification number: G09F13/0413 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10128

Abstract: Electronic devices may include displays. A display may include backlight structures that generate light and display layers that generate images using the generated light. An electronic device may include an opaque flexible printed circuit that is wrapped around one or more edges of the backlight structures. The opaque flexible printed circuit may prevent light from the backlight structures from reaching other electronic components or escaping from the device. The opaque flexible printed circuit may include signal lines that communicate signals between a printed circuit board and the display. The opaque flexible printed circuit may be a layer of the printed circuit board that extends from an edge of the printed circuit board. The printed circuit board may include an additional flexible extended printed circuit layer that wraps around a surface of the printed circuit board and forms a portion of a conductive shield over that surface.

公开(公告)号：US09922921B2

公开(公告)日：2018-03-20

申请号：US14637385

申请日：2015-03-03

Applicant: Jae-min Jung ,  Na-rae Shin

Inventor： Jae-min Jung ,  Na-rae Shin

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/498 ,  H05K1/00 ,  H01L23/48 ,  H01L23/49 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/49811 ,  H01L23/4985 ,  H01L23/564 ,  H01L2224/16225 ,  H05K1/189 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A semiconductor package includes: a semiconductor chip including an effective chip region at a center of the semiconductor chip and in which pads connected to chip wirings are formed, and a dummy chip region at a side of the effective chip region and in which pads not connected to the chip wirings are formed; a base film including a chip mounting section on which the semiconductor chip is mounted; and a plurality of wiring patterns disposed on the base film and electrically connected to the chip wirings of the semiconductor chip, wherein first wiring patterns, which are a part of the plurality of wiring patterns, extend on a first region of the chip mounting section corresponding to the dummy chip region.

公开(公告)号：US09920421B2

公开(公告)日：2018-03-20

申请号：US14101032

申请日：2013-12-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Hans-Georg Lotz ,  Neil Morrison ,  Thomas Deppisch

IPC: C23C14/08 ,  C23C14/14 ,  C23C14/34 ,  C23C14/56 ,  C23C14/58 ,  H01J37/34 ,  G06F3/044 ,  G06F3/041 ,  G03F9/00 ,  C23C14/35 ,  H05K1/02 ,  H05K3/00 ,  H05K1/03

CPC classification number: C23C14/562 ,  C23C14/086 ,  C23C14/14 ,  C23C14/3464 ,  C23C14/35 ,  C23C14/5873 ,  G03F9/7042 ,  G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H01J37/3405 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/00 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0326 ,  H05K2201/10128

Abstract: A process for manufacturing a transparent body for a touch screen panel is described. The process includes: depositing a first transparent layer stack over a flexible transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second dielectric film with a second refractive index different from the first refractive index; providing a transparent conductive film over the first transparent layer stack; depositing a layer of a conductive material over the transparent conductive film; providing a polymer layer over the layer of a conductive material; imprinting a pattern, e.g. a 3D pattern, on the polymer layer; etching the layer of the conductive material based upon the pattern to form conductive paths for the touch screen panel; and etching the transparent conductive film based upon the pattern to form a structured transparent conductive pattern for touch detection.

公开(公告)号：US09917113B2

公开(公告)日：2018-03-13

申请号：US15429411

申请日：2017-02-10

Applicant: Samsung Display Co., Ltd.

Inventor： Dae Geun Lee

IPC: H01L23/48 ,  H01L27/12 ,  H01L23/00 ,  G02F1/1345 ,  H01L27/32

CPC classification number: H01L27/124 ,  G02F1/13458 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H01L27/3276 ,  H01L2224/05552 ,  H01L2224/06152 ,  H01L2224/81132 ,  H01L2924/3511 ,  H05K1/111 ,  H05K1/189 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10128 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49005

Abstract: An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

公开(公告)号：US20180063946A1

公开(公告)日：2018-03-01

申请号：US15805053

申请日：2017-11-06

Applicant: Samsung Display Co., Ltd.

Inventor： Hee-Kwon Lee

IPC: H05K1/02 ,  H05K9/00 ,  H01L51/52 ,  H05K1/18

CPC classification number: H05K1/0259 ,  H01L51/5237 ,  H05K1/189 ,  H05K9/0096 ,  H05K2201/10128

Abstract: A display device having a display panel, a conductive shielding film disposed on a surface of the display panel, and a flexible circuit unit connected to another surface of the display panel and configured to provide a driving signal to the display panel, wherein the shielding film has at least one protrusion disposed adjacent the flexible circuit unit.

公开(公告)号：US09897248B2

公开(公告)日：2018-02-20

申请号：US15242590

申请日：2016-08-21

Applicant: Qisda (Suzhou) Co., Ltd. ,  Qisda Corporation

Inventor： Chun-Ting Chen ,  Yen-Chen Chiang

IPC: G06F1/16 ,  F16M11/10 ,  H05K1/14 ,  F16M11/28

CPC classification number: F16M11/10 ,  F16M11/28 ,  G06F1/166 ,  H05K1/148 ,  H05K2201/10128

Abstract: A display device includes a display, a base, a flexible circuitry connecting the display to the base, and a support frame assembly disposed between the display and the base. The support frame assembly includes an inner rail connecting to the base, an outer rail connecting to the display, and a first stop member. The outer rail is movably connected to the inner rail so that the outer rail is disposed at a first position or a second position relative to the base. An accommodation space is formed between the outer rail and the inner rail for accommodating the flexible circuitry. The first stop member is disposed between the inner rail and outer rail and extends from the inner rail and away from the accommodation space for restricting the outer rail to move along the inner rail between the first position and the second position.

公开(公告)号：US20180049324A1

公开(公告)日：2018-02-15

申请号：US15446255

申请日：2017-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-eun Koo ,  Ye-chung Chung ,  Yong-hoon Kim

IPC: H05K1/18 ,  H01L23/00 ,  G09G5/18 ,  H01L25/065 ,  H01L21/48 ,  H01L23/538 ,  H01L25/18

CPC classification number: H05K1/185 ,  G09G3/20 ,  G09G5/18 ,  G09G2300/0426 ,  G09G2310/08 ,  H01L21/486 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2924/141 ,  H01L2924/1426 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/181 ,  H05K1/186 ,  H05K1/189 ,  H05K2201/0154 ,  H05K2201/10128 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10681

Abstract: Provided are a semiconductor package and a display device including the same. In some aspects, the semiconductor package may include a film substrate including a base film including cavities and a wiring layer on the base film, a semiconductor chip connected to the wiring layer and mounted on a surface of the base film, and passive devices accommodated in the cavities of the base film and electrically connected to the semiconductor chip through the wiring layer. According to other aspects a base film having at least one recess may be provided. A wiring layer may be on the base film, and a semiconductor chip may be connected to the wiring layer and mounted on a surface of the base film. At least one passive device may be in the at least one recess of the base film and electrically connected to the semiconductor chip via the wiring layer.

公开(公告)号：US20180047478A1

公开(公告)日：2018-02-15

申请号：US15792452

申请日：2017-10-24

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Yui ABE ,  Yoshihiro TAGUCHI ,  Mitsuo BITO ,  Yoshiyuki ASABE ,  Yasuyuki KITAMURA ,  Tomoyuki YAMAI ,  Koji OGUMA ,  Tomofumi OBA

IPC: H01B5/14 ,  B82Y30/00 ,  H05K1/09 ,  C23C14/34 ,  H01L51/00 ,  H01L31/18 ,  H01B1/02 ,  H05K3/38 ,  H01L31/0224 ,  H01L51/52 ,  B82Y40/00 ,  H01L51/10 ,  H01L51/44

CPC classification number: H01B5/14 ,  B82Y30/00 ,  B82Y40/00 ,  C23C14/34 ,  H01B1/02 ,  H01L31/0224 ,  H01L31/022466 ,  H01L31/1884 ,  H01L51/0021 ,  H01L51/102 ,  H01L51/442 ,  H01L51/5206 ,  H05K1/09 ,  H05K3/388 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/10128 ,  Y02E10/50 ,  Y10T428/31663 ,  Y10T428/31678

Abstract: A conductor includes (i) a substrate, (ii) a transparent conductive film formed on the substrate and including a silver nanowire, (iii) a metal film formed over the transparent conductive film such that at least a portion thereof overlaps the transparent conductive film, and (iv) a buffer film provided between the transparent conductive film and the metal film, the buffer film having adhesion to each of the transparent conductive film and the metal film, and not impeding conductivity between the transparent conductive film and the metal film. Preferably, the buffer film is formed of an organic material having respective functional groups capable of bonding to the transparent conductive film and the metal film.

公开(公告)号：US09888582B2

公开(公告)日：2018-02-06

申请号：US14842338

申请日：2015-09-01

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Kang Moon Jo ,  Se Hyoung Cho ,  Kyung-Hoon Kim ,  Dong Woo Kim ,  Il Gon Kim

IPC: H05K1/00 ,  H05K3/36 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K3/361 ,  H05K1/118 ,  H05K3/323 ,  H05K2201/09063 ,  H05K2201/09172 ,  H05K2201/09418 ,  H05K2201/10128

Abstract: A display device including a flexible substrate that includes a display part to display an image; a driving integrated chip (IC) that supplies a driving voltage to the display part; a flexible printed circuit (FPC) attached to an outer side portion of the substrate; and a printed circuit board (PCB) attached to the FPC, the PCB transferring the driving voltage to the driving IC through the FPC, wherein the FPC includes attachment parts at ends thereof, the attachment parts of the FPC being attached to pad parts at the outer side portion of the substrate and to pad parts of the PCB, and the attachment parts include slits therein.

公开(公告)号：US20180035532A1

公开(公告)日：2018-02-01

申请号：US14914156

申请日：2016-02-01

Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.

Inventor： Gui CHEN

IPC: H05K1/02 ,  H05K5/00

CPC classification number: H05K1/028 ,  H05K1/0213 ,  H05K1/0215 ,  H05K1/147 ,  H05K3/361 ,  H05K5/0017 ,  H05K2201/0314 ,  H05K2201/10037 ,  H05K2201/10128

Abstract: An electronic terminal includes a display panel, a printed circuit board and a flexible printed circuit board. A portion of the flexible printed circuit board is located below the printed circuit board, a terminal of the flexible printed circuit board is connected with the display panel, and the other terminal is connected with a port of a driving circuit of the printed circuit board. At a location of a ground wire disposed inside an overlapping region of the flexible printed circuit board and the printed circuit board and disposed on the flexible printed circuit board, a first copper-exposed region is provided. At a location of a ground wire inside the overlapping region and on the printed circuit board, a second copper-exposed region is provided. A length of the ground wire in the printed circuit board is matched with a length of an antenna in the electronic terminal.