公开(公告)号：US20140126159A1

公开(公告)日：2014-05-08

申请号：US13792869

申请日：2013-03-11

Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. ,  UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.

Inventor： YEN-HUNG LIN ,  TSUNG-JUNG CHENG

IPC: H05K1/14 ,  H05K3/32

CPC classification number: H05K3/32 ,  H01L21/561 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/144 ,  H05K3/284 ,  H05K3/4015 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2224/81 ,  H01L2924/00

Abstract: A system in package (SiP) module includes a first circuit board assembly, a second circuit board assembly and a plurality of metallic pillars. The first circuit board assembly has a first top surface, a first bottom surface and a plurality of pads mounted on the first bottom surface. The second circuit board assembly has a second top surface, a second bottom surface and a plurality of second pads mounted on the second top surface. The metallic pillars are disposed between the first bottom surface and the second top surface. The metallic pillars electrically connect the first pad and the second pad.

Abstract translation: 封装系统（SiP）模块包括第一电路板组件，第二电路板组件和多个金属支柱。 第一电路板组件具有第一顶表面，第一底表面和安装在第一底表面上的多个焊盘。 第二电路板组件具有第二顶表面，第二底表面和安装在第二顶表面上的多个第二焊盘。 金属柱设置在第一底表面和第二顶表面之间。 金属柱电连接第一焊盘和第二焊盘。

公开(公告)号：US20140098538A1

公开(公告)日：2014-04-10

申请号：US14123426

申请日：2012-02-15

Applicant: Gerardus Geertruud De Vaal

Inventor： Gerardus Geertruud De Vaal

IPC: H01L33/64 ,  H01L25/075 ,  F21K99/00 ,  H01L25/16

CPC classification number: H01L33/64 ,  F21K9/00 ,  F21V29/508 ,  F21V29/67 ,  F21V29/83 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L25/167 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/09481 ,  H05K2201/10106 ,  H05K2201/10242 ,  H01L2924/00

Abstract: A semiconductor device such as an LED illumination device includes a substrate sheet (2) and a plurality of LEDs (4) that are supported on the front of the substrate sheet. A plurality of apertures (9) extend through the substrate sheet (2) and thermally conductive elements in the form of conduits or tubes (1) extend through the apertures, while thermally conductive elements in the form of pads (10) extend between the LEDs and the tubes (1). Each tube (1) defines an open passage that extends through the apertures (9) between the front and the back of the substrate sheet (2), without obstruction. Heat generated in the LEDs is conducted to the tubes (1), from where it is dissipated through convection.

Abstract translation: 诸如LED照明装置的半导体装置包括基板（2）和被支撑在基板的前面的多个LED（4）。 多个孔（9）延伸穿过基片（2），导管或管（1）形式的导热元件延伸穿过孔，而垫（10）形式的导热元件在LED 和管（1）。 每个管（1）限定开放通道，其延伸穿过基片（2）的前和后之间的孔（9），而不会阻塞。 在LED中产生的热量被传导到管（1），从其通过对流消散。

公开(公告)号：US20130248584A1

公开(公告)日：2013-09-26

申请号：US13989818

申请日：2012-08-30

Applicant: Xiaofeng Bi

Inventor： Xiaofeng Bi

IPC: B23K31/02

CPC classification number: B23K31/02 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10416

Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.

Abstract translation: 制作大功率LED散热结构的工艺包括：（1）提供PCB板，导热板和散热板; （2）提供穿过PCB板的第一定位孔和第一固定孔，并将铜板焊接到PCB板的一侧; 同时将电极焊接脚焊接到PCB板的另一侧; （3）提供穿过导热板的第二定位孔和第二固定孔; （4）使用固定柱穿过用于将PCB板和导热板连接在一起的两个固定孔; （5）使用导热柱刺穿两个定位孔; （6）将导热板和PCB板的一体放置在压制设备上以调节导热柱的高度。

公开(公告)号：US08541299B2

公开(公告)日：2013-09-24

申请号：US12787527

申请日：2010-05-26

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 电互连形成方法。 电互连包括包括第一导电焊盘的第一衬底，包括第二导电焊盘的第二衬底以及将第一导电焊盘电连接和机械地连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US20130175085A1

公开(公告)日：2013-07-11

申请号：US13650748

申请日：2012-10-12

Applicant: Keita Terajima

Inventor： Keita Terajima

IPC: H02G3/18

CPC classification number: H01R43/0256 ,  H01R4/027 ,  H01R12/58 ,  H01R13/533 ,  H05K3/4046 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2201/10242

Abstract: A connector includes an insulation board, a conductor pattern, a rod-shaped member and a solder. The insulation board is provided with a through hole penetrating from a top face to a bottom face. The conductor pattern covers an internal wall of the through hole. The rod-shaped member includes a first end protruding beyond the bottom face and a second end inside the through hole. The solder closes a gap between the conductor pattern covering the internal wall of the through hole and the rod-shaped member and covers the second end of the rod-shaped member.

Abstract translation: 连接器包括绝缘板，导体图案，棒状构件和焊料。 绝缘板设置有从顶面贯穿到底面的通孔。 导体图案覆盖通孔的内壁。 杆状构件包括突出超过底面的第一端和通孔内的第二端。 焊料封闭覆盖通孔的内壁的导体图案与杆状构件之间的间隙，并且覆盖杆状构件的第二端。

公开(公告)号：US08458900B2

公开(公告)日：2013-06-11

申请号：US12755555

申请日：2010-04-07

Applicant: Kotaro Kodani ,  Junichi Nakamura

Inventor： Kotaro Kodani ,  Junichi Nakamura

IPC: H05K3/30 ,  H01K3/10

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2221/68359 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15174 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K1/181 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/10242 ,  H05K2201/10674 ,  H05K2203/0376 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of making a wiring substrate having at least one interconnection layer includes forming a first metal layer on a surface of a support member having at least one columnar through hole that exposes the surface of the support member, forming a columnar metal layer that fills the columnar through hole, forming an insulating layer on the columnar metal layer and on the first metal layer, forming an interconnection layer on a first surface of the insulating layer electrically connected to the columnar metal layer through the insulating layer, and forming, by removing at least an entirety of the support member and an entirety of the first metal layer, a protruding part including at least part of the columnar metal layer protruding from a second surface of the insulating layer opposite the first surface, and serving as at least part of a connection terminal of the wiring substrate.

Abstract translation: 制造具有至少一个互连层的布线基板的方法包括在具有暴露支撑构件的表面的至少一个柱状通孔的支撑构件的表面上形成第一金属层，形成填充该支撑构件的柱状金属层 在柱状金属层和第一金属层上形成绝缘层，在通过绝缘层与柱状金属层电连接的绝缘层的第一表面上形成互连层，并通过在 所述支撑构件的整体和所述第一金属层的整体，突出部分，其包括从所述绝缘层的与所述第一表面相对的第二表面突出的所述柱状金属层的至少一部分，并且用作所述第一金属层的至少一部分 接线基板的连接端子。

公开(公告)号：US20120192411A1

公开(公告)日：2012-08-02

申请号：US13166525

申请日：2011-06-22

Applicant: Yau-Hung Chiou ,  Shu-Hui Fan ,  Ming-Tze Kao

Inventor： Yau-Hung Chiou ,  Shu-Hui Fan ,  Ming-Tze Kao

IPC: H01R43/00

CPC classification number: H05K3/4046 ,  H05K1/0306 ,  H05K3/0047 ,  H05K2201/10242 ,  Y10T29/49117

Abstract: The present invention discloses a method for electrical connection between two surfaces of a ceramic substrate, and the method includes the steps of forming a through hole between the two surfaces of the ceramic substrate corresponding to electrical connection points of a circuit on the ceramic substrate, and then mounting a conductive assembly inside the through hole to form a conduction path between the two surfaces of the ceramic substrate. By this means, time cost of manufacturing of ceramic substrate circuit board could be largely decreased, and the manufacturing procedures could be much simplified as well.

Abstract translation: 本发明公开了一种在陶瓷基板的两面之间进行电连接的方法，该方法包括以下步骤：在与陶瓷基板上的电路的电连接点相对应的陶瓷基板的两个表面之间形成通孔，以及 然后将导电组件安装在通孔内部以形成陶瓷基板的两个表面之间的传导路径。 通过这种方式，陶瓷基板电路板的制造时间成本可以大大降低，并且制造程序也可以被大大简化。

公开(公告)号：US20110248389A1

公开(公告)日：2011-10-13

申请号：US13050288

申请日：2011-03-17

Applicant: Chiko YORITA ,  Tsutomu HARA ,  Hiroshi OKABE ,  Tomonori TANOUE ,  Yuji SHIRAI

Inventor： Chiko YORITA ,  Tsutomu HARA ,  Hiroshi OKABE ,  Tomonori TANOUE ,  Yuji SHIRAI

IPC: H01L23/552 ,  H01L21/82 ,  H01L23/48

CPC classification number: H01L23/66 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/552 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/09972 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/10416 ,  H05K2203/1316 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An upper module board on which an integrated chip component with a low upper temperature limit is mounted and a lower module board on which a heat-generating semiconductor chip, a single chip component and an integrated chip component are mounted are electrically and mechanically connected via a plurality of conductive connecting members, and these are sealed together with mold resin. In such a circumstance, a shield layer made up of a stacked film of a Cu plating film and a Ni plating film is formed on side surfaces of the upper and lower module boards and surfaces (upper and side surfaces) of the mold resin, thereby realizing the electromagnetic wave shield structure.

Abstract translation: 安装了具有低温度限制的集成芯片部件的上模块板和安装有发热半导体芯片，单芯片部件和集成芯片部件的下模块板通过以下方式电连接和机械连接： 多个导电连接构件，并且这些与模制树脂密封在一起。 在这种情况下，在模具树脂的上模块板和下模块板的表面（上表面和侧表面）的侧表面上形成由Cu镀膜和Ni镀膜的叠层膜构成的屏蔽层，由此 实现电磁波屏蔽结构。

公开(公告)号：US20100230143A1

公开(公告)日：2010-09-16

申请号：US12787485

申请日：2010-05-26

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H05K1/03

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电结构，包括包括第一导电焊盘的第一基板，包括第二导电焊盘的第二基板和将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US07786001B2

公开(公告)日：2010-08-31

申请号：US11733840

申请日：2007-04-11

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H01L21/44

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电气结构和成型方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。