公开(公告)号：US07794234B2

公开(公告)日：2010-09-14

申请号：US12315305

申请日：2008-12-02

Applicant: Naoya Kitajima ,  Seiya Takahashi ,  Katsumi Arai

Inventor： Naoya Kitajima ,  Seiya Takahashi ,  Katsumi Arai

IPC: H01R12/00

CPC classification number: H05K1/118 ,  H01R12/716 ,  H01R13/2414 ,  H05K3/0058 ,  H05K3/027 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09172 ,  H05K2201/09663 ,  H05K2203/0369

Abstract: The present invention provides a connector configured to electrically connect two connection objects. The connector comprises an elastic member having a surface and a conductive film placed on the surface of the elastic member. The conductive film comprises two contact portions to be brought into contact with the connection objects, respectively, and a connect portion connecting the contact portions. Each of the contact portions comprises projections and a drainage arranged, at least in part, between the projections.

Abstract translation: 本发明提供一种被配置为电连接两个连接对象的连接器。 连接器包括具有放置在弹性构件的表面上的表面和导电膜的弹性构件。 导电膜包括分别与连接对象接触的两个接触部分和连接接触部分的连接部分。 每个接触部分包括至少部分地在突起之间布置的突起和排水。

公开(公告)号：US07768131B1

公开(公告)日：2010-08-03

申请号：US12493171

申请日：2009-06-27

Applicant: Jun-Chung Hsu ,  Chen-Lin Li

Inventor： Jun-Chung Hsu ,  Chen-Lin Li

IPC: H01L23/48

CPC classification number: H05K3/341 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H05K3/3436 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/099 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A package structure preventing solder overflow on substrate solder pads includes a plurality of die pins, a plurality of solders and a plurality of substrate solder pads. The die pins are located under a die. The substrate solder pads are formed on an upper surface of a substrate by copper plating or etching. Each of the substrate solder pads has at least one solder pad connection point. The solders connect the die pins with the corresponding solder pad connection points, respectively. Each of the solder pad connection points has a pair of solder pad ridges or a pair of solder pad grooves. The solder pad ridges and the solder pad grooves filled with the solder or a resin can prevent the solder overflow problem.

Abstract translation: 防止衬底焊盘上的焊料溢出的封装结构包括多个管芯引脚，多个焊料和多个衬底焊盘。 模具销位于模具下方。 通过镀铜或蚀刻在衬底的上表面上形成衬底焊盘。 每个衬底焊盘具有至少一个焊盘连接点。 焊料将管芯引脚分别与相应的焊盘连接点相连。 每个焊盘连接点具有一对焊盘凸脊或一对焊盘凹槽。 焊料焊盘脊和填充有焊料或树脂的焊盘凹槽可以防止焊料溢出问题。

公开(公告)号：US20100139968A1

公开(公告)日：2010-06-10

申请号：US12619129

申请日：2009-11-16

Applicant: Yoshinori TAKENAKA ,  Takeshi Nakamura

Inventor： Yoshinori TAKENAKA ,  Takeshi Nakamura

IPC: H05K1/11 ,  H05K1/00 ,  H01B13/00

CPC classification number: H05K3/465 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2221/68345 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K2201/0373 ,  H05K2201/0949 ,  H05K2201/09736 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative material and the first conductive circuit, forming on a surface of the second resin insulative material a first concave portion to be filled with a conductive material for formation of a second conductive circuit, forming on the surface of the second resin insulative material a pattern having a second concave portion and post portions to be filled with the conductive material for formation of a plane conductor, and filling the conductive material in the first concave portion and the second concave portion such that the second conductive circuit and the plane conductor are formed.

Abstract translation: 一种多层印刷电路板的制造方法，其特征在于，在第一树脂绝缘材料上或第一树脂绝缘材料上制备具有第一导电电路的第一树脂绝缘材料，在第一树脂绝缘材料和第一导电电路上形成第二树脂绝缘材料，形成第 所述第二树脂绝缘材料的表面具有要填充用于形成第二导电电路的导电材料的第一凹部，在所述第二树脂绝缘材料的表面上形成具有第二凹部的图案和待填充的柱部分 用于形成平面导体的导电材料，并且在第一凹部和第二凹部中填充导电材料，使得形成第二导电电路和平面导体。

公开(公告)号：US20100123164A1

公开(公告)日：2010-05-20

申请号：US12623135

申请日：2009-11-20

Applicant: Yoshinobu SUEHIRO ,  Koji Tasumi

Inventor： Yoshinobu SUEHIRO ,  Koji Tasumi

IPC: H01L33/00

CPC classification number: H05K1/021 ,  F21K9/00 ,  F21K9/232 ,  F21K9/90 ,  F21V5/043 ,  F21V7/005 ,  F21V29/505 ,  F21V29/70 ,  F21V29/75 ,  F21V29/763 ,  F21V29/767 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0085 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/01019 ,  H01L2924/09701 ,  H05K3/341 ,  H05K2201/0347 ,  H05K2201/0373 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014

Abstract: A light emitting device includes a light-emitting portion including a metal part including a metal able to be bonded to a solder material, and a heat dissipation member that includes aluminum, aluminum alloy, magnesium or magnesium alloy and a bonding portion processed to be bonded to the solder material. The metal part of the light-emitting portion is bonded via the solder material to the bonding portion of the heat dissipation member. The solder material includes a material unable to be directly bonded to the heat dissipation member, the metal part of the light-emitting portion is formed by metalizing an insulation of ceramic or semiconductor, and the bonding portion includes a thermal expansion coefficient between that of the heat dissipation member and that of the insulation.

Abstract translation: 发光装置包括：发光部，其包括具有能够与焊料接合的金属的金属部，以及包含铝，铝合金，镁或镁合金的散热构件和加工成粘合的接合部 焊接材料。 发光部的金属部通过焊料粘合到散热部件的接合部。 焊料材料包括不能直接接合到散热构件的材料，发光部分的金属部分通过金属化陶瓷或半导体的绝缘体而形成，并且接合部分包括热膨胀系数 散热构件和隔热构件。

公开(公告)号：US07701069B2

公开(公告)日：2010-04-20

申请号：US10610168

申请日：2003-06-30

Applicant: Kum Foo Leong ,  Siew Fong Tai ,  Chee Key Chung

Inventor： Kum Foo Leong ,  Siew Fong Tai ,  Chee Key Chung

IPC: H01L23/48

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/2081 ,  Y02P70/611 ,  H01L2924/00

Abstract: A ball grid array device includes a substrate, further including a first major surface and a second major surface. An array of pads is positioned on one of the first major surface or the second major surface. At least some of the pads include a barrier layer having pores or openings therein. When solder is placed on the pad, the barrier layer forms an intermetallic compound at a rate different from the rate of the intermetallic compound formed between the pad and the solder. The result is a solder ball on a pad that has a first intermetallic compound and a second intermetallic compound.

Abstract translation: 球栅阵列器件包括衬底，还包括第一主表面和第二主表面。 衬垫阵列位于第一主表面或第二主表面之一上。 至少一些焊盘包括其中具有孔或开口的阻挡层。 当焊料放置在焊盘上时，阻挡层以与焊盘和焊料之间形成的金属间化合物的速率不同的速率形成金属间化合物。 结果是焊盘上具有第一金属间化合物和第二金属间化合物的焊球。

公开(公告)号：US20100044745A1

公开(公告)日：2010-02-25

申请号：US12510526

申请日：2009-07-28

Applicant: Takaaki Sakai ,  Norifumi Imazeki ,  Soji Owada

Inventor： Takaaki Sakai ,  Norifumi Imazeki ,  Soji Owada

IPC: H01L33/00

CPC classification number: H05K3/325 ,  H01L2224/48091 ,  H01L2924/01327 ,  H01R4/5075 ,  H01R12/7088 ,  H01R13/04 ,  H05K1/056 ,  H05K1/11 ,  H05K2201/0311 ,  H05K2201/0373 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10962 ,  H05K2201/2045 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In an optical semiconductor device module constructed by an optical semiconductor device having a light emitting portion on its top surface, a mounting substrate adapted to mount the optical semiconductor device thereon, at least one wiring pattern layer formed on a front surface of the mounting substrate, and at least one power supplying portion in contact with the wiring pattern layer, at least one of the power supplying portion and the wiring pattern layer is uneven.

Abstract translation: 在由其顶表面上具有发光部分的光半导体器件构成的光学半导体器件模块中，适于将光学半导体器件安装在其上的安装衬底，形成在安装衬底的前表面上的至少一个布线图案层， 以及与所述布线图案层接触的至少一个供电部，所述供电部和所述布线图案层中的至少一个是不均匀的。

公开(公告)号：US20090316376A1

公开(公告)日：2009-12-24

申请号：US12143540

申请日：2008-06-20

Applicant: Arvind K. Sinha ,  Thomas S. Thompson

Inventor： Arvind K. Sinha ,  Thomas S. Thompson

IPC: H01R9/00

CPC classification number: H05K1/111 ,  H05K1/0206 ,  H05K3/3421 ,  H05K2201/0373 ,  H05K2201/0949 ,  H05K2201/0969 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49149

Abstract: The present disclosure is directed at an apparatus for changing printed circuit board pad structure to increase solder volume and strength. The invention provides increased end row pad and lead size and utilizes a plurality of lead-to-pad and pad-to-lead conforming geometric structures to form a joint providing additional solder surface adhesion area.

Abstract translation: 本公开涉及一种用于改变印刷电路板焊盘结构以增加焊料体积和强度的装置。 本发明提供增加的端排衬垫和引线尺寸，并且利用多个引线对焊盘和焊盘与引线相符的几何结构以形成提供附加焊接表面粘附区域的接头。

公开(公告)号：US20090291329A1

公开(公告)日：2009-11-26

申请号：US12096668

申请日：2006-12-14

Applicant: Masao Kondou ,  Yasuo Akai ,  Yoshihisa Ikeda ,  Tomoyuki Shose

Inventor： Masao Kondou ,  Yasuo Akai ,  Yoshihisa Ikeda ,  Tomoyuki Shose

IPC: H01M14/00

CPC classification number: H05K3/3426 ,  H01M2/0222 ,  H01M2/10 ,  H01M2/204 ,  H01M2/30 ,  H01M10/052 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/09681 ,  Y02P70/613

Abstract: A battery 10A with leads has a low-profile external casing acting 11 as one of a pair of electrode terminals and a closure plate 12 acting as the other of the electrode terminals. The closure plate 12 hermetically seals an opening of the external casing 11 via an insulating gasket. A pair of lead plates 13 and 14 are each welded to a different one of the electrode terminals 11 and 12. One of the lead plates 13 and 14 is secured to a circuit board X. The lead plate 14 that is secured to the circuit board has a net-like structure.

Abstract translation: 具有引线的电池10A具有作为一对电极端子和作为另一个电极端子的封闭板12之一的低外形外壳。 闭合板12通过绝缘垫片密封外壳11的开口。 一对引线板13和14分别焊接到不同的一个电极端子11和12中。一个引线板13和14被固定到电路板X上。引线板14固定到电路板 有网状结构。

公开(公告)号：US20090242261A1

公开(公告)日：2009-10-01

申请号：US12355201

申请日：2009-01-16

Applicant: Yoshinori Takenaka ,  Takeshi Nakamura ,  Takamitsu Hattori

Inventor： Yoshinori Takenaka ,  Takeshi Nakamura ,  Takamitsu Hattori

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/0271 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/045 ,  H05K3/107 ,  H05K3/205 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0352 ,  H05K2201/0373 ,  H05K2201/096 ,  H05K2203/0156 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49155

Abstract: A printed wiring board disperses stress throughout an inner conductor layer, ensuring the flatness of a substrate. Embedding wires into the outermost insulating layer and forming the wires in a tapered shape that widens downward reduces the amount of stress applied on the edge of the inner conductor layer. This also prevents cracks from forming within the insulating layer, while maintaining favorable yield rates. Via diameters may also be reduced to increase circuit density.

Abstract translation: 印刷线路板将应力分散在整个内部导体层中，确保基板的平坦度。 将导线嵌入最外层的绝缘层中并形成向下加宽的锥形形状的导线减少施加在内导体层边缘上的应力的数量。 这也可以防止在绝缘层内形成裂缝，同时保持有利的产率。 还可以减小通孔直径以增加电路密度。

公开(公告)号：US20090149015A1

公开(公告)日：2009-06-11

申请号：US12368983

申请日：2009-02-10

Applicant: Shyh-Ming Chang

Inventor： Shyh-Ming Chang

IPC: H01L21/768

CPC classification number: H05K3/4007 ,  H01L22/32 ,  H01L24/13 ,  H01L2224/034 ,  H01L2224/0361 ,  H01L2224/0391 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/11515 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13552 ,  H01L2224/13553 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/2919 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09909 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.

Abstract translation: 接触结构的制造方法包括首先提供其上已经形成有接触垫的基板。 之后，在接触垫上形成聚合物凸块。 接着，在聚合物凸块上形成导电层。 导电层覆盖聚合物凸块并延伸到聚合物凸块的外部。 延伸到聚合物凸块外部的导电层的部分用作测试垫。