公开(公告)号：US06617510B2

公开(公告)日：2003-09-09

申请号：US09955215

申请日：2001-09-18

Applicant: Chris M. Schreiber ,  Bao Le ,  Eric Dean Jensen

Inventor： Chris M. Schreiber ,  Bao Le ,  Eric Dean Jensen

IPC: H05K506

CPC classification number: H01L21/568 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/49861 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/10757 ,  H01L2924/00

Abstract: A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a flexible circuit. The stress relief bend may be free floating and extend from the flexible substrate or may be encapsulated by the flexible substrate. The electrical circuit and the flexible circuit each have a generally planar portion extending in the X and Y axis, with the stress relief bend projecting into the Z axis. This allows electrical traces to be spaced with a very narrow pitch because the stress relief bend does not consume any valuable real estate on the flexible circuit or the substrate to which the electrical trace is applied.

公开(公告)号：US20030034382A1

公开(公告)日：2003-02-20

申请号：US09933028

申请日：2001-08-20

Inventor： Chen-Chi Huang

IPC: B23K035/12 ,  B23K035/14

CPC classification number: H05K3/3478 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0244 ,  H05K3/3436 ,  H05K2201/0305 ,  H05K2201/0382 ,  H05K2201/10424 ,  H05K2203/0113

Abstract: A process for producing a solder sheet with a bump grid array includes the step of molding a sheet of solder material in a mold having two mold halves. Each of the mold halves is formed with an array of first recesses. At least one of the mold halves is further formed with a plurality of second recesses interconnecting adjacent pairs of the first recesses. Each of the first recesses has a depth deeper than that of the second recesses. The first recesses of one of the mold halves are registered with the first recesses of the other of the mold halves such that the first and second recesses of the mold halves cooperatively form a mold cavity defining the shape of the molded solder sheet when the mold halves are brought toward each other to close the mold.

Abstract translation: 用于制造具有凸块格栅阵列的焊料片的方法包括在具有两个半模的模具中成型一块焊料材料的步骤。 每个半模形成有第一凹部的阵列。 至少一个半模进一步形成有互连第一凹槽相邻对的多个第二凹部。 每个第一凹部具有比第二凹部深的深度。 其中一个半模的第一凹槽与另一个半模的第一凹部对准，使得半模的第一和第二凹槽协同地形成限定模制焊料片形状的模腔，当半模 相互靠近以关闭模具。

公开(公告)号：US20020179325A1

公开(公告)日：2002-12-05

申请号：US10200941

申请日：2002-07-23

Applicant: Tessera, Inc.

Inventor： Thomas H. DiStefano ,  Joseph Fjelstad

IPC: H05K001/03 ,  H01R012/04

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

Abstract translation: 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件从中心导体延伸，并且具有适于从中心导体径向向内收缩的外围部分，以响应由在所接合的电路板上限定中心孔的接触垫施加的力。 因此，当电路板被内插件压缩时，触头径向向内收缩并且擦拭穿过焊盘。 擦拭动作有助于通过摩擦焊接将接触件接合到焊盘，或者通过接触件本身承载的导电接合材料。

公开(公告)号：US06420664B1

公开(公告)日：2002-07-16

申请号：US09444642

申请日：1999-11-22

Applicant: Shigetsugu Muramatsu ,  Yoshihiko Ogawa ,  Norio Kojima

Inventor： Shigetsugu Muramatsu ,  Yoshihiko Ogawa ,  Norio Kojima

IPC: H01R1204

CPC classification number: H05K3/4007 ,  H01L23/3114 ,  H01L23/49575 ,  H01L23/49816 ,  H01L23/49861 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/28 ,  H05K3/4084 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/10977 ,  H05K2203/1572 ,  H01L2224/05099

Abstract: A semiconductor device characterized in that: a circuit substrate of a single or multiple layer which is composed in such a manner that, bumps, which are electrically connected to connection electrodes provided on one face of a surface mount device, are arranged in the same plane arrangement as that of said connection electrodes and protruded onto one side of a sheet of metal foil, on which wiring patterns electrically connected to said bumps with each other are formed, and an insulating adhesive agent layer is made to adhere onto the one side of a sheet of metal foil having bumps, is made to adhere onto one face of the surface mount device by said insulating adhesive agent layer; and tips of the bumps respectively come into contact with the connection electrodes.

Abstract translation: 一种半导体器件，其特征在于：单层或多层的电路基板，其以与设置在表面安装器件的一个面上的连接电极电连接的凸块布置在同一平面内 布置成所述连接电极并且突出到金属箔片的一侧上，在其上形成与所述凸块电连接的布线图案，并且使绝缘粘合剂层粘附到 具有凸块的金属箔片通过所述绝缘粘合剂层粘附到所述表面安装装置的一个面上; 并且突起的尖端分别与连接电极接触。

公开(公告)号：US20020058404A1

公开(公告)日：2002-05-16

申请号：US09515555

申请日：2000-02-29

Inventor： Curtis M Medlen ,  Mark E Tuttle

IPC: H01L021/4763

CPC classification number: H01L24/12 ,  B23K20/02 ,  B23K20/16 ,  B23K2101/38 ,  B23K2101/42 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K3/321 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2201/10992 ,  H01L2924/00

Abstract: Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided and a layer of material is formed thereover. Openings are formed within the layer of material and conductive masses are formed within the openings. A second substrate having conductive interconnect surfaces is provided. The conductive interconnect surfaces are then contacted with the conductive masses and deformed thereby. In one aspect, the interconnect surfaces are deformed in part by portions of the layer of material proximate the conductive masses. In another aspect, the layer of material is removed and the interconnect surfaces are deformed by the conductive masses themselves.

Abstract translation: 描述形成导电互连和电互连基板的方法。 在一个实施方式中，提供具有外表面的第一基板，并且在其上形成一层材料。 开口形成在材料层内，导电块形成在开口内。 提供具有导电互连表面的第二基板。 然后导电互连表面与导电块接触并由此变形。 在一个方面，互连表面部分地靠近导电块的材料层的一部分变形。 另一方面，材料层被去除并且互连表面被导电块自身变形。

公开(公告)号：US20020029875A1

公开(公告)日：2002-03-14

申请号：US09778952

申请日：2001-02-08

Inventor： Yorihira Takano

IPC: H02G003/08 ,  F28F007/00 ,  H05K007/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0271 ,  H05K3/429 ,  H05K7/20436 ,  H05K2201/0209 ,  H05K2201/0382 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/10689

Abstract: The present invention provides an electronic apparatus provided with an electronic circuit substrate that is inexpensive, in which packaging density is high and which has good heat dissipating characteristics, and which comprises: an electronic circuit substrate comprising a resin wiring substrate formed with a wiring pattern and a grounding pattern at an internal layer thereof, a plurality of through holes provided directly below a mounting portion of a heat generating component and connected with the grounding pattern, and a case for protectively housing the electronic circuit substrate provided with a heat dissipating protruding surface portion contacting an area where the through holes of the rear surface of the electronic circuit substrate are disposed, and being formed so as to ensure space between the case and the rear surface of the electronic circuit substrate to enable mounting of low heat generating electrical/electronic components.

Abstract translation: 本发明提供一种电子设备，其具有电子电路基板，该电子电路基板廉价，其中封装密度高并且散热特性良好，并且包括：电子电路基板，其包括形成有布线图案的树脂布线基板和 在其内层的接地图案，直接设置在发热部件的安装部分的下方并与接地图形连接的多个通孔，以及用于保护性地容纳设置有散热突出表面部分的电子电路基板的壳体 使电子电路基板的背面的贯通孔配置的区域与电子电路基板的后表面之间的空间形成，从而能够安装低发热电气电子部件 。

公开(公告)号：US20020008966A1

公开(公告)日：2002-01-24

申请号：US09752992

申请日：2001-01-02

Inventor： Joseph Fjelstad ,  John W. Smith ,  Thomas H. Distefano ,  James Zaccardi ,  A. Christian Walton

IPC: H05K003/30 ,  H01R029/00 ,  H05K001/00 ,  H01R012/00 ,  H01R009/00 ,  H05K003/00 ,  H01R009/24 ,  H01R013/02

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/7076 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

Abstract translation: 诸如柔性的，片状的悬臂触点之类的微电子触点具有以规则图案设置的凹凸。 每个粗糙部分的尖端具有远离接触表面的尖端特征。 当配合的微电子元件与触点接合时，擦拭动作导致粗糙的尖锐特征刮擦配合元件，以便在触发和配合元件激活时提供有效的电互连和任选的有效的冶金结合 接合材料。

公开(公告)号：US20010025718A1

公开(公告)日：2001-10-04

申请号：US09822521

申请日：2001-04-02

Inventor： Mitsuko Maruyama ,  Hidenori Yamanashi

IPC: H01B003/00

CPC classification number: H02G5/005 ,  H02G3/16 ,  H05K1/0298 ,  H05K3/202 ,  H05K3/4084 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/0382 ,  H05K2201/0391 ,  H05K2201/0397 ,  H05K2203/063

Abstract: The bus bar wiring plate body (20) for an electric coupling box according to the present invention is arranged in a manner that bus bar members (23, 24) are wired between pre-hardening epoxy resin plates (21, 22) and these pre-hardening epoxy resin plates are subjected to the heat pressing process to thereby integrate the pre-hardening epoxy resin plates (21, 22) and the bus bar members (23, 24) in a laminated state. When hardened epoxy resin plates (25, 26) are disposed at the outsides of the pre-hardening epoxy resin plates (21, 22) as shown by phantom lines, respectively, the strength of the bus bar wiring plate body (20) can be improved. Thus, since the bus bar members (23, 24) are sealed in an insulated state, leak current can be reduced surely. Further, the thickness of the bus bar wiring plate body (20) can be reduced to a large extent, so that the electric coupling box can be miniaturized and lightweighted.

Abstract translation: 根据本发明的用于电耦合盒的汇流条布线板主体（20）布置成使得汇流条构件（23,24）布线在预硬化环氧树脂板（21,22）和这些预硬化环氧树脂板 对硬化性环氧树脂板进行热压加工，从而将预硬化型环氧树脂板（21,22）和汇流条构件（23,24）层叠在一起。 当硬化环氧树脂板（25,26）分别设置在预硬化环氧树脂板（21,22）的外侧时，如虚线所示，汇流条布线板主体（20）的强度可以是 改进。 因此，由于汇流条构件（23,24）在绝缘状态下被密封，因此能够可靠地降低泄漏电流。 此外，汇流条布线板主体20的厚度可以很大程度地减小，从而电耦合盒可以小型化和轻量化。

公开(公告)号：US06271597B1

公开(公告)日：2001-08-07

申请号：US09429884

申请日：1999-10-29

Applicant: Curtis M. Medlen ,  Mark E. Tuttle

Inventor： Curtis M. Medlen ,  Mark E. Tuttle

IPC: H01L2348

CPC classification number: H01L24/12 ,  B23K20/02 ,  B23K20/16 ,  B23K2101/38 ,  B23K2101/42 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K3/321 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/10984 ,  H05K2201/10992 ,  H01L2924/00

Abstract: Methods of forming electrically conductive interconnections and electrically interconnected substrates are described. In one implementation, a first substrate having an outer surface is provided and a layer of material is formed thereover. Openings are formed within the layer of material and conductive masses are formed within the openings. A second substrate having conductive interconnect surfaces is provided. The conductive interconnect surfaces are then contacted with the conductive masses and deformed thereby. In one aspect, the interconnect surfaces are deformed in part by portions of the layer of material proximate the conductive masses. In another aspect, the layer of material is removed and the interconnect surfaces are deformed by the conductive masses themselves.

Abstract translation: 描述形成导电互连和电互连基板的方法。 在一个实施方式中，提供具有外表面的第一基板，并且在其上形成一层材料。 开口形成在材料层内，导电块形成在开口内。 提供具有导电互连表面的第二基板。 然后导电互连表面与导电块接触并由此变形。 在一个方面，互连表面部分地靠近导电块的材料层的一部分变形。 另一方面，材料层被去除并且互连表面被导电块自身变形。

公开(公告)号：US20010006859A1

公开(公告)日：2001-07-05

申请号：US09739376

申请日：2000-12-19

Inventor： Hisashi Soga ,  Kouichi Sinzawa

IPC: H01R029/00

CPC classification number: H05K3/202 ,  B60Q3/80 ,  B60R16/0207 ,  H02G3/0462 ,  H05K3/107 ,  H05K2201/0382 ,  H05K2201/09063 ,  H05K2201/2072 ,  H05K2203/175 ,  Y10S439/949

Abstract: An automotive lamp unit includes a bus bar unit forming a circuit with a plurality of bus bars connected with each other via a bridge portion, the bus bar unit including terminals, for connection to switches and a power source, and a supporting member for supporting a lamp, the circuit serving to switch on the lamp, and a resin base member provided with the bus bar unit mounted thereon at a predetermined position, and a small hole formed in the resin base member at a position thereof associated with the bridge portion. The plurality of bus bars are separated from each other at the bridge portion which is disposed in the small hole.

Abstract translation: 汽车灯单元包括形成具有经由桥接部分彼此连接的多个母线的电路的母线单元，所述母线单元包括用于连接到开关和电源的端子，以及支撑构件，用于支撑 灯，用于接通灯的电路以及设置有预定位置的母线单元的树脂基座构件，以及在与桥接部分相关联的位置处形成在树脂基座构件中的小孔。 多个母线在设置在小孔中的桥接部分彼此分离。