ELECTRONIC APPARATUS AND DAUGHTERBOARD
    112.
    发明申请
    ELECTRONIC APPARATUS AND DAUGHTERBOARD 有权
    电子设备和DAUGHTERBOARD

    公开(公告)号:US20100172097A1

    公开(公告)日:2010-07-08

    申请号:US12724195

    申请日:2010-03-15

    Abstract: An electronic apparatus includes: a housing; a motherboard that is accommodated in the housing; a first daughterboard that is accommodated in the housing; a second daughterboard that is accommodated in the housing; a host controller that is mounted on the motherboard; a bridge controller that is mounted on the first daughterboard and electrically connected to the host controller; a first chip that is mounted on the first daughterboard and electrically connected to the bridge controller; and a second chip that is mounted on the second daughterboard and electrically connected to the bridge controller.

    Abstract translation: 电子设备包括:壳体; 住在房屋中的主板; 容纳在壳体中的第一个子板; 容纳在壳体中的第二子板; 安装在主板上的主机控制器; 桥式控制器,其安装在第一子板上并电连接到主机控制器; 安装在第一子板上并电连接到桥接控制器的第一芯片; 以及安装在第二子板上并电连接到桥接控制器的第二芯片。

    MULTILAYER PRINTED WIRING BOARD AND COMPONENT MOUNTING METHOD THEREOF
    115.
    发明申请
    MULTILAYER PRINTED WIRING BOARD AND COMPONENT MOUNTING METHOD THEREOF 有权
    多层印刷接线板及其组件安装方法

    公开(公告)号:US20090229873A1

    公开(公告)日:2009-09-17

    申请号:US12468626

    申请日:2009-05-19

    Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps. This multilayer printed wiring board is easy to mount components, excellent in work efficiency or easy in reworkable process and a mounting method of such multilayer printed wiring board is also provided.

    Abstract translation: 多层印刷电路板的部件安装方法包括:多个焊料凸块,用于安装形成在其前后的电子元件,其中当焊料凸块由第一,第二,第三和第四 焊料,第一,第二,第三和第四焊料具有不同的熔点,第一,第二,第三和第四焊料的熔点被排列为第一焊料的熔点,第二焊料的熔点,熔化 第三焊料的点和第四焊料的熔点按照高熔点顺序依次使用,并且第一,第二,第三和第四焊料依次用于以高熔点的顺序焊接电子部件等。 此外,在这种情况下,优选地,具有大体积的焊料凸块应比其它焊料凸块更早地焊接。 该多层印刷电路板容易安装组件,工作效率优异或易于再加工的工艺,并且还提供了这种多层印刷线路板的安装方法。

    Active dual in line memory module connector with re-driven propagated signals
    116.
    发明授权
    Active dual in line memory module connector with re-driven propagated signals 有权
    主动双列直插存储器模块连接器,具有重新驱动的传播信号

    公开(公告)号:US07539024B1

    公开(公告)日:2009-05-26

    申请号:US11831062

    申请日:2007-07-31

    Inventor: Chris Karabatsos

    Abstract: An Active edge connector for memory modules has a base including two PCB sides and a spacer separating the sides, with driver chips mounted on each side of each side, printed wiring electrically connecting a first set of electrical signals from each of the driver chips to a mother board on which the connector is mounted, and printed wiring for electrically connecting a second set of electrical signals from each of the driver chips to a memory module inserted in the edge connector. When a group of connectors are mounted on a mother board, electrical signals arriving at the first connector are routed to its driver chips, producing re-driven signals to the next connector, and so on. A decoder circuit provides addressing signals determining the last such connector to which the signals are intended, and which prevents the signals from going to any connectors containing memories not addressed.

    Abstract translation: 用于存储器模块的主动边缘连接器具有包括两个PCB侧的基座和分隔两侧的间隔件,其中安装在每侧的每一侧上的驱动器芯片,印刷布线将来自每个驱动器芯片的第一组电信号电连接到 安装有连接器的主板,以及用于将来自每个驱动器芯片的第二组电信号电连接到插入到边缘连接器中的存储模块的印刷布线。 当一组连接器安装在母板上时,到达第一连接器的电信号被路由到其驱动器芯片,产生到下一个连接器的重新驱动信号等等。 解码器电路提供确定信号所期望的最后一个这样的连接器的寻址信号,并且防止信号进入包含未被寻址的存储器的任何连接器。

    Expansion structure of memory module slot
    120.
    发明授权
    Expansion structure of memory module slot 有权
    内存模块插槽的扩展结构

    公开(公告)号:US07298625B1

    公开(公告)日:2007-11-20

    申请号:US11653932

    申请日:2007-01-17

    Abstract: An expansion structure of memory module slots is provided. A circuit switch board and a substrate are disposed on a motherboard, wherein a plurality of first memory module slots is disposed on the motherboard, at least one second memory module slot is disposed on one side of the substrate, and a plurality of third memory module slots is disposed on the other side of the substrate. The third memory module slots are electrically connected to the second memory module slot, and two ends of the circuit switch board are plugged into one of the first memory module slots and the second memory module slot. When memory modules are plugged in the third memory module slots, the memory modules are electrically connected to the first memory module slots respectively through the circuit switch board and then transmit data and signals with the motherboard.

    Abstract translation: 提供了存储器模块插槽的扩展结构。 电路开关板和基板设置在母板上,其中多个第一存储器模块插槽设置在母板上,至少一个第二存储器模块插槽设置在衬底的一侧上,并且多个第三存储器模块 槽位于基板的另一侧。 第三存储器模块插槽电连接到第二存储器模块插槽,并且电路交换板的两端插入第一存储器模块插槽和第二存储器模块插槽中的一个。 当存储器模块插入第三存储器模块插槽时,存储器模块分别通过电路开关板电连接到第一存储器模块插槽,然后与主板传输数据和信号。

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