公开(公告)号：US20180065538A1

公开(公告)日：2018-03-08

申请号：US15808542

申请日：2017-11-09

Applicant: UUSI, LLC

Inventor： David W. Shank

IPC: B60Q1/00 ,  H05B33/08 ,  H05K1/14 ,  H05B37/02

CPC classification number: B60Q1/0088 ,  H01R12/62 ,  H05B33/0803 ,  H05B33/0845 ,  H05B33/0854 ,  H05B33/086 ,  H05B37/0227 ,  H05K1/02 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/16 ,  H05K2201/04 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10356

Abstract: A vehicle accessory control component includes a first circuit board substrate and a second circuit board substrate. The first circuit board substrate has a plurality of circuit elements and an overall perimeter shape including an outer edge profile and a plurality of first deviations along the outer edge profile. The second circuit board substrate has a plurality of circuit elements an outer edge profile and a plurality of second deviations along the outer edge profile, at least one of the second deviations being different than the first deviations. The first circuit board substrate and the second circuit board substrate are arranged in a plane and selectively movable relative to each other to form the overall perimeter shape of the substrate. The outer edge profile of the first and second circuit board substrates are received in a housing having a correspondingly shaped perimeter that generally conforms to the outer edge profile.

公开(公告)号：US20180041670A1

公开(公告)日：2018-02-08

申请号：US15783433

申请日：2017-10-13

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI

IPC: H04N5/225 ,  H05K1/02 ,  H05K1/18 ,  G02B23/24 ,  H01L27/146

CPC classification number: H04N5/2253 ,  G02B23/2484 ,  H01L27/14 ,  H01L27/14618 ,  H01L27/14636 ,  H04N2005/2255 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/3405 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10446

Abstract: An image pickup apparatus includes: an image pickup device including a plurality of convex electrodes disposed on an opposing surface; and a wiring board including a plurality of first edge electrodes on a first main surface and a plurality of second edge electrodes on a second main surface, wherein the wiring board is disposed in an upright state on the opposing surface, the plurality of convex electrodes include first convex electrodes and second convex electrodes, the first convex electrodes are bonded to the first edge electrodes, the second convex electrodes are bonded to the second edge electrodes, and the wiring board is held between the first convex electrodes and the second convex electrodes.

公开(公告)号：US09840185B2

公开(公告)日：2017-12-12

申请号：US15362703

申请日：2016-11-28

Applicant: UUSI, LLC

Inventor： David W. Shank

IPC: H01R12/62 ,  H05K1/02 ,  H05K1/16 ,  B60Q1/00 ,  H05K1/14 ,  H05B37/02 ,  H05B33/08 ,  H05K1/11

CPC classification number: B60Q1/0088 ,  H01R12/62 ,  H05B33/0803 ,  H05B33/0845 ,  H05B33/0854 ,  H05B33/086 ,  H05B37/0227 ,  H05K1/02 ,  H05K1/117 ,  H05K1/14 ,  H05K1/142 ,  H05K1/16 ,  H05K2201/04 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10356

Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.

公开(公告)号：US09754712B2

公开(公告)日：2017-09-05

申请号：US14963579

申请日：2015-12-09

Applicant: Radial Electronics, Inc.

Inventor： James E. Quilici

IPC: H01F5/00 ,  H01F17/00 ,  H01F17/06 ,  H01F41/02 ,  H01F41/04 ,  H05K1/16 ,  H01F41/064 ,  H05K1/02 ,  H05K3/04 ,  H05K3/46 ,  H01F27/02 ,  H01F27/28 ,  H05K3/00

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F27/027 ,  H01F41/02 ,  H01F41/0206 ,  H01F41/041 ,  H01F41/042 ,  H01F41/064 ,  H01F2027/2814 ,  H05K1/0284 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/045 ,  H05K3/4611 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/2036 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T156/10

Abstract: Disclosed are apparatus and methods for a magnetic component. In accordance with an embodiment, a magnetic component comprises a base substrate defining a winding cup having a shape of a closed groove surrounding a hub. The winding cup defines a core space operable to receive a core therein. A first conductive pattern is disposed on at least a portion of the base substrate including the winding cup. A second substrate defines a second conductive pattern. The second substrate is coupled to the first base surface with the first conductive pattern in operable alignment with the second conductive pattern. The first and second conductive patterns are coupled in electrical communication so as to define one or more winding-type electric circuits surrounding the core space so as to induce a magnetic flux within the core space when the one or more electric circuits are energized by a voltage source.

公开(公告)号：US20170199600A1

公开(公告)日：2017-07-13

申请号：US15508882

申请日：2016-02-01

Applicant: FUJIKURA LTD.

Inventor： Takeshi Shiojiri ,  Takaharu Hondo

IPC: G06F3/044 ,  H05K3/10 ,  H05K3/28 ,  H05K1/03

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0313 ,  H05K3/10 ,  H05K3/28 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2201/10151

Abstract: A wiring body includes a first conductor layer including a first conductor wire, a resin layer covering the first conductor layer, and a second conductor layer disposed on the first conductor layer through the resin layer and including a second conductor wire. The wiring body satisfies the formula |H1−H2|

公开(公告)号：US20170182723A1

公开(公告)日：2017-06-29

申请号：US15391745

申请日：2016-12-27

Applicant: Massachusetts Institute of Technology

Inventor： Samuel Eli Calisch ,  Neil A. Gershenfeld

IPC: B29D99/00 ,  B29C53/80 ,  B64C3/00 ,  B31D3/02 ,  H05K1/02 ,  B29C53/36 ,  B29D35/12

CPC classification number: B29D99/0089 ,  A43B1/0009 ,  B29C53/285 ,  B29C53/36 ,  B29C53/80 ,  B31D3/0207 ,  B64C3/20 ,  F21V1/18 ,  F21Y2109/00 ,  F21Y2115/10 ,  H05K1/028 ,  H05K2201/055 ,  H05K2201/09045

Abstract: A method of forming a structural honeycomb includes cutting and folding a substrate sheet according to predetermined cutting and folding patterns and fold angles that cause the sheet to form a honeycomb having cells that each have at least one face abutting, or nearly abutting, the face of another cell. The honeycomb is then stabilized by joining abutting, or nearly abutting, faces to hold the honeycomb together. The honeycomb may have a prespecified three-dimensional shape. The folding pattern may include corrugation, canted corrugation, or zig-zag folds. Joining may employ fixed and/or reversible joinery, including slotted cross section, tabbed strip, angled strip, integral skin, sewn, or laced. At least some folds may be partially-closed to create bends and twists in the honeycomb structure. Some surfaces of the honeycomb may be covered with a skin or face sheet. The substrate sheet may have flexible electronic traces.

公开(公告)号：US09609737B2

公开(公告)日：2017-03-28

申请号：US14516487

申请日：2014-10-16

Applicant: HYUNDAI MOTOR COMPANY ,  KIA MOTORS CORPORATION ,  YURA CORPORATION CO., LTD.

Inventor： Mun Jong Kim ,  Kwan Bum Lee ,  Jin Su Yeom

IPC: H05K1/11 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/06 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K1/0201 ,  H05K1/0206 ,  H05K1/09 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/067 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0338 ,  H05K2201/09045 ,  H05K2203/0278 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

Abstract: A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.

公开(公告)号：US20170079135A1

公开(公告)日：2017-03-16

申请号：US15123215

申请日：2014-05-28

Applicant: INTEL CORPORATION

Inventor： Chuan HU ,  Adel A. ELSHERBINI ,  Yoshihiro TOMITA ,  Shawna LIFF

IPC: H05K1/02 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H05K1/0283 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/1515 ,  H01L2924/181 ,  H05K1/036 ,  H05K1/185 ,  H05K3/1275 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09263 ,  H05K2201/10151 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure describe a wavy interconnect for bendable and stretchable devices and associated techniques and configurations. In one embodiment, an interconnect assembly includes a flexible substrate defining a plane and a wavy interconnect disposed on the flexible substrate and configured to route electrical signals of an integrated circuit (IC) device in a first direction that is coplanar with the plane, the wavy interconnect having a wavy profile from a second direction that is perpendicular to the first direction and coplanar with the plane. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了用于可弯曲和可拉伸装置的波浪互连以及相关技术和配置。 在一个实施例中，互连组件包括限定平面的柔性衬底和布置在柔性衬底上的波纹互连，并且被配置成沿与平面共面的第一方向布置集成电路（IC）器件的电信号，波形 互连件具有从垂直于第一方向并与该平面共面的第二方向的波状轮廓。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09519166B2

公开(公告)日：2016-12-13

申请号：US14469559

申请日：2014-08-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Heecheol Kim ,  Youngsuk Song ,  Seongyeol Yoo ,  Seungjin Choi

IPC: G02F1/1345 ,  G02F1/133 ,  H05K1/11 ,  H05K3/36

CPC classification number: G02F1/133 ,  G02F1/1303 ,  H05K1/119 ,  H05K3/361 ,  H05K2201/09045 ,  H05K2203/0278

Abstract: This disclosure provides a circuit substrate, a display panel and a display device for solving the problem of a relatively large electrode pitch of the circuit substrate in the prior art while reducing the production cost. Wherein the circuit substrate comprises a substrate, a plurality of first electrodes arranged on the substrate, and insulating convex structures arranged between the substrate and the first electrodes, the convex structure comprising a top face and a bottom face, wherein the top face contacts with the first electrode, and the bottom face contacts with the substrate.

Abstract translation: 本公开内容提供了一种用于在降低生产成本的同时解决现有技术中电路基板的较大电极间距的问题的电路基板，显示面板和显示装置。 其中，所述电路基板包括基板，布置在所述基板上的多个第一电极以及布置在所述基板和所述第一电极之间的绝缘凸起结构，所述凸起结构包括顶面和底面，其中所述顶面与 第一电极，并且底面与基板接触。

公开(公告)号：US09480172B2

公开(公告)日：2016-10-25

申请号：US14368623

申请日：2012-12-28

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Volodymyr Karpovych ,  Johannes Stahr

IPC: H05K1/18 ,  H05K3/36 ,  H05K3/46 ,  H05K3/40 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K3/4611 ,  H05K1/11 ,  H05K1/142 ,  H05K1/18 ,  H05K3/368 ,  H05K3/403 ,  H05K3/4694 ,  H05K2201/09045 ,  H05K2201/0919 ,  H05K2201/09572 ,  H05K2201/1059 ,  H05K2201/209 ,  Y10T29/49126

Abstract: A printed circuit board and a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. At least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface.

Abstract translation: 一种印刷电路板和由至少两个印刷电路板区域组成的印刷电路板的制造方法，其中印刷电路板区域各自包括至少一个导电层和/或至少一个导电部件，其中印刷电路板区域 在彼此连接的情况下，在每种情况下，至少一个彼此直接相邻的侧面的区域通过机械联接彼此连接。 导电层的至少一个子区域或连接端口和/或该部件的导电元件在侧表面处彼此导电耦合。