公开(公告)号：US20040219837A1

公开(公告)日：2004-11-04

申请号：US10426229

申请日：2003-04-30

Inventor： Andrew Michael Cherniski ,  Kirk Yates

IPC: H01R013/66

CPC classification number: H01R13/719 ,  H01R13/652 ,  H01R24/78 ,  H01R2103/00 ,  H01R2201/06 ,  H05K1/0231 ,  H05K1/181 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09809 ,  H05K2201/10189

Abstract: An electrical device having an enclosure in which noise is parasitically induced in a wire located in the interior of the enclosure is disclosed. The electrical device has an entry connector for mating the wire with an external connector at which a transmission line terminates for preventing the induced noise from being emitted from the device enclosure via the transmission line. The electrical device comprises a printed circuit board (PCB) adapted to be mounted adjacent to an opening in a wall of the enclosure, a receptacle, integral with the PCB, configured to mate with the external connector, a first conductive path coupling the transmission line with the wire when mated, and capacitors mounted on the printed circuit board radially disposed around the receptacle and adapted to be electrically coupled to the external connector when mated. The electrical device further comprises a second conductive path coupling the capacitors to a low potential sink.

Abstract translation: 公开了一种具有外壳的电气设备，其中噪声在位于外壳内部的导线中被寄生地感应。 电气设备具有用于将导线与外部连接器配合的入口连接器，在该连接器处传输线终止，用于防止感应噪声经由传输线从设备外壳发射。 电气设备包括适于安装在外壳壁上的开口附近的印刷电路板（PCB），与该PCB一体的插座，被配置为与外部连接器相配合，第一导电路径将传输线 并且电容器安装在放射状设置在插座周围的印刷电路板上，并且适合于在配合时电耦合到外部连接器。 电气设备还包括将电容器耦合到低电位宿的第二导电路径。

公开(公告)号：US06807065B2

公开(公告)日：2004-10-19

申请号：US10615378

申请日：2003-07-09

Applicant: Masahiro Sato

Inventor： Masahiro Sato

IPC: H05K702

CPC classification number: H05K1/0222 ,  H01P1/047 ,  H05K1/0237 ,  H05K1/0251 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A multilayer PCB has first and second signal transmission lines and first and second ground layers. A signal via is connected between the first and second transmission lines. Ground vias extending parallel to the signal via are connected between the first and second ground layers. The end of the first ground layer protrudes with respect to the second ground layer and extends nearer to the signal via than the second ground layer. Thus, it is possible to stabilize the characteristic impedance of the first transmission line.

Abstract translation: 多层PCB具有第一和第二信号传输线以及第一和第二接地层。 信号通孔连接在第一和第二传输线之间。 平行于信号通孔延伸的接地通孔连接在第一和第二接地层之间。 第一接地层的端部相对于第二接地层突出，并且比第二接地层更靠近信号通路延伸。 因此，可以稳定第一传输线的特性阻抗。

公开(公告)号：US06794961B2

公开(公告)日：2004-09-21

申请号：US10067917

申请日：2002-02-08

Applicant: Hideyuki Nagaishi ,  Hiroshi Kondoh

Inventor： Hideyuki Nagaishi ,  Hiroshi Kondoh

IPC: H01P100

CPC classification number: H05K1/0222 ,  G01S7/032 ,  G01S13/931 ,  G01S2007/028 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/047 ,  H01Q1/3233 ,  H01Q9/0407 ,  H01Q21/0087 ,  H01Q23/00 ,  H05K1/0221 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4629 ,  H05K2201/09618 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line connecting the RF circuit parts provided on both sides is constructed by a via group including a periodical structure or a via having a coaxial structure perpendicular to faces of the multilayer dielectric substrate. As the multilayer dielectric substrate, a hard multilayer substrate using metallic layers as a microstrip line wiring layer, a DC/IF signal line layer, and grounding metal layers for shielding which are disposed on and under the DC/IF signal line is employed. By using the transmission line achieved by a through via having the periodical structure or the through via having the coaxial structure, an electromagnetic wave propagating in parallel between the grounding conductors is confined.

Abstract translation: 一种用于汽车雷达等的高频电路模块，其中RF电路部分安装在硬质多层电介质基板的两侧，以及连接设置在两侧的RF电路部分的传输线由通孔 包括具有垂直于多层电介质基板的表面的同轴结构的周期性结构或通孔。 作为多层电介质基板，采用使用设置在DC / IF信号线上和下方的金属层作为微带线布线层的硬质多层基板，DC / IF信号线层和用于屏蔽的接地金属层。 通过使用具有周期性结构的贯通孔或具有同轴结构的通孔实现的传输线，限制了在接地导体之间并联传播的电磁波。

公开(公告)号：US20040094328A1

公开(公告)日：2004-05-20

申请号：US10659210

申请日：2003-09-09

Inventor： Joseph C. Fjelstad ,  Para K. Segaram ,  Thomas Obenhuber ,  William F. Wiedemann

IPC: H01R009/05

CPC classification number: H05K1/0219 ,  H01R9/0515 ,  H01R12/526 ,  H01R12/714 ,  H01R13/24 ,  H01R13/6592 ,  H05K1/14 ,  H05K1/141 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10356

Abstract: An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.

Abstract translation: 用于进行电子信号的组件。 组件包括基板和电子电缆。 衬底具有不同的第一和第二区域，以分别连接到第一和第二电路板。 分别在第一和第二区域的基板中形成第一和第二通孔。 电子电缆设置在第一通孔内并且延伸出第一通孔，邻近基板并进入第二通孔。

公开(公告)号：US20040072468A1

公开(公告)日：2004-04-15

申请号：US10627100

申请日：2003-07-24

Inventor： David T. Engquist ,  J. Steve Lyford ,  Devin Bingham

IPC: H01R012/24

CPC classification number: H05K3/3405 ,  H01R9/0515 ,  H01R12/598 ,  H01R12/7052 ,  H01R12/79 ,  H05K2201/09036 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2201/10356

Abstract: Method and apparatus for launching a coaxial cable onto a circuit board is described. In an example, a circuit board includes a front edge and a major surface. The major surface includes a recessed portion open to the front edge, the recessed portion being defined by a stop surface, opposing side surfaces, and a bottom surface. A plurality of conductive pads is disposed on the major surface. A conductive layer is disposed on at least a portion of the bottom surface. The recessed portion is adapted to receive a multiple conductor ribbon cable to provide thereby low-profile communication of the multiple conductor ribbon cable and the circuit board. The multiple conductor ribbon cable having a plurality of first conductors and a plurality of second conductors respectively associated with the plurality of first conductors. The plurality of conductive pads are adapted to receive respective first conductors of the multiple conductor ribbon cable. The conductive layer is adapted to receive respective second conductors of the multiple conductor ribbon cable.

Abstract translation: 描述了将同轴电缆发射到电路板上的方法和装置。 在一个示例中，电路板包括前边缘和主表面。 主表面包括一个向前边缘开口的凹入部分，该凹陷部分由止动表面，相对的侧表面和底面限定。 多个导电垫设置在主表面上。 导电层设置在底表面的至少一部分上。 凹部适于接收多导体带状电缆，从而提供多导体带状电缆和电路板的低调通信。 所述多导体带状电缆具有分别与所述多个第一导体分别相关联的多个第一导体和多个第二导体。 多个导电焊盘适于接收多导体带状电缆的相应的第一导体。 导电层适于接收多导体带状电缆的相应的第二导体。

公开(公告)号：US20040057220A1

公开(公告)日：2004-03-25

申请号：US10663797

申请日：2003-09-17

Applicant: NEC CORPORATION

Inventor： Naoya Tamaki ,  Norio Masuda ,  Toshihide Kuriyama ,  Masamoto Tago

IPC: H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10

CPC classification number: H05K1/0222 ,  H01L2223/6622 ,  H01P5/085 ,  H01R9/0515 ,  H05K1/113 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/403 ,  H05K2201/0919 ,  H05K2201/09618 ,  H05K2201/09809 ,  H05K2201/10356 ,  H05K2201/10446

Abstract: An electronic apparatus comprises a function module having a multilayer wiring unit including a first signal wiring corresponding to an internal layer wiring, a first signal via, a first reference potential wiring, a first signal pad to which the first signal wiring is connected through the first signal via, a first reference potential pad that surrounds the periphery of the first signal pad and to which the first reference potential wiring is connected, and a first reference potential via connected to the first reference potential pad; a multilayer circuit board including a second signal wiring corresponding to an internal layer wiring, a second signal via, a second reference potential wiring, a second signal pad to which one end of the second signal wiring is connected through the second signal via, a second reference potential pad that surrounds the periphery of the second signal pad and to which one end of the second reference potential wiring is connected, a second reference potential via connected to the second reference potential pad, a third signal pad to which the other end of the second signal wiring is connected, and a third reference potential pad to which the other end of the second reference potential wiring is connected; a first conductor that connects the first signal pad and the second signal pad; and a second conductor that connects the first reference potential pad and the second reference potential pad, wherein a central conductor of a coaxial cable is connected to the third signal pad, and an outer conductor of the coaxial cable is connected to the third reference potential pad.

Abstract translation: 电子设备包括具有多层布线单元的功能模块，多层布线单元包括对应于内层布线的第一信号布线，第一信号通孔，第一参考电位布线，第一信号布线通过第一信号布线连接到第一信号焊盘 信号通孔，围绕所述第一信号焊盘的周围并且所述第一参考电位布线连接到的第一参考电位焊盘和连接到所述第一参考电位焊盘的第一参考电位通孔; 多层电路板，包括对应于内层布线的第二信号布线，第二信号通孔，第二基准电位布线，通过第二信号通孔连接第二信号布线的一端的第二信号焊盘，第二信号通孔 围绕第二信号焊盘的周边并且连接到第二参考电位布线的一端的参考电位焊盘，连接到第二参考电位焊盘的第二参考电位通孔，第二信号焊盘的另一端 连接第二信号布线和第二参考电位布线的另一端连接的第三参考电位焊盘; 连接第一信号焊盘和第二信号焊盘的第一导体; 以及连接第一参考电位焊盘和第二参考电位焊盘的第二导体，其中同轴电缆的中心导体连接到第三信号焊盘，同轴电缆的外导体连接到第三参考电位焊盘 。

公开(公告)号：US20040040739A1

公开(公告)日：2004-03-04

申请号：US10234669

申请日：2002-09-03

Inventor： Eiji Yoshimura ,  Masao Okubo ,  Kazumasa Okubo

IPC: H05K001/03

CPC classification number: H05K1/0221 ,  H05K3/062 ,  H05K3/243 ,  H05K3/4644 ,  H05K2201/09809 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/0733

Abstract: A multilayer wiring board is manufactured wherein an intermediate wiring layer having a signal pattern is formed on an upper side of a lower shielding layer via an insulating layer, and an upper shielding layer is then formed on an upper side of the intermediate wiring layer via an insulating layer, by a method including forming the lower shielding layer having a lower shielding portion under a portion in which the signal pattern is to be formed, forming a lower metal wall erected from the lower shielding portion under both sides of the portion in which the signal pattern is to be formed, and forming the insulating layer for exposing the lower metal wall and covering the lower shielding layer.

Abstract translation: 制造多层布线板，其中具有信号图案的中间布线层经由绝缘层形成在下屏蔽层的上侧上，然后通过经由绝缘层在中间布线层的上侧形成上屏蔽层 绝缘层，通过包括在其下面形成下屏蔽部分的下屏蔽层形成下部屏蔽部分的方法形成下部金属壁，该下部金属壁从下部屏蔽部分的两侧竖立， 形成信号图案，并且形成用于暴露下金属壁并覆盖下屏蔽层的绝缘层。

公开(公告)号：US06674344B2

公开(公告)日：2004-01-06

申请号：US10101127

申请日：2002-03-19

Applicant: Reinhold Berberich

Inventor： Reinhold Berberich

IPC: H03H700

CPC classification number: H05K9/0018 ,  H01R13/2414 ,  H01R13/6581 ,  H01R13/7195 ,  H05K1/0231 ,  H05K1/162 ,  H05K3/3447 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/09672 ,  H05K2201/09809 ,  H05K2201/10189

Abstract: An electronic device includes a housing for accommodating a carrier substrate. An electronic module and a conductor structure for making electrical connection with the electronic module are fitted on the carrier substrate. A filter device for improving the electromagnetic sensitivity is arranged in the housing. The filter device is formed by an electrical and/or capacitive connection of a first conductor surface of the conductor structure to an external first potential and by an electrical and/or capacitive connection of a second conductor surface of the conductor structure to a second electrical potential, the first conductor surface and the second conductor surface being arranged approximately opposite one another.

Abstract translation: 电子设备包括用于容纳载体衬底的壳体。 用于与电子模块进行电连接的电子模块和导体结构安装在载体基板上。 用于提高电磁敏感度的过滤装置设置在壳体中。 滤波器装置由导体结构的第一导体表面的电和/或电容连接形成为外部第一电位，并且通过导体结构的第二导体表面的电和/或电容连接形成第二电位 第一导体表面和第二导体表面彼此大致相对布置。

公开(公告)号：US20030218515A1

公开(公告)日：2003-11-27

申请号：US10460264

申请日：2003-06-13

Applicant: NEC CORPORATION

Inventor： Naoya Tamaki ,  Norio Masuda

IPC: H01P005/02

CPC classification number: H01P5/085 ,  H01L2924/0002 ,  H01L2924/19107 ,  H05K1/0219 ,  H05K1/183 ,  H05K3/3405 ,  H05K3/341 ,  H05K3/3421 ,  H05K2201/09809 ,  H05K2201/09845 ,  H05K2201/10356 ,  H01L2924/00

Abstract: An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

公开(公告)号：US20030215619A1

公开(公告)日：2003-11-20

申请号：US10436143

申请日：2003-05-13

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazuhiko Ooi ,  Masaru Yamazaki ,  Yukiji Watanabe ,  Takaaki Yazawa

IPC: B32B015/04

CPC classification number: H05K3/44 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4641 ,  H05K2201/09518 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09718 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/09845 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A metal core substrate comprises a core layer (10) consisting of first and second metal plates (11, 12) layered with a third insulating layer (13) interposed therebetween; first and second insulating layers (20, 21) formed on the first and metal plates, respectively; first and second wiring patterns (45, 46) formed on the first and second insulating layers, respectively. A conductive layer (40) formed in a through-hole (22) penetrates the first insulating layer, the first metal plate, the third insulating layer, the second metal plate and the second insulating layer for electrically connecting the first wiring pattern with the second wiring pattern. The first metal plate (11) is electrically connected with the first wiring pattern (45) and the second wiring pattern (46), respectively, by means of a via (44) and by means a via (43). The second metal plate (12) is electrically connected with the second wiring pattern (46) and the first wiring pattern (45), respectively, by means of a via (42) and by means a via (41), respectively.

Abstract translation: 金属芯基板包括由第一和第二金属板（11,12）组成的芯层（10），第一和第二金属板与第三绝缘层（13）分开; 分别形成在第一和金属板上的第一和第二绝缘层（20,21）; 分别形成在第一和第二绝缘层上的第一和第二布线图案（45,46）。 形成在通孔（22）中的导电层（40）穿过第一绝缘层，第一金属板，第三绝缘层，第二金属板和第二绝缘层，用于将第一布线图案与第二绝缘层 接线图案。 第一金属板（11）通过通孔（44）和通孔（43）分别与第一布线图案（45）和第二布线图案（46）电连接。 第二金属板（12）分别通过通孔（42）和通孔（41）与第二布线图案（46）和第一布线图案（45）电连接。