公开(公告)号：US09894764B2

公开(公告)日：2018-02-13

申请号：US15096993

申请日：2016-04-12

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung-Uk Lee ,  Il-Jong Seo ,  Jae-Hoon Choi ,  Yong-Ho Baek

IPC: H05K1/11 ,  H05K3/06

CPC classification number: H05K1/115 ,  H05K3/067 ,  H05K3/4647 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0361 ,  H05K2201/09854 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/0384

Abstract: A printed circuit board and a method of manufacturing a printed circuit board are provided. The printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer, a solder resist layer disposed on one surface of the insulating layer, the solder resist layer having a cavity of a through-hole shape to expose a part of the circuit layer from the insulating layer, and a metal post embedded in the solder resist layer and exposed to outside via an opening of the solder resist layer, and the metal post includes a first post metal layer, a post barrier layer, and a second post metal layer disposed in that order.

公开(公告)号：US09844137B2

公开(公告)日：2017-12-12

申请号：US14850253

申请日：2015-09-10

Applicant: Advanced Powertrain Engineering, LLC

Inventor： Paul Fathauer

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  F16K31/02 ,  H05K1/18

CPC classification number: H05K1/115 ,  F16K31/02 ,  H05K1/119 ,  H05K1/18 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10818 ,  Y10T29/49002

Abstract: A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.

公开(公告)号：US09801275B2

公开(公告)日：2017-10-24

申请号：US14621998

申请日：2015-02-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Chung Sik Park ,  Jae Hwa Kim ,  Heun Gun Shin

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/113 ,  H05K1/0206 ,  H05K3/0044 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/09854 ,  Y10T29/49155

Abstract: A printed circuit board according to the embodiment includes an insulating layer; a first pad on a top surface of the insulating layer; a second pad on a bottom surface of the insulating layer; and a via formed in the insulating layer and having one surface connected to the first pad and an opposite surface connected to the second pad, wherein the via includes a plurality of via parts which are at least partially overlapped with each other.

公开(公告)号：US20170223819A1

公开(公告)日：2017-08-03

申请号：US15418692

申请日：2017-01-28

Applicant: AT&S (China) Co. Ltd.

Inventor： Sally Sun ,  Yee-Bing Ling ,  Nikolaus Bauer-Öppinger ,  Wilhelm Tamm

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00

CPC classification number: H05K1/0206 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/09563 ,  H05K2201/09854

Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure with a bore extending into the layer stack. The bore includes a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter. The component carrier further comprises a thermally conductive material filling substantially the entire bore. The bore is in particular formed by mechanical drilling.

公开(公告)号：US09668345B2

公开(公告)日：2017-05-30

申请号：US14389387

申请日：2013-03-27

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Hiroyuki Yamaguchi ,  Seiichi Kurihara ,  Hiroshi Sakurai ,  Shunsuke Nukina

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46 ,  H05K3/00

CPC classification number: H05K1/116 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0154 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09545 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2201/10287 ,  H05K2203/061 ,  H05K2203/1572

Abstract: A multilayer wiring board includes a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines and is arranged on a mounting surface side for mounting a surface mount type component, a wire wiring layer that is arranged on an opposite side of the mounting surface, and in which an insulation coating wire is wired, and a first interlayer conduction hole that has a conduction part which electrically connects the metal foil wiring line positioned on a surface of the first metal foil wiring layer to at least one of the metal foil wiring line in an inner layer of the first metal foil wiring layer and the insulation coating wire of the wire wiring layer. A hole diameter of the first interlayer conduction hole varies in a board thickness direction of the multilayer wiring board.

公开(公告)号：US20170094801A1

公开(公告)日：2017-03-30

申请号：US15170943

申请日：2016-06-02

Applicant: ETHERTRONICS, INC.

Inventor： Seung Hyuk CHOI ,  Hyun Jun HONG ,  Tae Wook KIM ,  Cheong Ho RYU ,  Young Sang KIM ,  Sung Jun KIM

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H05K3/18 ,  H05K3/28

CPC classification number: H05K3/0026 ,  H05K3/0014 ,  H05K3/185 ,  H05K3/188 ,  H05K3/28 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0582 ,  H05K2203/0588 ,  H05K2203/072 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present disclosure relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

公开(公告)号：US09565775B2

公开(公告)日：2017-02-07

申请号：US14469782

申请日：2014-08-27

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Noriyoshi Shimizu ,  Wataru Kaneda ,  Hiromu Arisaka ,  Akio Rokugawa

IPC: H05K1/11 ,  H05K3/42 ,  H05K1/00 ,  H05K1/18 ,  H05K7/10 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/421 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/115 ,  H05K1/116 ,  H05K3/38 ,  H05K3/4644 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/09381 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/0979 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/2072 ,  H05K2203/0789 ,  H01L2924/00

Abstract: A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole.

Abstract translation: 布线板包括涂覆第一布线层的第一绝缘层。 第一通孔在第一绝缘层的表面上开放，并露出第一布线层的表面。 布置在第一通孔中的第一通孔包括暴露于第一绝缘层的表面的端表面。 在第一通孔中的第一绝缘层和第一通孔之间形成间隙。 在第一绝缘层的表面和第一通孔的端面上堆叠第二布线层。 第二布线层包括填充间隙的垫。 该垫的平面形状大于第一通孔。

公开(公告)号：US09560769B2

公开(公告)日：2017-01-31

申请号：US14713063

申请日：2015-05-15

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka Shimabe ,  Ryuichiro Tominaga

IPC: H05K1/18 ,  H05K3/46 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/032 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/09045 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611

Abstract: A printed wiring board includes a substrate having first and second cavities, first electronic components accommodated in the first cavity, second electronic components accommodated in the second cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the first and second cavities. The substrate has a first projection structure partitioning the first components in the first cavity and a second projection structure partitioning the second components in the second cavity, and the first and second cavities and the first and second projection structures are formed in the substrate such that T1

Abstract translation: 印刷电路板包括具有第一和第二空腔的衬底，容纳在第一腔中的第一电子部件，容纳在第二腔中的第二电子部件和形成在衬底上并包括绝缘夹层的堆积层， 覆盖第一和第二腔。 衬底具有分隔第一腔中的第一部件的第一突起结构和分隔第二腔中的第二部件的第二突出结构，并且第一和第二腔以及第一和第二突出结构形成在衬底中，使得T1 满足

公开(公告)号：US09538636B1

公开(公告)日：2017-01-03

申请号：US13803081

申请日：2013-03-14

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： Christopher D. Weigand ,  Andrzej Rozbicki

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K1/03 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/181 ,  H01L23/13 ,  H01L23/14 ,  H01L23/49805 ,  H01L23/49822 ,  H05K1/0201 ,  H05K1/0251 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/14 ,  H05K1/141 ,  H05K1/18 ,  H05K3/0097 ,  H05K3/429 ,  H05K2201/041 ,  H05K2201/066 ,  H05K2201/09181 ,  H05K2201/09509 ,  H05K2201/09854 ,  H05K2201/10719

Abstract: An apparatus having a plurality of insulating layers, a plurality of conductive layers and a plating is disclosed. The conductive layers may be separated by the insulating layers. A first pattern in a first of the conductive layers generally extends to an edge castellation. A second pattern in a second of the conductive layers may also extends to the edge castellation. The plating may be disposed in the edge castellation and connect the first pattern to the second pattern. The plating in the castellation may extend at most between a subset of the conductive layers.

Abstract translation: 公开了一种具有多个绝缘层，多个导电层和电镀层的装置。 导电层可以被绝缘层分离。 第一导电层中的第一图案通常延伸到边缘星座。 在第二导电层中的第二图案也可以延伸到边缘星座。 电镀可以设置在边缘地毯中并且将第一图案连接到第二图案。 地板中的电镀最多可以在导电层的子集之间延伸。

公开(公告)号：US09526177B2

公开(公告)日：2016-12-20

申请号：US14061047

申请日：2013-10-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Eun Lee ,  Yul Kyo Chung ,  Yee Na Shin ,  Doo Hwan Lee

IPC: H05K1/16 ,  H05K1/18 ,  H01L23/00 ,  H05K3/46 ,  H01L21/56

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2924/12042 ,  H01L2924/3511 ,  H05K3/4602 ,  H05K2201/09854 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49139 ,  H01L2924/00

Abstract: Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers.

Abstract translation: 这里公开了包括嵌入其中的电子部件的印刷电路板及其制造方法。 包括嵌入其中的电子部件的印刷电路板包括：芯，其形成有由通孔形成的空腔，并且具有形成有基于其中心部分对称地形成有顶部和底部的倾斜表面的侧壁; 嵌入腔内的电子部件; 堆叠在包括电子部件的芯的上部和下部的绝缘层; 以及形成在绝缘层上的外部电路层。