公开(公告)号：USRE31114E

公开(公告)日：1982-12-28

申请号：US207515

申请日：1980-11-17

Applicant: William E. Berg

Inventor： William E. Berg

IPC: H01H1/24 ,  H05K1/02 ,  H05K3/32 ,  H05K7/10

CPC classification number: H05K3/325 ,  H01H1/24 ,  H05K7/1061 ,  H05K1/0237 ,  H05K2201/0314 ,  H05K2201/049 ,  H05K2201/10393 ,  H05K2201/10681 ,  H05K2201/10727

Abstract: This disclosure describes an electrical connector for joining microcircuit or microcircuit modules, such as leadless integrated or hybrid circuit carriers to utilization means, such as printed or etched circuit boards or similar means. The electrical contacts through which the microcircuit and utilization means are connected are formed and etched in place on an elastomeric material, precisely located; the material acting as a restoring force to maintain connection. The connector when used in a system maintains transmission line mediums in a single environment.

公开(公告)号：US4357061A

公开(公告)日：1982-11-02

申请号：US125812

申请日：1980-02-28

Applicant: John B. Crosby

Inventor： John B. Crosby

IPC: G02F1/13 ,  H01R12/71 ,  H05K3/32 ,  H01R13/54

CPC classification number: G02F1/133308 ,  H05K3/325 ,  G02F1/13452 ,  G02F2201/465 ,  H05K2201/0314 ,  H05K2201/10136 ,  H05K2201/10393 ,  H05K2201/10522 ,  H05K2201/10606 ,  H05K2201/10689 ,  H05K2201/10727

Abstract: An electro-mechanical package is disclosed which includes an LCD and an IC chip mounted on opposite sides of a PC board by common package-retaining means, which includes posts extending through the PC board and a clip member that latches onto the ends of the posts to retain the package in assembled position. The latching action is resilient and permits non-destructive disassembly.

Abstract translation: 公开了一种机电封装，其包括通过公共包装保持装置安装在PC板的相对侧上的LCD和IC芯片，其包括延伸穿过PC板的柱和夹在柱的端部上的夹子 以将包装保持在组装位置。 锁定动作是弹性的并允许非破坏性拆卸。

公开(公告)号：US4127321A

公开(公告)日：1978-11-28

申请号：US718830

申请日：1976-08-30

Applicant: Masaharu Koyama ,  Tadashi Ishibashi ,  Hironari Tanaka

Inventor： Masaharu Koyama ,  Tadashi Ishibashi ,  Hironari Tanaka

IPC: G09F9/00 ,  G02F1/1345 ,  G09F9/30 ,  H05K3/34 ,  G02F1/16 ,  H01L39/02 ,  H05K1/00

CPC classification number: H05K3/3442 ,  G02F1/1345 ,  H05K2201/09427 ,  H05K2201/10136 ,  H05K2201/10727 ,  H05K2201/10909 ,  H05K2203/0465 ,  Y02P70/613

Abstract: The display apparatus comprises a liquid crystal display element, a circuit board and electroconductive members interconnecting them. External terminals are formed on one substrate of the display element and input terminals are formed on the circuit board. The external terminals are electrically and mechanically interconnected by rigid electroconductive members through conductive films.

Abstract translation: 显示装置包括液晶显示元件，电路板和将它们互连的导电元件。 外部端子形成在显示元件的一个基板上，并且在电路板上形成输入端子。 外部端子通过导电膜通过刚性导电构件电气和机械地互连。

公开(公告)号：US3483308A

公开(公告)日：1969-12-09

申请号：US3483308D

申请日：1968-10-24

Applicant: TEXAS INSTRUMENTS INC

Inventor： WAKELY WILBUR T

IPC: H05K1/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/13 ,  H05K3/34 ,  H05K5/00 ,  H05K1/10

CPC classification number: H05K3/3442 ,  H01L23/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K2201/09045 ,  H05K2201/10568 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/49124 ,  H01L2924/00014 ,  H01L2924/00

Abstract: 1,263,126. Mounting semi-conductor devices. TEXAS INSTRUMENTS Inc. 19 Aug., 1969 [24 Oct., 1968], No. 41277/69. Headings H1K and H1R. For mounting, e.g. a miniaturized electronic circuit 22 on a printed circuit board 32 and making electrical connection between the circuit and board, insulating body 10 has pedestal members 18 extending downwardly from its lower surface, metallized zones 20 on its upper surface form leads for circuit 22 and conductive paths electrically connect leads 22 with metal films on the bottoms of the pedestal members. As shown, the sides of the pedestal members are metallized to form the conductive paths. Alternatively (Figs. 5 to 8, not shown) the conductive paths are formed by filling holes drilled through the pedestals with wire or molten metal. The pedestal members may have square or round cross-section and the bottoms may be rounded. The insulating body may be of plastics, glass or ceramic and the metallization may be applied by coating with Mo or Mn in a binder through a mask, firing and electroplating with layers of Ni, Ag and Au. A layer of Sn may be applied by hot dipping. The circuit 22 may be a single transistor or may contain active and passive components and may be encapsulated with epoxy resin after it has been connected to the metallized paths.

公开(公告)号：US3374533A

公开(公告)日：1968-03-26

申请号：US45893065

申请日：1965-05-26

Applicant: SPRAGUE ELECTRIC CO

Inventor： BURKS DARNALL P ,  FABRICIUS JOHN H

IPC: H01L21/60 ,  H01L23/498 ,  H01L25/07 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L24/80 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/10166 ,  H05K2201/10477 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T428/12549 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：US20190090355A1

公开(公告)日：2019-03-21

申请号：US16135552

申请日：2018-09-19

Applicant: Schlage Lock Company LLC

Inventor： Russell L. Steiner

IPC: H05K3/34 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K3/341 ,  H05K1/0201 ,  H05K1/0206 ,  H05K3/303 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2203/1178

Abstract: A surface-mounted integrated circuit (IC) package is disclosed that has unwanted flux removed from surface-mounted IC. A bottom termination component (BTC) includes lands and a thermal pad. The lands provide an electrical connection from the BTC and the thermal pad provides heat transfer from the BTC. The thermal pad includes vias that are configured to remove flux generated from solder applied to the surface-mounted IC as the surface-mounted IC is assembled. A printed circuit board (PCB) is mounted to the BTC and is electrically connected to the BTC via the lands and receives heat transfer from the BTC via the thermal pad and includes a reservoir. The reservoir is configured to pull flux positioned between the lands into the reservoir as the flux is generated from the solder applied to the surface-mounted IC as the BTC is mounted to the PCB and as the surface-mounted IC is assembled.

公开(公告)号：US09839128B2

公开(公告)日：2017-12-05

申请号：US15220771

申请日：2016-07-27

Applicant: International Business Machines Corporation

Inventor： Phillip D. Isaacs

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/18 ,  H05K3/42 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/0215 ,  H05K1/114 ,  H05K1/116 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/09572 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2203/0207 ,  H05K2203/176 ,  Y10T29/49144

Abstract: An apparatus includes a printed circuit board. The printed circuit board includes at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The printed circuit board includes a second dielectric layer on top of the at least one conductive layer. The printed circuit board includes a thermal pad on top of the second dielectric layer. The printed circuit board is fabricated by forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The printed circuit board is fabricated by backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

公开(公告)号：US09788424B2

公开(公告)日：2017-10-10

申请号：US14234903

申请日：2012-07-25

Applicant: Masatsugu Iiyama

Inventor： Masatsugu Iiyama

IPC: H05K1/11 ,  H05K3/34 ,  H01L23/13 ,  H01L23/498

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/49805 ,  H01L2224/48227 ,  H01L2224/49175 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring substrate comprises an insulating substrate and an external electrode on the insulating substrate. The insulating substrate comprises a lateral surface comprising a cutout. The cutout extends to a lower surface of the insulating substrate. The external electrode extends from an inner surface of the cutout to the lower surface of the insulating substrate. The insulating substrate comprises a protrusion at a lower end portion of the inner surface of the cutout. The protrusion protrudes from the inner surface of the cutout toward the lateral surface of the insulating substrate.

公开(公告)号：US09699907B2

公开(公告)日：2017-07-04

申请号：US14813359

申请日：2015-07-30

Applicant: SK hynix Inc.

Inventor： Jung Tae Jeong

IPC: H05K7/10 ,  H05K9/00 ,  H05K1/18 ,  H05K3/34 ,  H01L23/498

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K3/3436 ,  H05K2201/10287 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor package module may include a first substrate, and a second substrate disposed to face the first substrate. The semiconductor package module may include an interconnection member electrically connecting the first substrate to the second substrate and including a plurality of wires. Portions of the plurality of wires may be twisted and wound together and may be bent to extend in a predetermined direction.

公开(公告)号：US20160309575A1

公开(公告)日：2016-10-20

申请号：US15198110

申请日：2016-06-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hong MIN ,  Myung Sam KANG ,  Jung Han LEE ,  Young Gwan KO

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2518 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/181 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4608 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/10727

Abstract: A circuit board includes an insulating part including insulating layers, metal layers disposed on the insulating layers, vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure including a thermally conductive material, at least a part of the thermally conductive structure being inserted into the insulating part, a first via having one surface contacting the first thermally conductive structure, a first metal pattern contacting another surface of the first via, a first bonding member connected to the first metal pattern, and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part, the pads being at least in a first region and a second region having a higher temperature than the first region.

Abstract translation: 电路板包括绝缘部分，其包括绝缘层，设置在绝缘层上的金属层，每个穿过绝缘层中的至少一个绝缘层的通孔，并将金属层中的至少两个金属层连接在一起; 包括导热材料的第一导热结构，所述导热结构的至少一部分插入到所述绝缘部分中，具有与所述第一导热结构接触的一个表面的第一通孔，第一金属图案与所述第一导热结构的第一 通孔，连接到第一金属图案的第一接合构件以及在布置在绝缘部分的最外表面上的金属层的最外表面上连接有第一电子部件的焊盘，所述焊盘至少在第一区域中 以及具有比第一区域更高的温度的第二区域。