公开(公告)号：US20040155560A1

公开(公告)日：2004-08-12

申请号：US10735704

申请日：2003-12-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masato Koike ,  Katsumi Fujimoto

IPC: H02N002/00

CPC classification number: G01C19/5663 ,  H01L41/053 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/10083 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/2045 ,  Y02P70/613

Abstract: In a vibrator support structure, a vibrator is supported on a substrate through support pins, substrate connection portions of the support pins and pin connection portions of the substrate are joined through conductive adhesive which is made of a resin including conductive filler and has a pencil hardness of about 4H or less, and the conductive adhesive has a thickness which can buffer vibrations and impacts propagated through the support pins.

Abstract translation: 在振动器支撑结构中，振动器通过支撑销支撑在基板上，支撑销的基板连接部分和基板的引脚连接部分通过由包括导电填料的树脂制成并具有铅笔硬度的导电粘合剂 约4H或更小，并且导电粘合剂具有可以缓冲通过支撑销传播的振动和冲击的厚度。

公开(公告)号：US06396709B1

公开(公告)日：2002-05-28

申请号：US09528370

申请日：2000-03-17

Applicant: Franz Schmich

Inventor： Franz Schmich

IPC: H05K702

CPC classification number: H05K1/028 ,  H05K3/4691 ,  H05K2201/09063 ,  H05K2201/2045

Abstract: To increase the elasticity of an elastically deformable middle section of a printed-circuit board having at least two rigid circuit board sections provided with electric and/or electronic components and interconnected by the middle section, the middle section being provided with printed circuit traces extending from the first rigid section to the second rigid section, at least one opening is made in the elastically deformable middle section, the region of the middle section surrounding the opening forming at least two bars extending in a direction from the first rigid section to the second rigid section and laterally bordering the at least one opening, the printed circuit traces being arranged on the bars. When, in an electric/electronic device, the first rigid section of the printed-circuit board is fixedly joined to a component part supported in a vibration-damped manner, and the second rigid section is fixedly joined to the device housing, then vibrations are prevented from being transmitted from the printed-circuit board to the component part.

Abstract translation: 为了增加具有至少两个具有电和/或电子元件的刚性电路板部分并且由中间部分互连的印刷电路板的可弹性变形的中间部分的弹性，中间部分设置有从 第一刚性部分到第二刚性部分，至少一个开口形成在可弹性变形的中间部分中，围绕开口的中间部分的区域形成至少两个沿从第一刚性部分到第二刚性部分的方向延伸的杆 并且横向地邻接至少一个开口，印刷电路迹线布置在条上。 当在电气/电子设备中，印刷电路板的第一刚性部分固定地接合到以减振方式支撑的部件上，并且第二刚性部分固定地接合到装置壳体上，则振动是 防止从印刷电路板向组件部件传送。

公开(公告)号：US5945643A

公开(公告)日：1999-08-31

申请号：US491556

申请日：1995-06-16

Applicant: Donald J. Casser

Inventor： Donald J. Casser

IPC: B29C70/08 ,  B32B5/02 ,  F16F9/30 ,  H05K1/02 ,  H05K1/03 ,  E04B1/82

CPC classification number: H05K1/0271 ,  B29C70/086 ,  B32B5/02 ,  F16F9/306 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/2045

Abstract: A laminated damping material comprising a layer of high density and high modulus material as a core layer and two layers of higher modulus material being adhered to the core material, the core being sandwiched between the higher modulus layers. The damping material can be further augmented by adhering an additional layer of material exterior to the higher modulus materials if necessary and as needed for the specific application, be it cosmetic, environmental (if resistance to chemical is needed, for example), etc. The damping material can be used for preparing a reinforced composite material which comprises at least one basic multi-layer structure comprising higher modulus material/high modulus panel structure with the layers being bonded with adhesive compatible with both core and outer layer materials and the application where the panel section is used, such as chemical resistance, high heat resistance, etc. If an additional exterior layer is used, the bonding agent must be suitable for that material as well. The resultant structure exhibits extremely high rigidity and vibration damping properties, and may be used as a free standing isolation platform such as a table top, platform or base, for electrical devices, instruments, or any device, object or matter that is affected by external vibration. The materials may alternatively or additionally be used as structural members such as chassis within such devices, instruments, objects or matter, or may be alternatively or additionally utilized as substructures within such instruments, devices, objects or matter. The material may also be used in or in association with acoustical instruments or any other device that is subject to external vibration.

Abstract translation: 一种叠层阻尼材料，其包括作为芯层的高密度和高模量材料层，以及两层较高模量的材料粘附到芯材料上，芯体夹在较高模量层之间。 如果需要，并且根据具体应用的需要，无论是化妆品，环境（例如，如果需要耐化学药品）等，阻尼材料可以通过在较高模量材料的外部附着另外的材料层来进一步增强。 阻尼材料可用于制备增强复合材料，其包括至少一种包括较高模量材料/高模量面板结构的基本多层结构，其中所述层与与芯层和外层材料兼容的粘合剂粘合，并且其中 使用面板部分，例如耐化学性，高耐热性等。如果使用额外的外层，则粘合剂也必须适合于该材料。 所得结构具有非常高的刚性和抗振性能，并且可以用作电气设备，仪器或受外部影响的任何设备，物体或物质的独立式隔离平台，例如桌面，平台或底座 振动。 材料可以替代地或另外地用作结构构件，例如在这种装置，仪器，物体或物质内的底盘，或者可以替代地或另外地用作这些仪器，装置，物体或物质内的子结构。 该材料也可以与声学仪器或受外部振动的任何其他装置一起使用或结合使用。

公开(公告)号：US4902371A

公开(公告)日：1990-02-20

申请号：US283437

申请日：1988-12-12

Applicant: Gerald St. Andris ,  John P. Gauci

Inventor： Gerald St. Andris ,  John P. Gauci

IPC: B05B15/04 ,  B05C17/06 ,  B41F15/08 ,  B41F15/40 ,  H01L21/027 ,  H01L21/30 ,  H05K3/12 ,  H05K3/46

CPC classification number: B41F15/0813 ,  H05K3/1233 ,  B41P2215/14 ,  H05K2201/2045 ,  H05K2203/0264 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T156/1189

Abstract: An apparatus and a method is disclosed for providing a controlled separation of a structure that has been screened from the screening mask. A dampener pad floats with the mask as the screened structure is being separated from the mask. The mask is held in place by the dampener pad while the structure completely separates from the mask. The dampener pad assembly, then, in a controlled manner, brings the mask back to the original position, and the mask is then ready for the next screening operation.

公开(公告)号：US20190124771A1

公开(公告)日：2019-04-25

申请号：US15987360

申请日：2018-05-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil PARK ,  Gu Won JI ,  Se Hun PARK

IPC: H05K1/18 ,  H01G4/30 ,  H01G4/232 ,  H01G4/248 ,  H01G4/224

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G4/008 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/224 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H05K1/111 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/2045

Abstract: A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1≤G/CT≤0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.

公开(公告)号：US09887040B2

公开(公告)日：2018-02-06

申请号：US15222636

申请日：2016-07-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Hyun Ra ,  Yong Gyu Han

IPC: H01G4/38 ,  H01G4/232 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H01G4/005 ,  H01G4/30 ,  H05K3/34

CPC classification number: H01G4/385 ,  H01G2/065 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/111 ,  H05K1/181 ,  H05K3/341 ,  H05K3/3431 ,  H05K2201/10015 ,  H05K2201/2045

Abstract: A multilayer electronic component includes a first capacitor including a first capacitor body and first and second external electrodes disposed on outer surfaces of the first capacitor body; and a second capacitor including a second capacitor body and third and fourth external electrodes disposed on outer surfaces of the second capacitor body and electrically connected to the first capacitor. The first and third external electrodes are connected to each other by a first metal terminal enclosing portions of a lower surface of the first external electrode to an upper surface of the third external electrode, and the second and fourth external electrodes are connected to each other by a second metal terminal enclosing portions of a lower surface of the second external electrode and an upper surface of the fourth external electrode.

公开(公告)号：US09877381B2

公开(公告)日：2018-01-23

申请号：US15195685

申请日：2016-06-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soo Hwan Son

IPC: H01G4/30 ,  H05K1/18 ,  H05K1/02 ,  H01G2/06 ,  H01G2/10 ,  H01G4/38 ,  H01G9/00 ,  H01G9/042 ,  H01G15/00

CPC classification number: H05K1/0231 ,  H01G2/065 ,  H01G2/10 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H01G9/0029 ,  H01G9/042 ,  H01G9/28 ,  H01G15/00 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A composite electronic composite includes a plurality of multilayer ceramic capacitors each including a ceramic body in which dielectric layer and internal electrodes are alternately disposed and first and second external electrodes disposed on a lower surface of the ceramic body, a tantalum capacitor including a body part including a sintered tantalum powder material and a tantalum wire of which a portion is embedded in the body part and disposed on the plurality of multilayer ceramic capacitors, and a molding portion enclosing the tantalum capacitor and the plurality of multilayer ceramic capacitors.

公开(公告)号：US20170374743A1

公开(公告)日：2017-12-28

申请号：US15699570

申请日：2017-09-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Arata KISHI ,  Hironori MUNAKATA ,  Koji MOTOMURA ,  Hiroki MARUO

IPC: H05K1/18 ,  H01L23/00 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10156 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81052 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/81609 ,  H01L2224/81611 ,  H01L2224/81613 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/81815 ,  H01L2224/81935 ,  H01L2224/81951 ,  H01L2224/81986 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A mounting structure includes a bonding material (106) that bonds second electrodes (104) of a circuit board (105) and bumps (103) of a semiconductor package (101), the bonding material (106) being surrounded by a first reinforcing resin (107). Moreover, a portion between the outer periphery of the semiconductor package (101) and the circuit board (105) is covered with a second reinforcing resin (108). Even if the bonding material (106) is a solder material having a lower melting point than a conventional bonding material, high drop resistance is obtained.

公开(公告)号：US09801277B1

公开(公告)日：2017-10-24

申请号：US14455772

申请日：2014-08-08

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed ,  David Geiger ,  Murad Kurwa

IPC: H05K1/14 ,  H05K3/24 ,  H05K1/02 ,  H01R12/52 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K1/14 ,  H01R12/52 ,  H05K1/0271 ,  H05K3/0085 ,  H05K3/241 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/04 ,  H05K2201/068 ,  H05K2201/10734 ,  H05K2201/10946 ,  H05K2201/10984 ,  H05K2201/2045 ,  H05K2203/0338 ,  H05K2203/0723

Abstract: A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.

公开(公告)号：US09696349B2

公开(公告)日：2017-07-04

申请号：US14315743

申请日：2014-06-26

Applicant: General Electric Company

Inventor： Ruxi Wang ,  William Edward Burdick, Jr. ,  Satish Prabhakaran ,  Raymond John Nicholas

IPC: G01R15/20 ,  G01R15/18 ,  H05K1/02 ,  H01F27/28 ,  H05K1/16 ,  H05K3/28

CPC classification number: G01R15/181 ,  H01F27/2804 ,  H01F2027/2809 ,  H05K1/028 ,  H05K1/165 ,  H05K3/282 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/097 ,  H05K2201/10151 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/0221 ,  H05K2203/0228 ,  H05K2203/107

Abstract: A detecting unit is presented. The detecting unit includes a flexible circuit having a first side and a second side opposite the first side. The flexible circuit includes a plurality of cells defined therein, each of the plurality of cells having a first side and a second side respectively corresponding to the first side and the second side of the flexible circuit. Moreover, the flexible circuit includes a plurality of conductive windings disposed on at least one of the first and second sides of the plurality of cells. Further, the flexible circuit includes a stress reduction feature between each of the plurality of cells. Also, the detecting unit includes a sealing element configured to secure the flexible circuit in a stacked configuration. A sensing system and a method of making a detecting unit are also presented.